Electronic carving printing gravure alkaline copper plating additive

Abstract

The invention relates to the technical field of electronic engraving and printing, in particular to an electronic engraving and printing gravure alkaline copper plating additive. Comprising a hardening agent and a leveling agent, and is prepared from the following raw materials in parts by weight: the hardening agent comprises 1-2 parts of M2-mercaptobenzimidazole, 2-4 parts of isothiourea propanesulfonic acid inner salt, 1-2 parts of MOME, 1-3 parts of glycerol and 1-3 parts of dodecylphenol polyoxyethylene ether; the leveling agent is prepared from the following components in parts by weight: 1 to 2 parts of M2-mercaptobenzimidazole, 2 to 6 parts of thiourea, 0.5 to 2 parts of N, N-dimethyl-sodium dithiocarbonyl propane sulfonate, 1 to 4 parts of G-35 polyethyleneimine, 0.5 to 2 parts of diaminourea polymer, 2 to 4 parts of sodium dodecyl benzene sulfate, 0.2 to 1 part of sodium 2-ethylhexyl sulfonate, 2 to 4 parts of disodium ethylene diamine tetraacetate, 1 to 3 parts of sodium dithiodipropane sulfonate and 1 to 2 parts of sodium bicarbonate. The additive disclosed by the invention can be directly used without nickel plating, and a plating layer electroplated by using the additive disclosed by the invention has the advantages of fast bright dipping, good brightness, excellent leveling property, good toughness and good stability.

Description

technical field [0001] The invention relates to the technical field of electronic engraving printing, in particular to an electronic engraving printing gravure alkaline copper plating additive. Background technique [0002] As a soft metal with metallic luster, easy machining, good electrical conductivity and ductility, copper is used in the production process of engraving intaglio. Electronic engraving and printing intaglio is to engrave patterns on the surface of the copper layer, and because of its engraving The method is different from other gravures, such as Bumeilan gravure, laser engraving gravure, etc. These printing gravures only need to be based on the copper layer, while the electronic engraving printing gravure has strict standards for the hardness and brightness of the copper layer, and gravure copper can be obtained. There are currently acidic additives as additives for the coating, but this process currently requires nickel plating and then copper plating to e...

AI Technical Summary

Problems solved by technology

[0002] As a soft metal with metallic luster, easy machining, good electrical conductivity and ductility, copper is used in the production process of engraving intaglio. Electronic engraving and printing intaglio is to engrave patterns on the surface of the copper layer, and because of its engraving The method is different from other gravures, such as Bumeilan gravure, laser engraving gravure, etc. These printing gravures only need to be based on the copper layer, while the electronic engraving printing gravure has strict standards for the hardness and brightness of the copper layer, and gravure copper can be obtained. There are currently acidic additives as additives for the coating, but this process currently requires nickel plating and then copper plating to ensure the binding force with iron, and a large amount of heavy metal nickel in the acidic additives will cause great environmental pollution. Commonly used additives can also be divided into toxic and toxic. Cyanide copper plating and cyanide-free copper plating, cyanide copper plating has strong uniformity and covering ability, high bonding force with steel substrate, fine crystallization of the coating, easy maintenance, but the electrolyte contains a large amount of highly toxic cyanide, which is harmful to Environmental pollution is high, which is dangerous to the health of operators. Cyanide-free copper plating is far from meeting the requirements of electronic engraving intaglio for the copper layer, and it is impossible to realize fine bottom copper engraving. For example, a kind of electronic engraving printing disclosed in Chinese patent CN107268042 A Gravure hard copper additives, including hardeners and gloss agents, hardeners are made from the following components: ethylene thiourea, polyethylene glycol, thiazoline-based dithio, sodium propanesulfonate, wetting agents, Sulfuric acid and purified water with a mass concentration of 98%; the gloss agent is made of the following components: sodium polydithiodipropane sulfonate, sodium phenyl dithiopropane sulfonate, acid copper leveling agent, acid copper medium Low area moving agent, high molecular polymer, mercaptobenzimidazole, acid copper yellow dye, sulfuric acid with a mass concentration of 98%, hydrochloric acid with a mass concentration of 98%, and purified water

The additive is an acidic formula, and the existing acidic formula needs to be nickel-plated before copper-plating during use, otherwise it will not be possible to obtain a coating with good smoothness and strong substrate adhesion, and the copper plated by the existing alkaline additives layer, the brightness cannot reach the standard, and the hardness is even less likely to reach the standard, so the existing technology needs further improvement

Images