Solvent-free polyurethane adhesive for photovoltaic back plate and preparation method and photovoltaic back plate of solvent-free polyurethane adhesive

Abstract

The invention discloses a solvent-free polyurethane adhesive for a photovoltaic back plate and a preparation method of the solvent-free polyurethane adhesive. According to the preparation method, a polyhydric alcohol and diisocyanate are taken as basic raw materials, together with aids such as a catalyst, an antioxidant, a light stabilizer, a leveling agent and a silane coupling agent, a double-component polyurethane adhesive is prepared, two components are mixed according to a ratio when being used, macromolecules are formed through mutual reactions, and thus the purpose of cross-linking curing is achieved. The double-component polyurethane adhesive produced by using the method disclosed by the invention has good properties such as adherence, xanthochromia resistance, hydrolysis resistance and weather resistance, and is capable of meeting processing and use requirements of industries. After 2000 hours of hydrothermal aging testing, the interlaminar strength is kept at 4.0N / cm or greater, and in addition, defects such as bubbling or adhesive overflowing can be avoided. In addition, as no solvent is used, VOCs (volatile organic compounds) can be reduced, the adhesive has large economic benefits when being compared with a solvent type adhesive in the market, and requirements of conventional environment protection policies and consumer markets on environment-friendly products canbe well met.

Description

technical field [0001] The invention belongs to the technical field of solar photovoltaic backplanes, and in particular relates to a solvent-free polyurethane adhesive for photovoltaic module backplanes, a preparation method thereof and a photovoltaic backplane. Background technique [0002] Solar power generation is a process that uses the principle of photoelectric conversion to convert the sun's radiation into electrical energy through semiconductor materials such as silicon elements. This photoelectric conversion process is usually called "photovoltaic effect". If semiconductor components such as silicon chips are directly exposed to the air, they will be subjected to high and low temperature and water vapor erosion, and their photoelectric conversion performance will be easily attenuated, losing their use value. Encapsulation is a key step in the production of solar cells. The encapsulation of solar cells is to bond the crystalline silicon wafer assembly, the upper prot...

AI Technical Summary

Problems solved by technology

However, carbodiimide has low molecular weight and low boiling point. Under long-term use and high temperature, it is easy to migrate outward from the adhesive, thus affecting the aging resistance and bond strength of the adhesive.

[0006] Currently, two-component solvent-based polyurethane glue is mostly used as the adhesive for backsheet lamination. Before use, the glue must be formulated according to the proportion. After being coated on the substrate (PET), it is dried in an oven and then mixed with various materials (PVDF, PE) ) compound, because it contains solvent, the smell of solvent will cause discomfort when used, and the solvent is flammable and explosive, and it is easy to cause fire and explosion hazards when used, and the use of solvents will cause environmental pollution, safety and health hazards

And the preparation process of this type of glue needs to go through the drying process, the equipment investment is large, and the operating cost is high, especially under the current situation of global warming, climate anomalies, and energy shortages, it does not meet the concept of sustainable development. Therefore, it is urgently needed A substitute colloid and preparation process

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