Ultra-thin silver base thin film, multi-layer composite transparent electric conduction thin film and preparing method and application thereof
A transparent conductive film, multi-layer composite technology, applied in the coating, superimposed layer plating, metal material coating process and other directions, can solve the photoelectric performance island growth mode and aging effect, the oxygen doping concentration is difficult to accurately control, the preparation conditions of the conductive film are harsh and other problems, to achieve the effect of convenient application, good mechanical flexibility, and good mechanical flexibility
Active Publication Date: 2017-10-17
HEBEI UNIVERSITY
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The invention provides an ultra-thin silver base thin film, a multi-layer composite transparent electric conduction thin film and a preparing method and application thereof. The ultra-thin sliver base thin film is of a double-layer structure and comprises an Ag (O) layer and a continuous ultra-thin Ag layer which is located on and makes contact with the Ag (O) layer; the thickness of the Ag (O) layer is 0.5 nm-5 nm, and the thickness of the Ag layer is 2 nm-10 nm; and the oxygen doping concentration x is greater than or equal to 1% and less than or equal to 24% in the Ag (O) layer. The multi-layer composite transparent electric conduction thin film comprises a base and at least one Ag (O) / Ag double-layer which is located on the base. According to the ultra-thin silver base thin film and the multi-layer composite transparent electric conduction thin film based on the ultra-thin silver base thin film, excessive dependence of the thin film overall electric conduction on the oxygen doping concentration of the Ag (O) layer is weakened to a certain extent, the technical problems of difficult precise controlling over the oxygen doping concentration of the Ag (O) layer and the like are solved, the transparent electric conduction thin film with better mechanical flexibility and composite photoelectricity performance is obtained, preparing in a room temperature condition is achieved, cost is low, and the application prospects are broad.
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Property | Measurement | Unit |
Thickness | 0.5 ~ 5.0 | nm |
Thickness | 2.0 | nm |
Total thickness | 8.0 | nm |
tensile | MPa | |
Particle size | Pa | |
strength | 10 |
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