Manufacturing method of polyphenylene sulfide composite heat conduction material for light-emitting diode (LED)

A composite heat-conducting material, polyphenylene sulfide technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of narrow application range, unsatisfactory heat conduction, unsatisfactory impact resistance and process toughness, etc., to prevent electrification effect
CN102391647AInactive Publication Date: 2012-03-28四川瑞安特电子技术有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
四川瑞安特电子技术有限公司
Publication Date
2012-03-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a manufacturing method of a polyphenylene sulfide composite heat conduction material for a light-emitting diode (LED), which adopts the following raw material formulation: 40-60% wt of polyphenylene sulfide resin, 1.5-0.5% wt of heat stabilizer trisnonyl phenyl phosphate, 8-6% wt of nanoscale heat conduction metal fiber materials, 12-7.5% wt of inorganic filling materials,6-4% wt of heat conduction powder materials and 32.5-22% wt of 95% aluminium oxide ceramic fiber. The polyphenylene sulfide composite heat conduction material prepared by the method of the invention has a certain heat-conducting property and good mechanical strength, can be widely used for the fields such as electronic and electric products, war industry, space flight and aviation, electrocommunication and the like which need heat conduction or electronic shielding materials after being molded by injection, and is especially used as the heat conduction material for the LED, so that the heat dispersion performance of the LED in high temperature can be improved, and the service life of the LED can be prolonged.
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Description

Technical field

[0001] The invention belongs to the application field of polymer materials.

[0002] Since the polyphenylene sulfide resin (PPS) composite material of the present invention has a volume resistivity in the semiconductor range, it is excellent in heat resistance, weather resistance, flame retardancy, chemical resistance, mechanical strength, toughness, and low temperature windability. It has excellent characteristics, so it can be used in a wide range of applications such as electrical appliances, electronic components, household appliances, and audio equipment that require thermal conductivity, antistatic properties, electromagnetic wave sealing, and low resistance. At the same time, it can also be used in chemical machinery, petroleum machinery, military industry, aerospace, electronic communication and other fields. Background technique

[0003] Brackets, chips, and heat dissipation materials are the three main raw materials in the heat dissipation process ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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