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Photo-curable and heat-curable resin composition

A resin composition and photocurable technology, applied in the field of photocurable thermosetting resin compositions, can solve problems such as difficulty in removing impurities, and achieve the effects of improving flexibility, improving electrical properties, and reducing chloride ion impurities

Active Publication Date: 2012-04-11
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The epoxy resins used as raw materials for general epoxy acrylate modified resins almost all contain a lot of chloride ion impurities. After epoxy acrylate modification, it is very difficult to remove the impurities.

Method used

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  • Photo-curable and heat-curable resin composition
  • Photo-curable and heat-curable resin composition
  • Photo-curable and heat-curable resin composition

Examples

Experimental program
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Embodiment

[0167] Although Examples and Comparative Examples are shown below and the present invention will be specifically described, the present invention is not limited to the following Examples. In addition, the following "parts" and "%" refer to mass standards unless otherwise specified.

Synthetic example 1

[0169] In an autoclave equipped with a thermometer, a nitrogen gas introduction device, an alkylene oxide introduction device, and a stirring device, 119.4 g of a novolac-type cresol resin (manufactured by Showa Polymer Co., Ltd., trade name "Shonol CRG951", OH equivalent: 119.4 ), 1.19g potassium hydroxide and 119.4g toluene, while stirring, carry out nitrogen replacement in the system, and heat up. Next, slowly add 63.8g of propylene oxide dropwise, at 125-132°C, at 0-4.8kg / cm 2 React for 16 hours. Then, it was cooled to room temperature, and 1.56 g of 89% phosphoric acid was added to the reaction solution to neutralize potassium hydroxide to obtain a non-volatile content of 62.1%, a hydroxyl value of 182.2 g / eq. Propane reaction solution. This is a substance in which 1.08 moles of alkylene oxide were added on average per 1 equivalent of phenolic hydroxyl group.

[0170] Next, 293.0 g of the alkylene oxide reaction liquid of the obtained novolak type cresol resin, 43.2 g ...

Synthetic example 2

[0172] In a 5-liter detachable flask equipped with a thermometer, a stirrer, and a reflux condenser, 1245 g of polycaprolactone diol (DDAICEL CHEMICAL INDUSTRIES, LTD. manufacture PLACCEL208, molecular weight 830), 201 g of polycaprolactone diol as a polymer polyol, and 201 g as Dimethylol propionic acid of a dihydroxy compound having a carboxyl group, 777 g of isophorone diisocyanate as a polyisocyanate, and 119 g of 2-hydroxyethyl acrylate as a (meth)acrylate having a hydroxyl group, and 0.5 g each p-methoxyphenol and di-tert-butyl-hydroxytoluene. Heating was stopped at 60° C. while stirring, and 0.8 g of dibutyltin dilaurate was added. If the temperature in the reaction vessel begins to drop, then reheat, continue stirring at 80°C, and confirm the absorption spectrum of the isocyanate group (2280cm -1 ) disappears to terminate the reaction to obtain a viscous liquid urethane acrylate compound. Non-volatile content=50 mass % was adjusted using carbitol acetate. A resin so...

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Abstract

Disclosed are: a photo-curable and heat-curable resin composition which enables the formation of a cured coating film having significantly superior insulation reliability and also having PCT resistance, HAST resistance and electroless gold plating resistance that are important for a solder resist for a semiconductor package; a dried film and a cured product of the composition; and a printed circuit board having, formed thereon, a cured coating film such (e.g., a solder resist) produced from the composition or the dried film. Specifically disclosed is a photo-curable and heat-curable resin composition which can be developed with a dilute aqueous alkaline solution. The resin composition comprises a carboxyl-group-containing resin (excluding a carboxyl-group-containing resin produced using an epoxy resin as a starting raw material), a photopolymerization initiator and an epoxidized polybutadiene. The carboxyl-group-containing resin preferably contains no hydroxy group, and more preferably contains a photosensitive group.

Description

technical field [0001] The present invention relates to a photocurable thermosetting resin composition that can be developed by a dilute alkaline aqueous solution, and more particularly to a composition for solder resist that is photocurable by ultraviolet exposure or laser exposure, its dry film and cured product, and a composition having a composition formed using them. Printed circuit boards with cured film. Background technique [0002] At present, from the viewpoint of high precision and high density, for some consumer printed circuit boards and most industrial printed circuit boards, solder resists are image-formed by developing after ultraviolet irradiation and then irradiated with heat and / or light. The final cured (completely cured) liquid-developed solder resist, starting from concerns about environmental issues, the alkali-developed photo-solder resist that uses a dilute alkaline aqueous solution as the developer has become the mainstream, and is used in the actua...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/038C08G8/30C08G18/67G03F7/004H05K3/28
CPCC08G59/027C08G59/4246G03F7/038H05K3/287C08L63/08C08L63/00C08G8/30C08G18/67H05K3/28
Inventor 伊藤信人有马圣夫
Owner TAIYO HLDG CO LTD