Low resistance thermosensitive ceramic material as well as preparation method and application thereof

A heat-sensitive ceramic and ceramic powder technology, applied in the field of electronic ceramic components, can solve the problems of low lift-to-resistance ratio and high resistivity, and achieve the effects of increasing temperature coefficient, reducing synthesis temperature and high temperature coefficient

Active Publication Date: 2019-05-17
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention solves the technical problems of high resistivity and low lift-to-drag ratio in the prior art

Method used

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  • Low resistance thermosensitive ceramic material as well as preparation method and application thereof
  • Low resistance thermosensitive ceramic material as well as preparation method and application thereof
  • Low resistance thermosensitive ceramic material as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0040] The preparation method of the thermosensitive ceramic material comprises the following steps:

[0041] (1) Mix bismuth oxide, alkali metal oxide or alkali metal carbonate, and titanium dioxide according to the molar ratio (0.98-1.02):(0.99-1.03):4, preferably according to the molar ratio of 1:1:4 and add an appropriate amount Organic monomers, using the polymerization of organic monomers to obtain a gel-like mixture after mixing, and calcining the gel-like mixture to obtain high-purity sodium bismuth titanate or potassium bismuth titanate ceramic powder; the organic monomer is propylene A mixture of amide and methylenebisacrylamide; wherein the mass ratio of acrylamide and methylenebisacrylamide is 20-28:1; the organic monomer undergoes a polymerization reaction under the action of a catalyst and an initiator; preferably , the catalyst is ammonium persulfate, and the initiator is tetramethylethylenediamine; the mixing method is preferably mixed by ball milling, and wate...

Embodiment 1

[0048] S1: 58.245g of bismuth oxide, 13.249g of sodium carbonate, 39.94g of titanium dioxide and organic monomers (21.395g of acrylamide, 0.873g of methylenebisacrylamide) were ball milled and mixed evenly. Using the polymerization of organic monomers, a uniform gel can be obtained after standing. Ammonium persulfate and tetramethylethylenediamine were used in the gelation process to speed up the gelation process. The gel was calcined at 820°C for 1 hour to obtain high-purity sodium bismuth titanate ceramic powder.

[0049] S2: Take 98.470g of barium carbonate, 0.244g of lanthanum oxide, 39.957g of titanium dioxide and 0.106g of sodium bismuth titanate and mix them uniformly by ball milling.

[0050] S3: The ceramic slurry is taken out from the ball mill jar, dried in an oven for 12 hours, and then taken out. After taking it out, grind the block into powder. Transfer the powder to a horse boiling furnace, raise the temperature to 1150°C at a rate of 300°C / hour and keep it w...

Embodiment 2-7

[0057] The preparation steps of this example are the same as those of Example 1, except that different amounts of barium carbonate, sodium bismuth titanate and donor doping are used in step S2. The amount of donor doping depends on the values ​​of x and y. For this group of examples, the amount of donor added per 1 mol of material is 0-0.3 mol%. The holding temperature in step S5 is 1125°C.

[0058] The main component of the thermosensitive ceramic material that present embodiment prepares is ((Bi 0.5 Na 0.5 ) x Ba 1-x )TiO 3 , the value of x and the electrical properties of the finished electronic components are shown in Table 1:

[0059] Table 1

[0060]

[0061] image 3 is the resistance-temperature curve of the barium titanate-based thermistor prepared in Example 3 of the present invention. Depend on image 3 It can be seen that the prepared heat-sensitive ceramic element has low room temperature resistance, obvious heat-sensitive effect, and excellent comprehe...

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Abstract

The invention discloses a low resistance thermosensitive ceramic material, a preparation method and application, and belongs to the technical field of electronic ceramic elements. The chemical formulaof amain component of the thermosensitive ceramic material is ((Bi0.5Q0.5)xBa<m-x>)TiO3, wherein Q is alkali metal Na or K, the value range of m is that m is larger than or equal to 1 and less than or equal to 1.007, and the value range of x is larger than or equal to 0.001 and less than or equal to 0.007. The preparation method comprises the steps that sodium bismuth titanate or potassium bismuth titanate ceramic powder is mixed with barium carbonate powder and titanium dioxide powder and then burned, andcurtain casting, lamination, preforming and slicing are sequentially perrformed to obtain a formed green body; the organics mixed in the casting process of the formed green body are decomposed at the temperature of 280 DEG C or above, the formed green body is burned in reduction atmosphere, so that a ceramic block is obtained; and the ceramic block is burned in oxygen-containing atmosphere. The slice barium titanate base thermosensitive ceramic prepared by adopting the method has theultralow room temperature specific resistance, high lift drag ratio and high temperature coefficient.

Description

technical field [0001] The invention belongs to the technical field of electronic ceramic components, and more specifically relates to a chip-type heat-sensitive ceramic material with low resistivity and high lift-to-drag ratio, its preparation method and application. Background technique [0002] Barium titanate-based positive temperature coefficient (PTC) ceramic thermistors are widely used in mobile communications, high-definition color TVs, local area networks, computers, automotive electronics and other fields. With the rapid development of electronic circuits and electrical appliances towards miniaturization, integration and multi-function, thermistors must also be miniaturized. At the same time, in order to meet the requirements of surface mount technology, thermistors should also be chipped like passive discrete components such as resistors, capacitors, and inductors, and require standard chip component dimensions. After years of exploration and technological progre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/468C04B35/622
Inventor 傅邱云严亮周东祥
Owner HUAZHONG UNIV OF SCI & TECH
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