Double-component rapid low-temperature curing conductive adhesive

A conductive adhesive, two-component technology, used in conductive adhesives, adhesives, epoxy resins, etc., can solve the problem of high price, and achieve the effect of long storage period, high conductivity and good mechanical strength

Inactive Publication Date: 2017-05-31
南京鑫研新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high conductivity and good oxidation resistance of silver, the current research focuses on the preparation of silver conductive adhesive. Yang Xiaofeng published a two-component conductive adhesive prepared with polyamide as a curing agent in "China Adhesive" using silver powder as a filler. , its conductivity is good, but the price is high

Method used

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  • Double-component rapid low-temperature curing conductive adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Embodiment 1 (preparation of silver-plated copper powder for three times):

[0038] The superfine copper powder prepared by direct current arc plasma method is used as raw material, the surface oxide is removed by ultrasonic treatment with 5% dilute sulfuric acid, the acid on the surface is cleaned with deionized water, and then the copper powder is vacuum-dried. Add 20g of copper powder, 10.3g of sodium hypophosphite, and 1g of PVP into 500mL of deionized water to prepare a reducing solution containing copper substrate, add ammonia water to adjust its pH value to 11; add 17g of silver nitrate, 0.5g of EDTA-2Na Prepare the oxidation solution in 500mL deionized water; slowly add the oxidation solution to the reducing solution, raise the temperature to 50°C, react for 20 minutes, and separate the primary silver-plated copper powder with a centrifuge; repeat the above plating with the primary silver-plated copper powder as the base material Two steps of silvering are used ...

Embodiment 2

[0041] Weigh 200 parts of silver-plated copper powder prepared in Example 1, 100 parts of epoxy resin, 15 parts of toluene, and high-speed mechanical stirring for 10 minutes to prepare conductive adhesive component A;

[0042] Weigh 180 parts of silver-plated copper powder prepared in Example 1, 10 parts of 1,4-butanediol diglycidyl ether, 20 parts of dimethylaniline, 20 parts of triethanolamine, 5 parts of defoamer, and high-speed mechanical stirring After 10 minutes, the conductive adhesive component B was prepared.

[0043]Mix component A and component B for 10 minutes, and then apply conductive adhesive on the overlapping surface of two stainless steel metal sheets. The length of the metal sheet is 100mm, the width is 25mm, the thickness is 2mm, and the length of the overlapping surface is 12.5mm. Put it in a blast drying oven and heat it to 150°C for 30 minutes to get a conductor, and the measured resistivity is 5.8×10 -4 Ω·cm, the shear strength is 6Mpa.

Embodiment 3

[0045] Weigh 180 parts of silver-plated copper powder prepared in Example 1, 100 parts of epoxy resin, 10 parts of acetone, and high-speed mechanical stirring for 10 minutes to prepare conductive adhesive component A;

[0046] Weigh 200 parts of silver-plated copper powder prepared in Example 1, 10 parts of 1,4-butanediol diglycidyl ether, 20 parts of methyltetrahydrophthalic anhydride, 20 parts of triethanolamine, 5 parts of defoamer part, high-speed mechanical stirring for 10 minutes, and prepared the conductive adhesive component B.

[0047] After mixing component A and component B for 10 minutes, apply conductive glue on a glass slide to form a conductive layer with a thickness of 0.2 mm and a diameter of 25 mm. Put it in a blast drying oven and heat it to 150°C to cure for 30 minutes to obtain a conductor, and the measured resistivity is 3.5×10 -3 Ω·cm, the shear strength is 13Mpa.

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Abstract

The invention discloses a double-component rapid low-temperature curing conductive adhesive which comprises the following components in parts by mass: a conductive adhesive component A and a conductive adhesive component B, wherein the conductive adhesive component A comprises 180-200 parts of silver-plated copper powder, 100 parts of epoxy resin and 10-15 parts of a reactive diluent; the conductive adhesive component B comprises 180-200 parts of silver-plated copper powder, 10-15 parts of a reactive diluent, 20-30 parts of a curing agent, 10-20 parts of an accelerator and 5 parts of a leveling agent or a defoaming agent. As copper powder is plated with silver for three times innovatively, copper powder with a high-density silver layer can be prepared. The silver-plated copper powder can be applied to the conductive adhesive, then the double-component rapid low-temperature curing conductive adhesive can be prepared, and meanwhile a conductor prepared from the conductive adhesive applied to a substrate is high in conductivity and good in mechanical strength.

Description

technical field [0001] The invention relates to a preparation method of conductive adhesive, in particular to a two-component fast low-temperature curing conductive adhesive. The two-component low-temperature curing conductive adhesive prepared by the invention is suitable for the packaging of LED chips, the bonding of flexible capacitor electrodes, and the preparation of electromagnetic shielding coatings. Background technique [0002] Ultrafine copper powder has high electrical and thermal conductivity, and is generally used as electrical and thermal conductive materials. The prepared conductive paste is mostly used in sealing bags and connections. The miniaturization of microelectronic components is also inseparable from ultrafine copper powder. Adding copper, nickel, silver and other metals in the chemical fiber production process can synthesize conductive fibers, and then prepare fiber products with anti-electric radiation function. At the same time, new conductive or t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J163/00C09J11/06
CPCC08L2205/025C09J9/02C09J11/06C09J163/00C08L63/00C08K13/06C08K9/10C08K7/18C08K5/12C08K5/17
Inventor 张小敏沙炜惠钱佳锋刘鹏洪子威黄伟
Owner 南京鑫研新材料科技有限公司
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