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Single-component UV delayed-curing adhesive composition as well as preparation method and application method thereof

A technology of adhesives and compositions, applied in the direction of adhesives, non-polymer adhesive additives, adhesive types, etc., can solve the problems of small molecular weight, low assembly efficiency, penetration migration, etc., achieve high bonding strength, improve assembly Efficiency, the effect of simple preparation method

Inactive Publication Date: 2021-02-05
JIANGNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, the Chinese Patent Publication No. CN 106753139A "A One-Component Epoxy Resin Adhesive with Delayed Curing" and the Chinese Patent Publication No. CN 108018011A "A UV Curable Adhesive Suitable for Bonding Non-transparent Materials" "Adhesive" is a photoacid-generating (cation) system; and the invention patent reported by CN 104592923 B is "a UV-induced delayed curing one-component epoxy adhesive and its preparation method", The quaternary ammonium salt paired with tetraphenyl boron is used as the photobase generator, and the tertiary amine is generated after ultraviolet light, which further triggers the polymerization reaction of the epoxy resin. By controlling the content of the photobase generator and the time of ultraviolet light, the curing of the adhesive can be adjusted The speed can achieve curing delay of 30 to 60 minutes, but the content of photobase generator in this system is relatively high, the molecular weight is small, and problems such as osmosis and migration are prone to occur after curing, resulting in certain pollution. At the same time, after ultraviolet light irradiation, from The time from lapping to setting exceeds 30 minutes, which may cause the problem of low assembly efficiency

Method used

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  • Single-component UV delayed-curing adhesive composition as well as preparation method and application method thereof
  • Single-component UV delayed-curing adhesive composition as well as preparation method and application method thereof
  • Single-component UV delayed-curing adhesive composition as well as preparation method and application method thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0039] Photobase Generator DBU·HBPh 4 The preparation method is: weigh 0.55g of 1,8-diazabicycloundec-7-ene (DBU) and dissolve it in 1.4mL of 10% hydrochloric acid aqueous solution, then weigh 1.37g of sodium tetraphenylborate (Na ·BPh 4 ) was dissolved in 60mL of deionized water; then, under magnetic stirring, the hydrochloric acid aqueous solution of the above-mentioned DBU was slowly added dropwise to the aqueous solution of sodium tetraphenylborate to produce a white precipitate. Carry out suction filtration at last, respectively use deionized water and methanol to wash three times respectively, then place in 40 ℃ oven and dry 24h to obtain photobase generator (DBU·HBPh 4 ).

[0040] Photobase Generator TEA·HBPh 4 The preparation method is: weigh 0.36g of triethylamine (TEA) and dissolve it in 1.4mL of 10% hydrochloric acid aqueous solution, then weigh 1.37g of sodium tetraphenylborate (Na BPh 4 ) was dissolved in 60mL deionized water; then, under magnetic stirring, th...

Embodiment 1～8

[0042] The preparation method of a kind of one-component UV delayed curing adhesive composition of embodiment 1~8, concrete steps are: according to the proportion shown in table 2, photobase generator and bisphenol A type epoxy resin (E51) Mix and stir at 110°C until clear and transparent, then cool to room temperature; then add bisphenol A epoxy acrylate (EA), 1,6-hexanediol diacrylate (HDDA), pentaerythritol tetra- 3-mercaptopropionate (SH4), photosensitizer 2-isopropylthioxanthone (ITX), free radical inhibitor 2,2,6,6-tetramethylpiperidin-1-oxyl radical ( TEMPO), use a double-center mixing and dispersing machine to mix and disperse for 10 minutes at a speed of 1600 rpm / min, to obtain a one-component UV delayed curing adhesive composition. The whole experiment process must be strictly protected from light.

[0043] The application method of a one-component UV delayed-curing adhesive composition of Examples 1-6, the specific steps are: apply the one-component UV delayed-cure...

Embodiment 7

[0044] The application method of a one-component UV delayed curing adhesive composition in Example 7, the specific steps are: apply the one-component UV delayed curing adhesive composition on the surface of the stainless steel substrate to be bonded by scraping, and apply The coating thickness is 60μm; use a UV high-pressure mercury lamp (350-450nm, the main wavelength is 365nm) at 30mW / cm 2 The intensity of irradiation for 10s is used to activate the adhesive composition; within 90-120s after the adhesive composition is activated, the lap joint between the substrates to be bonded is completed, and the initial bonding strength is achieved after being placed at room temperature for a certain period of time. The bonding between the base materials is finalized; finally, post-curing is performed at 80° C. for 2 hours, so that the adhesive composition is fully cured into an adhesive film.

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Abstract

The invention discloses a single-component UV delayed curing adhesive composition as well as a preparation method and an application method thereof, and belongs to the technical field of radiation curing adhesives. The adhesive composition comprises light-cured oligomer resin, an acrylate reactive diluent, epoxy resin, a curing agent, a photoinitiator and a free radical inhibitor, wherein the photoinitiator is formed by mixing a photobase generator and a photosensitizer. The preparation method of the UV curing adhesive composition is simple, the UV curing adhesive composition can be applied toadhesion between lightproof base materials, the adhesive applied to the surfaces of the base materials cannot be cured immediately after being irradiated by ultraviolet light, a certain operation time window can be provided to meet lap joint shaping between the base materials under different application scenes, and subsequently, sufficient bonding between the base materials can be achieved through post-curing. The adhesive composition is high in assembly efficiency, has relatively good bonding strength after being cured, and has a good application prospect in the fields of electronic components, space flight and aviation, automobile machinery, building materials and the like.

Description

technical field [0001] The invention relates to the technical field of radiation curing adhesives, in particular to a single-component UV delayed curing adhesive composition and a preparation and application method thereof. Background technique [0002] Compared with traditional thermal curing technology, UV light curing technology has the advantages of high efficiency, energy saving, and environmental protection. It has been widely used in many fields such as coatings, inks, adhesives, and 3D printing. However, there are still some limitations or technical bottlenecks in applying photocuring technology to adhesives. According to statistics from the Radiation Curing Association, in 2018, the output of UV-curable adhesives in my country was about 2,000 tons, with an output value of about 250 million yuan, accounting for a relatively small market share in the entire adhesive industry. Among them, the limited depth of radiation curing, the color of the system and the opacity o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/10C09J11/06
CPCC09J163/00C09J163/10C09J11/06C08L2205/02C08L63/10C08K5/372C08L63/00
Inventor 魏玮李平李小杰刘仁刘晓亚
Owner JIANGNAN UNIV
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