Efficient structural adhesive for temporary bonding and application thereof

A temporary bonding and adhesive technology, applied in the direction of adhesives, adhesive types, polymer adhesive additives, etc., can solve the problems of low thermal stability of the adhesive layer, low bonding strength, and slow bonding speed , to achieve the effect of good solvent resistance, thorough degumming and fast bonding speed

Pending Publication Date: 2022-07-08
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, there are limitations such as the adhesive contains volatile solvents, the bonding speed is slow, the bonding strength is not high, the thermal stability of the bonding layer is low, the degumming speed is slow, and the degumming is not complete.

Method used

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  • Efficient structural adhesive for temporary bonding and application thereof
  • Efficient structural adhesive for temporary bonding and application thereof
  • Efficient structural adhesive for temporary bonding and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055]The A component includes only m-hydroxybenzaldehyde glycidyl ether, and the B component only includes tetraethylenepentamine. The tensile shear strength of the adhesive was tested according to the national standard GB / T 7124-2008 Determination of the tensile shear strength of adhesives (rigid material to rigid material). Quickly mix 10.0g m-hydroxybenzaldehyde glycidyl ether and 7.0g tetraethylene pentamine evenly, apply it to the bonding part of the stainless steel test piece, fit the steel piece tightly, remove the excess glue on the edge, and fix it with a reverse tail clip , 5 samples were tested in each group, and the average value was taken. After curing at room temperature for 10min, 1h, 2h, and 24h, the tensile shear strength reached 0.5, 8.0, 12.1, and 16.3MPa, respectively. The samples cured at room temperature for 24 hours were soaked in ethanol, methanol, acetone, methyl ethyl ketone, toluene, ethyl acetate, N-methylpyrrolidone, N,N-dimethylformamide, hydrog...

Embodiment 2

[0057] The adhesive composition and test method are the same as those in Example 1, and the curing conditions are different. After curing at 100℃ for 3min, 5min, 10min, and 1h, the tensile shear strength reached 1.5, 5.1, 11.8, and 22.1MPa, respectively. The samples cured at 100℃ for 1h were soaked in ethanol, methanol, acetone, methyl ethyl ketone, toluene, ethyl acetate, N-methylpyrrolidone, N,N-dimethylformamide, hydrogen peroxide and sodium hydroxide aqueous solution for 24h at room temperature. The adhesive is completely non-degradable and has no degumming phenomenon. The thermal decomposition temperature of 5wt% of the sample adhesive layer after curing at 100°C for 1h is 309°C. The samples cured at 100 °C for 1 h were soaked in 1 mol / L acetic acid aqueous solution at room temperature, and the adhesive was completely degraded in about 10 minutes to complete degumming.

Embodiment 3

[0059] Adhesive component A includes only p-hydroxybenzaldehyde glycidyl ether See figure 2 ), other components and test methods are the same as in Example 1. After curing at room temperature for 30min, 1h, 2h, and 24h, the tensile shear strength reached 0.4, 7.9, 11.5, and 15.7MPa, respectively. The reaction process and reaction mechanism of the adhesive (the aldehyde group and epoxy group in the glycidyl ether structure of p-hydroxybenzaldehyde react with the amine group in the tetraethylene pentamine structure, respectively, to generate imine bonds and cross-linking structure) see infrared spectrum figure 2 . The samples cured at room temperature for 24h were soaked in ethanol, methanol, acetone, butanone, toluene, ethyl acetate, N-methylpyrrolidone, N,N-

[0060] In dimethylformamide, hydrogen peroxide and sodium hydroxide aqueous solution for 24h, the adhesive will not be degraded at all, and there will be no degumming phenomenon. The thermal decomposition temperat...

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Abstract

The invention belongs to the field of adhesives, and discloses an efficient structural adhesive for temporary bonding and application of the efficient structural adhesive. The adhesive comprises a component A and a component B, wherein the component A comprises the following components in percentage by weight: 35-100% of aromatic aldehyde epoxy prepolymer, 0-10% of reactive diluent, 0-30% of inorganic filler, 0-5% of thixotropic agent and 0-20% of flexibilizer; and the component B comprises the following components in percentage by weight: 30-100% of an amine curing agent, 0-5% of an accelerant, 0-40% of inorganic filler, 0-5% of a thixotropic agent and 0-20% of a toughening agent. The temporary bonding adhesive does not contain volatile solvents, is high in bonding speed, high in bonding strength, high in thermal stability of a bonding layer, good in solvent resistance of the bonding layer, high in degumming speed, thorough in degumming, simple in operation process, simple in adhesive preparation process, adjustable in structure and wide in application prospect.

Description

technical field [0001] The invention belongs to the field of adhesives and is used for temporarily fixing various workpieces or components such as wafer processing and hard material cutting, and particularly relates to a high-efficiency structural adhesive for temporary bonding and a preparation and use method thereof. Background technique [0002] In the fields of semiconductor, solar energy, electronic industry, mechanical processing, etc., many processes involve the temporary fixation of components. The process requires the use of adhesives to temporarily bond or bond various components to facilitate processing. Components are required after processing. Quick and complete release from the adhesive, temporary bonding of the adhesive is critical to the success of the process. Chinese patent CN104204126A discloses a wafer processing film adhesive composition, which includes an acrylic polymer and a photosensitive gas generating agent, and the adhesive layer can be debonded b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J161/22C09J11/04C09J11/08C08G12/06C08G59/50C11D7/08C11D7/26C11D7/50
CPCC09J163/00C09J161/22C09J11/04C09J11/08C08G59/5013C08G59/5073C08G12/06C11D7/08C11D7/265C11D7/5013C11D7/5009C11D7/5027C11D7/5022C08G2170/00C08K2201/011C08K2003/2227C08K2003/265C08L29/14C08K3/22C08K3/36C08L69/00C08K3/26C08K3/346
Inventor 袁彦超井长友李丽珍刘述梅赵建青
Owner SOUTH CHINA UNIV OF TECH
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