Manufacturing method of polyphenylene sulfide composite heat conduction material for light-emitting diode (LED)

Abstract

The invention discloses a manufacturing method of a polyphenylene sulfide composite heat conduction material for a light-emitting diode (LED), which adopts the following raw material formulation: 40-60% wt of polyphenylene sulfide resin, 1.5-0.5% wt of heat stabilizer trisnonyl phenyl phosphate, 8-6% wt of nanoscale heat conduction metal fiber materials, 12-7.5% wt of inorganic filling materials,6-4% wt of heat conduction powder materials and 32.5-22% wt of 95% aluminium oxide ceramic fiber. The polyphenylene sulfide composite heat conduction material prepared by the method of the invention has a certain heat-conducting property and good mechanical strength, can be widely used for the fields such as electronic and electric products, war industry, space flight and aviation, electrocommunication and the like which need heat conduction or electronic shielding materials after being molded by injection, and is especially used as the heat conduction material for the LED, so that the heat dispersion performance of the LED in high temperature can be improved, and the service life of the LED can be prolonged.

Description

Technical field [0001] The invention belongs to the application field of polymer materials. [0002] Since the polyphenylene sulfide resin (PPS) composite material of the present invention has a volume resistivity in the semiconductor range, it is excellent in heat resistance, weather resistance, flame retardancy, chemical resistance, mechanical strength, toughness, and low temperature windability. It has excellent characteristics, so it can be used in a wide range of applications such as electrical appliances, electronic components, household appliances, and audio equipment that require thermal conductivity, antistatic properties, electromagnetic wave sealing, and low resistance. At the same time, it can also be used in chemical machinery, petroleum machinery, military industry, aerospace, electronic communication and other fields. Background technique [0003] Brackets, chips, and heat dissipation materials are the three main raw materials in the heat dissipation process ...

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Problems solved by technology

[0007] Chinese Patent No. CN: 1244887 introduces a polyphenylene sulfide (PPS) composite material with thermally conductive graphite, which has a good control range of volume resistivity during injection molding and an elongation at break of more than 10%. , its application range is relatively narrow

[0008] Chinese patent application number 200710012359.8 introduces a thermally and electrically conductive polyphenylene sulfide material and its production method, wherein the added materials are carbon fiber, glass fiber, metal powder, carbon black powder, and inorganic fillers, etc., and the amount of thermally and electrically conductive material added It is 10-25%. In practice, it is found that although the thermal conductivity is good, the impact resistance and process toughness are not ideal

[0009] Chinese patent application number 200710076484.8 introduces a high thermal conductivity polyphenylene sulfide composite material and its preparation method, wherein the added materials are carbon fiber, glass fiber, metal powder, carbon black powder, and inorganic filler, etc., and the thermal conductivity is added in an amount of 3 -4%, in practice, it is found that there are also cases of unsatisfactory heat conduction

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