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Preparation method for copper and copper alloy surface corrosion-resistant nano-film

A nano-film and copper alloy technology, applied in the direction of nano-technology, electrolytic organic material coating, etc., can solve the problem of not being able to completely isolate the penetration of water molecules, and achieve the effect of not easy to oxidize and decompose, controllable conditions, and environment-friendly

Inactive Publication Date: 2018-08-14
BAOJI UNIV OF ARTS & SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, using electrodeposition technology alone to prepare a polymer film on a metal surface, although it can isolate ions to a certain extent, it cannot completely isolate the penetration of water molecules, oxygen, and solution ions.

Method used

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  • Preparation method for copper and copper alloy surface corrosion-resistant nano-film
  • Preparation method for copper and copper alloy surface corrosion-resistant nano-film
  • Preparation method for copper and copper alloy surface corrosion-resistant nano-film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Example 1: Preparation of copper-based surface corrosion-resistant nanofilm

[0033] Material preparation: pure copper (Shanghai Hongxin Metal Materials Co., Ltd., the purity is greater than 99.95%), copper sheets with a specification of 50mm×20mm×0.3mm, and the copper sheets are sequentially sprayed with 2.5μm, 1.5μm and 0.5μm diamond polishing agent Polished and polished to a mirror surface, then immersed in acetone for ultrasonic cleaning for 15 minutes to degrease and remove other organic contaminants, rinsed with deionized water and absolute ethanol in sequence, and then blown dry with nitrogen.

[0034] 6-N,N-Diallylamine-1,3,5-triazine-2,4-thiol monosalt (DAN)

[0035] Specific preparation process:

[0036] (1) Electrodeposition coating: the test temperature is room temperature, and the plating solution is composed of 6-N,N-diallylamine-1,3,5-triazine-2,4-thiol monosalt (DAN) and Sodium carbonate was used as the supporting electrolyte mixed solution, in which t...

Embodiment 2

[0040] The sample prepared in Example 1 was immersed in a corrosive medium to detect its relevant properties, and the electrochemical parameter measurements were all carried out on Wuhan Koster CS310 electrochemical workstation. The experiment used a standard three-electrode electrolytic cell, including working electrodes (copper ), the counter electrode (graphite electrode, the specification is 50mm×30mm×3mm) and the reference electrode (saturated calomel electrode SCE). The reference electrode was connected to the electrolytic cell with a Lukin capillary salt bridge, all measured potentials were relative to that of a saturated calomel electrode (SCE), and the corrosion medium was a 3.5 wt% NaCl solution (simulated seawater).

[0041] Before the test, wrap the sample with polyimide tape so that the exposed area is 1cm 2 The working electrode is firstly soaked in the corrosive medium for about 0.5h, and then the open circuit potential (OCP) change of the system is measured. Wh...

Embodiment 3

[0053] On the basis of Example 2, in order to further explore the anti-corrosion effect of electrodeposited film combined with adsorption on copper, the electrochemical impedance spectra of copper samples modified by different methods in 3.5% NaCl solution were measured. The results are as follows figure 2 As shown in the figure, the electrochemical impedance Nyquist spectra of pure copper samples in sodium chloride solution, electrodeposition coating, DAN adsorption and electrodeposition coating combined with DAN adsorption treatment in sodium chloride solution, respectively, are shown in the figure. Bode and phase angle maps, Z' and Z" in the figure are the real and imaginary parts of the copper electrode surface impedance value, respectively, and |Z| is the total impedance.

[0054] from figure 2 As can be seen in a, all curves present an irregular compressed semicircular capacitive reactance arc at the high frequency end. The compression deformation of the high frequency...

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Abstract

The invention discloses a preparation method for a copper and copper alloy surface corrosion-resistant nano-film. The method comprises the steps that (1) an electro-deposition film coating method is adopted for deposition of 6-N,N-diallylamine-1,3,5-triazine-2,4-mercaptan single salt nanometer polymerization film on the copper or copper alloy matrix surface; (2) a copper or copper alloy matrix obtained after electro-deposition film coating treatment is placed into a 6-N,N-diallylamine-1,3,5-triazine-2,4-mercaptan single salt solution to be subject to self-assembly treatment, and the copper orcopper alloy matrix surface corrosion-resistant nano-film is obtained. The method is simple, practical and controllable in condition, and the corrosion-resistant nano-film obtained through preparationis compact, stable and better in hydrophobicity; in addition, when metal copper with the surface provided with the nano-film in an attached manner is in a 3.5wt%NaCl solution, the corrosion inhibition efficiency is as high as 98.08%; and in the preparation process, release of hazardous substance is avoided, and the obtained nano-film is safe, non-toxic, stable in nature, not prone to achieving oxygenolysis and environment-friendly.

Description

technical field [0001] The invention belongs to the field of new materials, and in particular relates to a method for preparing a corrosion-resistant nano-film by using s-triazine dithiols as raw materials. Background technique [0002] Copper and its alloys are widely used in electrical industry, electronic industry, transportation industry and modern marine industry due to its excellent properties (good electrical and thermal conductivity, strong mechanical properties and corrosion resistance, beautiful color, etc.). Since copper is easily corroded in seawater, a natural strong corrosive medium, it is very important to delay the corrosion of copper in seawater and improve the corrosion resistance of copper. Studies have shown that in the presence of Cl - in an aerobic medium, Cl - Content and oxygen concentration are the main factors affecting the corrosion rate of copper, Cl - The increase of the content will increase the activity of the corrosive medium, and the high ...

Claims

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Application Information

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IPC IPC(8): C25D9/02C25D5/48B82Y40/00
CPCC25D9/02B82Y40/00C25D5/48
Inventor 赵倩
Owner BAOJI UNIV OF ARTS & SCI