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Aniline formaldehyde resin LED dispersion coating and preparation method thereof

A technology of aniline formaldehyde resin and heat-dissipating coating, applied in coating and other directions, can solve the problems of poor temperature resistance and aging resistance, low substrate adhesion, poor heat dissipation effect, etc., and achieves excellent weather resistance and easy painting. , the effect of increasing heat dissipation

Inactive Publication Date: 2014-06-25
程实
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, heat conduction adhesive is used to solve the heat dissipation problem of LED lamps, but the materials used have poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect, and inconvenient construction. It is difficult to meet people's expectations for LED lamps. Cooling Requirements

Method used

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Effect test

Embodiment Construction

[0010] An aniline-formaldehyde resin LED heat-dissipating coating, made of the following raw materials in parts by weight (kg): aniline-formaldehyde resin 33, polyamide imidic acid prepolymer 23, 2-methyl methacrylate 7, tetraethylenepentamine 6 , aluminum nitride powder 16, graphene 1.5, carbon nanotube 1.5, titanium dioxide 3, barium sulfate 1.5, zinc oxide 2.5, ethylene glycol 14, silane coupling agent KH-550 2.5, phthalate 6, trioxide Chromium 1.5, ethyl acetate 23, p-xylene 9, film-forming aid 4.5.

[0011] The film-forming aid is prepared from the following raw materials in parts by weight (kg): methyl laurate 8, dicyclopentadiene 4, butenediolic anhydride 3, propylene glycol butyl ether 4, 1,6-hexanediol di Acrylate 4, isopropyl tris(dioctyl pyrophosphate acyloxy) titanate 1.5, carboxymethyl cellulose 3, nano-chitin 1.5, nano-cellulose 1.5, benzoic acid peroxide 0.3, diethylene glycol 12. The preparation method is: mix diethylene glycol, carboxymethyl cellulose, nano-c...

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Abstract

The invention discloses an aniline formaldehyde resin LED heat dispersion coating which is prepared from the following raw materials in parts by weight: 30-35 parts of aniline formaldehyde resin, 20-25 parts of polyamide imide prepolymer, 6-8 parts of methyl 2-methacrylate, 5-7 parts of tetraethylenepentamine, 15-18 parts of aluminum nitride powder, 1-2 parts of graphene, 1-2 parts of carbon nano tube, 2-4 parts of titanium dioxide, 1-2 parts of barium sulfate, 2-3 parts of zinc oxide, 12-15 parts of ethylene glycol, 2-3 parts of silane coupling agent KH-550, 5-7 parts of phthalate, 1-2 parts of chromium sesquioxide, 20-25 parts of ethyl acetate, 8-10 parts of p-xylene and 4-5 parts of film forming agent. The coating disclosed by the invention has excellent weather fastness, ultraviolet resistance, water resistance, oil resistance and alkali resistance; as aluminum nitride powder, graphene, carbon nano tube, titanium dioxide, barium sulfate and zinc oxide are added, the heat dispersion, the dispersibility and the ageing-resistant performance of the coating are improved and the coating can be used for a long period of time below 200 DEG C.

Description

technical field [0001] The invention belongs to the technical field of coatings, in particular to an aniline-formaldehyde resin LED heat dissipation coating and a preparation method thereof. Background technique [0002] With the rapid expansion of the use of LED lamps, prolonging the service life of LED lamps has become an urgent problem to be solved. With the increase of LED power, the heat dissipation problem has also been paid more and more attention. At present, heat conduction adhesive is used to solve the heat dissipation problem of LED lamps, but the materials used have poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect, and inconvenient construction. It is difficult to meet people's expectations for LED lamps. cooling requirements. Contents of the invention [0003] The object of the present invention is to provide a kind of aniline-formaldehyde resin LED heat-dissipating coating and preparation method th...

Claims

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Application Information

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IPC IPC(8): C09D4/02C09D4/06C09D7/12
Inventor 程实
Owner 程实
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