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Method for improving surface binding force of aluminum plating layer and magnesium alloy

A technology of magnesium alloy and binding force, which is applied in the direction of coating, liquid chemical plating, metal material coating process, etc., can solve the problems of haloalkanes that are easy to pollute the environment, high temperature, and narrow application range, so as to improve the binding force and durability corrosion resistance, enhanced densification, and low-cost effects

Pending Publication Date: 2018-10-30
HARBIN ENG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, when aluminum is directly deposited in room temperature ionic liquids, rough or loose aluminum coatings are mostly obtained, and the bonding force between the obtained aluminum coatings and magnesium alloys is not good.
At present, there are many public reports about aluminum plating in ionic liquids. In the patent document CN102839403A, the ionic liquid of urea, halogen salt and amide is used for aluminum plating. The temperature is higher and the operation is more complicated, so the application range is narrower
In the patent document with the publication number CN104294327A, dichloromethane and trichloromethane and other halogenated alkanes are added to the plating solution to obtain a fine-grained and flat aluminum coating. However, because such halogenated alkanes are easy to pollute the environment, they cannot be used in industrial production.
Therefore, although there are many ways to improve the bonding force of aluminum coatings, due to the limitations of some applications, improvements and innovations are still needed.

Method used

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  • Method for improving surface binding force of aluminum plating layer and magnesium alloy
  • Method for improving surface binding force of aluminum plating layer and magnesium alloy
  • Method for improving surface binding force of aluminum plating layer and magnesium alloy

Examples

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Effect test

Embodiment 1

[0036] The magnesium alloy electrode is mechanically ground, ultrasonically cleaned, alkali washed to remove oil, pickled to activate, and zinc dipped; mechanically ground is polished with 800, 1200 mesh silicon carbide sandpaper; the oil removal solution is sodium carbonate 40g / L, hydroxide The mixed solution of sodium 50g / L and sodium phosphate 10g / L, the treatment temperature is 70°C, and the treatment time is controlled at 5min; the activation solution is 10% phosphoric acid, the activation temperature is room temperature, and the activation time is controlled at 10s; the zinc immersion solution contains zinc sulfate 36g / L, potassium pyrophosphate 140g / L, sodium fluoride 6g / L, sodium carbonate 6g / L, potassium sodium tartrate 3g / L, zinc dipping temperature is controlled at 70°C, zinc dipping time is controlled at 5min, and then deionized The water rinses the magnesium alloy clean.

[0037] Electroplating solution configuration: Mix the ionic liquid 1-butyl-3-methylimidazoli...

Embodiment 2

[0041] The magnesium alloy electrode is mechanically ground, ultrasonically cleaned, alkali washed to remove oil, pickled to activate, and zinc dipped; mechanically ground is polished with 800, 1200 mesh silicon carbide sandpaper; the oil removal solution is sodium carbonate 40g / L, hydroxide The mixed solution of sodium 50g / L and sodium phosphate 10g / L, the treatment temperature is 70°C, and the treatment time is controlled at 5min; the activation solution is 10% phosphoric acid, the activation temperature is room temperature, and the activation time is controlled at 10s; the zinc immersion solution contains zinc sulfate 36g / L, potassium pyrophosphate 140g / L, sodium fluoride 6g / L, sodium carbonate 6g / L, potassium sodium tartrate 3g / L, zinc dipping temperature is controlled at 70°C, zinc dipping time is controlled at 5min, and then deionized The water rinses the magnesium alloy clean.

[0042] Electroplating solution configuration: Mix the ionic liquid 1-butyl-3-methylimidazoli...

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Abstract

The invention provides a method for improving surface binding force of an aluminum plating layer and a magnesium alloy. The magnesium alloy is adopted as a cathode, a pure aluminum sheet is adopted asan anode, and an electrochemical workstation or a dual pulsed power supply is adopted for carrying out electroplating in ion liquid electroplating liquid; and the ion liquid electroplating liquid isobtained by the following method which comprises the steps that 1-butyl-3-methylimidazole chlorine salt ion liquid and anhydrous aluminum chloride are mixed according to the molar ratio being 1:1.5-1:3 and are stirred to be completely dissolved, and an additive is added according to the mass ratio being 0.5-1 g / L. According to the method, the binding force and corrosion resistance of the aluminumplating layer are improved, and the high-purity and compact aluminum plating layer can be obtained.

Description

technical field [0001] The invention relates to a method for surface modification of a magnesium alloy surface, in particular to a method for aluminum plating a magnesium alloy in an ionic liquid at room temperature. Background technique [0002] Magnesium alloy has the characteristics of low density, high specific strength, strong shock absorption performance, good shielding performance, easy processing, easy recycling, low price, etc., and can be widely used in automobiles, motorcycles, airplanes, mobile phones, computers, hardware and electrical machinery, etc. Industrial products, but magnesium alloys have high chemical activity and poor corrosion resistance. In order to solve this problem, the main technologies currently used include electroplating, chemical plating, anodic oxidation, chemical conversion coating, physical vapor deposition, surface organic coating, laser surface treatment, etc. Among them, the electroplating method has the characteristics of simple opera...

Claims

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Application Information

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IPC IPC(8): C25D3/44C25D5/42C23C18/52
CPCC23C18/52C25D3/44C25D5/42
Inventor 张萌陈俐蔓贺严东王桂香曹萌王艳力
Owner HARBIN ENG UNIV
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