Manufacturing method of polyphenylene sulfide composite heat conduction material for light-emitting diode (LED)

A composite heat-conducting material, polyphenylene sulfide technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of narrow application range, unsatisfactory heat conduction, unsatisfactory impact resistance and process toughness, etc., to prevent electrification effect

Inactive Publication Date: 2012-03-28
四川瑞安特电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Chinese Patent No. CN: 1244887 introduces a polyphenylene sulfide (PPS) composite material with thermally conductive graphite, which has a good control range of volume resistivity during injection molding and an elongation at break of more than 10%. , its application range is relatively narrow
[0008] Chinese patent application number 200710012359.8 introduces a thermally and electrically conductive polyphenylene sulfide material and its production method, wherein the added materials are carbon fiber, glass fiber, metal powder, carbon black powder, and inorganic fillers, etc., and the amount of thermally a

Method used

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  • Manufacturing method of polyphenylene sulfide composite heat conduction material for light-emitting diode (LED)
  • Manufacturing method of polyphenylene sulfide composite heat conduction material for light-emitting diode (LED)
  • Manufacturing method of polyphenylene sulfide composite heat conduction material for light-emitting diode (LED)

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Experimental program
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Effect test

Embodiment 1

[0035] The linear polyphenylene sulfide resin with a weight average molecular weight of 30,000 and a melt index of 380g / 10min is at 240°C; after 4 hours of oxidative thermal crosslinking, the polyphenylene sulfide resin is 40kg, and the heat stabilizer nonyl triphenyl phosphite is 1.5 kg, pretreated calcium sulfate whiskers 12kg, whisker length of 50 μm, 6% w pretreated particle diameter of 10nm carbon black powder 6kg formula, adding to the blender and stirring at high speed for 3 hours, then pretreated 8 kg of good nano-scale copper heat-conducting metal fiber material, long fibers with a fiber diameter of 1 nm, 32.5 kg of pretreated 95% alumina ceramic fibers, and long fibers with a fiber diameter of 25 μm are input into the twin-screw extruder, and finally passed through the same direction Twin-screw extruder kneading and extruding, cooling, pelletizing, and packaging to produce a polyphenylene sulfide composite material as a heat-conducting material for LEDs

Embodiment 2

[0037]After the linear polyphenylene sulfide resin with a weight average molecular weight of 50,000 and a melt index of 330g / 10min has undergone oxidative thermal crosslinking, 60 kg of polyphenylene sulfide resin, 0.5 kg of nonyl phosphite as a heat stabilizer, and pretreated 7.5kg of calcium carbonate whiskers, 25μm whisker length, 4kg of pretreated carbon black powder with a particle size of 5nm, added to the mixer and stirred at high speed for 2.5 hours, and then the pretreated nano-scale aluminum heat-conducting metal 6kg of fiber material, long fiber with a fiber diameter of 5nm, 22kg of pretreated 95% alumina ceramic fiber, a long fiber twin-screw extruder with a fiber diameter of 10μm, and finally mixed and extruded by a co-rotating twin-screw extruder , cooling, pelletizing, and packaging, and a polyphenylene sulfide composite material as a heat-conducting material for LEDs is prepared

Embodiment 3

[0039] After the linear polyphenylene sulfide resin with a weight average molecular weight of 40,000 and a melt index of 337g / 10min has undergone oxidative thermal crosslinking, use 50kg of polyphenylene sulfide resin, 1.0kg of heat stabilizer nonyl phosphite, and pretreatment Magnesium carbonate whiskers 10kg, the whisker length is 30μm, the formula 5kg of the pretreated carbon black powder with a particle size of 6nm is added to the mixer and stirred at high speed for 3 hours, and then the pretreated nano-scale 304 stainless steel heat-conducting metal 7kg of fiber material, long fiber with a fiber diameter of 4nm, 27kg of pretreated 95% alumina ceramic fiber, a long fiber twin-screw extruder with a fiber diameter of 20μm, and finally mixed and extruded by a co-rotating twin-screw extruder , cooling, pelletizing, and packaging, and a polyphenylene sulfide composite material as a heat-conducting material for LEDs is prepared

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Abstract

The invention discloses a manufacturing method of a polyphenylene sulfide composite heat conduction material for a light-emitting diode (LED), which adopts the following raw material formulation: 40-60% wt of polyphenylene sulfide resin, 1.5-0.5% wt of heat stabilizer trisnonyl phenyl phosphate, 8-6% wt of nanoscale heat conduction metal fiber materials, 12-7.5% wt of inorganic filling materials,6-4% wt of heat conduction powder materials and 32.5-22% wt of 95% aluminium oxide ceramic fiber. The polyphenylene sulfide composite heat conduction material prepared by the method of the invention has a certain heat-conducting property and good mechanical strength, can be widely used for the fields such as electronic and electric products, war industry, space flight and aviation, electrocommunication and the like which need heat conduction or electronic shielding materials after being molded by injection, and is especially used as the heat conduction material for the LED, so that the heat dispersion performance of the LED in high temperature can be improved, and the service life of the LED can be prolonged.

Description

Technical field [0001] The invention belongs to the application field of polymer materials. [0002] Since the polyphenylene sulfide resin (PPS) composite material of the present invention has a volume resistivity in the semiconductor range, it is excellent in heat resistance, weather resistance, flame retardancy, chemical resistance, mechanical strength, toughness, and low temperature windability. It has excellent characteristics, so it can be used in a wide range of applications such as electrical appliances, electronic components, household appliances, and audio equipment that require thermal conductivity, antistatic properties, electromagnetic wave sealing, and low resistance. At the same time, it can also be used in chemical machinery, petroleum machinery, military industry, aerospace, electronic communication and other fields. Background technique [0003] Brackets, chips, and heat dissipation materials are the three main raw materials in the heat dissipation process ...

Claims

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Application Information

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IPC IPC(8): C08L81/02C08K13/06C08K9/06C08K7/06C08K7/04C08K7/14C08K3/30C08K3/04C08K3/08C08K3/22C08K3/34C08K5/526C09K5/14
Inventor 宋大余宋小春苏心桐
Owner 四川瑞安特电子技术有限公司
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