Photoresist resin monomer synthesized from spiro[2.5] decane-6, 8-diketone and synthesis method thereof

A technology of resin monomer and synthesis method, which is applied in the field of photoresist resin monomer and its synthesis, can solve the problem of low resolution of photolithographic patterns, achieve improved resolution, good etching resistance, and increase solubility Effect

Pending Publication Date: 2020-04-28
上海博栋化学科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, due to the specific structure of the acid-sensitive resin monomer in the

Method used

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  • Photoresist resin monomer synthesized from spiro[2.5] decane-6, 8-diketone and synthesis method thereof
  • Photoresist resin monomer synthesized from spiro[2.5] decane-6, 8-diketone and synthesis method thereof
  • Photoresist resin monomer synthesized from spiro[2.5] decane-6, 8-diketone and synthesis method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0032] This embodiment provides a photoresist resin monomer synthesized by spiro[2.5]decane-6,8-dione, the reaction scheme of the synthesis method of the photoresist resin monomer is as follows:

[0033]

[0034] It specifically includes the following steps:

[0035] S1, preparation of methyl Grignard reagent: first add 3.0g of magnesium chips (123mmol) to 15ml of anhydrous ether, and add an iodine tablet to obtain a reaction solution; then, dissolve 11.5g of methyl bromide (121mmol) in 25mL Prepare a methyl bromide ether solution in diethyl ether; then, under the protection of nitrogen, first add 6mL methyl bromide ether solution to the above reaction solution. After 5 minutes, the reaction solution boils slightly, and the color of iodine disappears. Under stirring, continue to Add the remaining methyl bromide ethyl ether solution dropwise, and add 20 mL of diethyl ether, raise the temperature to keep boiling slightly, and reflux for half an hour to obtain the methyl Grign...

Embodiment 2

[0039] This embodiment provides a photoresist resin monomer synthesized by spiro[2.5]decane-6,8-dione, the reaction scheme of the synthesis method of the photoresist resin monomer is as follows:

[0040]

[0041] It specifically includes the following steps:

[0042] S1. According to the steps S1-S2 of the above-mentioned Example 1, 9.5 g of the intermediate (Formula 2-2, 48 mmol) was obtained, and the yield was 79.6%.

[0043]S2. Dissolve 9.5g of the above intermediate in 120mL of anhydrous tetrahydrofuran, and add 20g of triethylamine (198mmol); then, cool to 0 degrees Celsius with ice water, and slowly add Methacryloyl chloride (10.1g, 97mmol) in anhydrous tetrahydrofuran (50mL) solution to obtain a reaction solution; after the reaction solution was raised to room temperature and continued to react for 5 hours, the reaction solution was concentrated under vacuum to remove the solvent, and 50mL of Ethyl acetate and 20mL saturated aqueous sodium bicarbonate solution, the ...

Embodiment 3

[0045] This embodiment provides a photoresist resin monomer synthesized by spiro[2.5]decane-6,8-dione, the reaction scheme of the synthesis method of the photoresist resin monomer is as follows:

[0046]

[0047] It specifically includes the following steps:

[0048] S1. Preparation of ethyl Grignard reagent: first add 3.0g of magnesium chips (123mmol) to 15ml of anhydrous ether, and add an iodine tablet to obtain a reaction solution; then, dissolve 13.2g of ethyl bromide (121mmol) in 25mL Prepare ethyl bromide ether solution in diethyl ether; then, under the protection of nitrogen, first add 6mL ethyl bromide ether solution to the above reaction solution. After 5 minutes, the reaction solution boils slightly, and the color of iodine disappears. Under stirring, continue to Add the remaining ethyl bromide ether solution dropwise, and add 20 mL of diethyl ether, raise the temperature to keep boiling slightly, and reflux for half an hour to obtain ethyl Grignard reagent.

[0...

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Abstract

The invention discloses a photoresist resin monomer synthesized from spiro[2.5] decane-6, 8-diketone and a synthesis method of the photoresist resin monomer, which belongs to the technical field of chemical synthesis and photoetching. The structural general formula of the photoresist resin monomer is shown as a formula I, in the formula I, R1 is hydrogen or methyl; R2 is saturated alkane or cycloalkane; the synthesis method of the spiro [2.5] decane-6, 8-diketone compound comprises the following steps: under the protection of inert gas, carrying out a Grignard reaction on spiro [2.5] decane-6,8-diketone and an alkyl Grignard reagent or a cycloalkyl Grignard reagent, adding water for quenching after the Grignard reaction is finished, and carrying out aftertreatment purification to obtain an intermediate; and carrying out an esterification reaction on the intermediate and acryloyl chloride or methacryloyl chloride, and after the esterification reaction is finished, carrying out after-treatment purification to obtain the photoresist resin monomer. The resin monomer provided by the invention is a degradable resin monomer, and the polymer resin containing the resin monomer has better etching resistance and can improve the resolution of photoresist photoetching patterns.

Description

technical field [0001] The invention relates to the technical fields of chemical synthesis and photolithography, in particular to a photoresist resin monomer synthesized from spiro[2.5]decane-6,8-dione and a synthesis method thereof. Background technique [0002] Photolithography technology refers to the chemical sensitivity of photoresist materials (especially photoresist) under the action of visible light, ultraviolet rays, electron beams, etc., through exposure, development, etching and other processes, the design on the mask plate Graphics microfabrication technology that transfers graphics to the substrate. [0003] Photolithography materials (especially photoresist), also known as photoresist, are the most critical functional chemical materials involved in photolithography technology. The main components are resin, photoacid generator, and corresponding additives and solvents. , This type of material is chemically sensitive to light (including visible light, ultraviol...

Claims

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Application Information

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IPC IPC(8): C07C69/533C07C67/08C08F222/14G03F7/004
CPCC07C69/533C08F222/1006G03F7/004C07C2602/50C07C2601/14
Inventor 毕景峰李嫚嫚喻珍林郭颖
Owner 上海博栋化学科技有限公司
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