Modified epoxy resin composition, high-Tg low-loss laminated copper-clad plate and preparation method of high-Tg low-loss laminated copper-clad plate

A technology of epoxy resin and high-bromine epoxy resin, applied in chemical instruments and methods, other household appliances, electronic equipment, etc., can solve the problems of low product reliability, uneven performance, poor stability, etc., and achieve practicality Strong, excellent performance, good creative effect
CN112063111APending Publication Date: 2020-12-11GUANGDE LONGTAI ELECTRONICS SCI TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GUANGDE LONGTAI ELECTRONICS SCI TECH
Publication Date
2020-12-11

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Abstract

The invention relates to a modified epoxy resin composition, a high-Tg low-loss laminated copper-clad plate and a preparation method of the high-Tg low-loss laminated copper-clad plate. The composition is prepared from styrene-maleic anhydride, an organic solvent, inorganic filler, modified epoxy resin, a catalyst, a curing agent and a curing accelerator; an epoxy resin composition glue solution is prepared firstly, then copper foil is coated with the glue solution, and the copper foil is dried to be semi-cured,and heating, hot-pressing and laminating are carried out to obtain the TG low-losslaminated copper-clad plate. the high-TG low-loss laminated copper-clad plate is developed by adopting a method of acid anhydride and modified epoxy resin, Tg can reach 180 DEG C or above, Td can reach 370 DEG C or above (TGA 5% loss), low Dk (3.64@10GHz) and low Df (0.0065 @ 10GHz), and the high-TG low-loss laminated copper-clad plate is excellent in performance, high in practicability and suitable for radar application, and is also suitable for 3S (server / storage / switch) application, and has wide market value and application prospect.
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Description

technical field

[0001] The invention relates to the technical field of copper clad laminate production, in particular to a modified epoxy resin composition, a high Tg low loss laminated copper clad laminate and a preparation method thereof. Background technique

[0002] With the rapid development of electronic products in the direction of light, thin, small, high-density, multi-functional, and microelectronic integration technology, the volume of electronic components and logic circuits has been reduced exponentially, while the operating frequency has increased sharply and power consumption has continued to increase. Large, causing the working environment of components to change to high temperature. The heat dissipation requirements of the PCB substrate are becoming more and more urgent. If the heat dissipation of the substrate is not good, it will cause overheating of the components on the printed circuit board, thereby reducing the reliability of the whole machine. How to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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