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Modified epoxy resin composition, high-Tg low-loss laminated copper-clad plate and preparation method of high-Tg low-loss laminated copper-clad plate

A technology of epoxy resin and high-bromine epoxy resin, applied in chemical instruments and methods, other household appliances, electronic equipment, etc., can solve the problems of low product reliability, uneven performance, poor stability, etc., and achieve practicality Strong, excellent performance, good creative effect

Pending Publication Date: 2020-12-11
GUANGDE LONGTAI ELECTRONICS SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to various constraints, my country's metal-based copper-clad laminate industry is still at a relatively backward level in terms of software and hardware. The products produced have low reliability, poor stability, and uneven performance, especially thermal conductivity, insulation, and bending resistance. There are still many deficiencies in the foldability and the uniformity of the thickness of the insulating layer.

Method used

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  • Modified epoxy resin composition, high-Tg low-loss laminated copper-clad plate and preparation method of high-Tg low-loss laminated copper-clad plate
  • Modified epoxy resin composition, high-Tg low-loss laminated copper-clad plate and preparation method of high-Tg low-loss laminated copper-clad plate
  • Modified epoxy resin composition, high-Tg low-loss laminated copper-clad plate and preparation method of high-Tg low-loss laminated copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Turn on the ice water circulation system of the glue mixing tank, and set the ice water temperature to 10°C. Add 60 parts (parts by weight, the same below) of a mixture of styrene-maleic anhydride and 80 parts of DMF, butanone, and propylene glycol methyl ether, and stir for 180 minutes until styrene-maleic anhydride is completely dissolved; then add 100 parts of styrene-maleic anhydride to the mixture A mixture of boron nitride, silicon nitride, silicon carbide, diamond or silicon nitride, turn on the homogenizer and the shearing machine to stir for 100 minutes, and pass through the magnetic filter barrel to absorb the impurities in the filler; Add 150 parts of graphene modified high brominated epoxy resin, cyanate modified epoxy resin, graphene modified bisphenol S type epoxy resin mixture, 25 parts of cobalt acetylacetonate, butyl triphenyl A mixture of phosphorus bromide, 50 parts of aliphatic polyamines, diacetone acrylamide, a mixture of alicyclic polyamines, 5 pa...

Embodiment 2

[0045] Turn on the ice water circulation system of the glue mixing tank, and set the ice water temperature to 5°C. Add 40 parts (parts by weight, the same below) styrene-maleic anhydride and 60 parts of acetone, methyl butanone, methyl isobutyl ketone, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono The mixture of butyl ether was stirred for 240min until the styrene-maleic anhydride was completely dissolved; The mixture of chemical kaolin, turn on the homogenizer and the shearing machine to circulate and stir for 120min, and pass through the magnetic filter barrel to absorb the impurities in the filler; add 150 parts of dimer acid modified epoxy resin, carboxyl-terminated epoxy resin to the obtained mixture Nitrile rubber modified epoxy resin, carboxyl-terminated nitrile rubber modified novolac epoxy resin, polyurethane modified bisphenol A epoxy resin, thermoplastic polyurethane modified epoxy resin or terpene modified epoxy resin Mixt...

Embodiment 3

[0047] Turn on the ice water circulation system of the glue mixing tank, and set the temperature of the ice water to 3°C. Add 30 parts (parts by weight, the same below) of styrene-maleic anhydride and 50 parts of ethanol, isopropanol, ether, propylene oxide, cyclohexane, cyclohexanone or tolyl cyclohexanone, and stir for 150min to Styrene-maleic anhydride is completely dissolved; then add 200 parts of a mixture of spherical silica (particle size 2 microns), fused silica (1.6 microns), and German BASF highly micronized kaolin to the mixture to start homogenization Machine and shear force machine circulated and stirred for 100min, and passed the high magnetic filter barrel to absorb impurities in the filler; in the mixture obtained, add 150 parts of glue-modified novolac epoxy resin, polyurethane modified bisphenol A epoxy resin, Thermoplastic polyurethane modified epoxy resin or mixture of terpene modified epoxy resin, 25 parts of cobalt acetylacetonate, mixture of butyl triphe...

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Abstract

The invention relates to a modified epoxy resin composition, a high-Tg low-loss laminated copper-clad plate and a preparation method of the high-Tg low-loss laminated copper-clad plate. The composition is prepared from styrene-maleic anhydride, an organic solvent, inorganic filler, modified epoxy resin, a catalyst, a curing agent and a curing accelerator; an epoxy resin composition glue solution is prepared firstly, then copper foil is coated with the glue solution, and the copper foil is dried to be semi-cured,and heating, hot-pressing and laminating are carried out to obtain the TG low-losslaminated copper-clad plate. the high-TG low-loss laminated copper-clad plate is developed by adopting a method of acid anhydride and modified epoxy resin, Tg can reach 180 DEG C or above, Td can reach 370 DEG C or above (TGA 5% loss), low Dk (3.64@10GHz) and low Df (0.0065 @ 10GHz), and the high-TG low-loss laminated copper-clad plate is excellent in performance, high in practicability and suitable for radar application, and is also suitable for 3S (server / storage / switch) application, and has wide market value and application prospect.

Description

technical field [0001] The invention relates to the technical field of copper clad laminate production, in particular to a modified epoxy resin composition, a high Tg low loss laminated copper clad laminate and a preparation method thereof. Background technique [0002] With the rapid development of electronic products in the direction of light, thin, small, high-density, multi-functional, and microelectronic integration technology, the volume of electronic components and logic circuits has been reduced exponentially, while the operating frequency has increased sharply and power consumption has continued to increase. Large, causing the working environment of components to change to high temperature. The heat dissipation requirements of the PCB substrate are becoming more and more urgent. If the heat dissipation of the substrate is not good, it will cause overheating of the components on the printed circuit board, thereby reducing the reliability of the whole machine. How to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L63/04C08L35/00C08K13/02C08K3/04C08K3/38C08K3/34C08K7/18C08K3/36B32B7/12B32B15/01B32B15/20B32B33/00
CPCC08L63/00C08L63/04B32B15/20B32B15/01B32B7/12B32B33/00B32B2457/08C08L2205/035C08L2205/025C08K2201/014C08K2003/385C08K2201/005C08L35/00C08K13/02C08K3/042C08K3/38C08K3/34C08K3/04C08K13/04C08K7/18C08K3/36C08K3/346
Inventor 陈伟福李亚涛
Owner GUANGDE LONGTAI ELECTRONICS SCI TECH
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