Space solar cell composite interconnection material and preparation method thereof

A technology for interconnecting materials and solar cells, applied in the field of composite interconnecting materials for space solar cells and their preparation, can solve the problems of cracking of coatings and silver foils, corrosion and exhaustion of silver foils, and difficulty in completely blocking atomic oxygen corrosion.

Active Publication Date: 2021-09-10
HUNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Generally, solar interconnectors are punched out of pure silver foil. When the solar panel is working, atomic oxygen with strong oxidation and high kinetic energy reacts with silver on the surface of interconnectors to form silver oxide, and the silver oxide will be released from The top of the substrate is peeled off to reveal a fresh surface. Repeatedly, the silver foil will be corroded and exhausted by atomic oxygen, so that the solar panel cannot provide power for the aircraft.
In order to further protect the corrosion of atomic oxygen, gold film, aluminum film, polyimide, DC1140, DC1200, SWSSV10 silicon, etc. are sprayed on the surface of silver foil, but these methods produce huge thermal cycle stress and thermal fatigue due to the large temperature difference effect etc., resulting in cracking and peeling between the coating and the silver foil
Chinese Patent No. (Notice No.: CN 111129193A, a silver interconnect sheet for atomic oxygen protection for space solar cells and its preparation method) proposes a method of plating palladium on the surface of silver foil as a transition layer, and then plating a gold protective layer on it. Although this method alleviates the corrosion of atomic oxygen, it is difficult to completely block the corrosion of atomic oxygen due to the presence of pinholes in the surface coating. At the same time, this method increases the cost of the entire production process
This method of ion implantation optimizes the surface of Mo foil and improves the film-base bonding to a certain extent, but the environment and state of ion implantation are completely inconsistent with the electroplating Ag layer, and the process cannot be completed under in-situ conditions; electroplating in solution In the middle, it causes many defects and the film is not dense; the equipment and process required by this method are relatively complicated, and it is challenging for large-scale production and cost control

Method used

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  • Space solar cell composite interconnection material and preparation method thereof
  • Space solar cell composite interconnection material and preparation method thereof
  • Space solar cell composite interconnection material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1～5

[0057] Preparation and characterization of molybdenum-silver alloy thin films.

[0058] Co-deposition of Mo by sputtering on N-type single-sided polished Si substrate x Ag y Alloy, substrate cleaning and thin film sputtering processes are as follows:

[0059] Firstly, the single-sided polished Si wafer with a size of 10 mm×10 mm was soaked in acetone and alcohol solutions for 20 minutes, then ultrasonically cleaned for 20 min, dried in a blast drying oven, and installed on a magnetron sputtering (MIS800) workstation. ,Such as figure 1 As shown in (a), the sample is located on a concentric circle with a distance of 20 mm from the center of the sample stage;

[0060] Then, the rotating speed of the sample stage is adjusted to be 5rpm, the vertical target spacing is 55cm, the inclination angle of the silver target and the molybdenum target is adjusted to be 30°, and the two target center extension lines intersect at the center of the sample stage (such as figure 1 (a) sputter...

Embodiment 1

[0065] The Mo that embodiment 1 obtains x Ag y The distribution of elements in the alloy film is as follows: figure 1 As shown in (c), the results show that when the sample rotation speed is 5r / min, the Mo and Ag elements in the film are evenly distributed. The high-resolution image shows that there are amorphous regions in the sample, and more crystalline regions. Electron diffraction (inset) revealed a polycrystalline structure of the film. The crystal structure of the above sample was analyzed, and its X-ray diffraction pattern was as follows: figure 1 As shown in (d), the results show that Mo x Ag y The alloy film is mainly composed of Mo(Ag) solid solution, pure Ag phase and amorphous phase.

Embodiment 3

[0066] The Mo that embodiment 3 obtains x Ag y The morphology of the alloy thin film is as image 3 As shown in (a), its energy spectrum is as image 3 (b) shown. X-ray diffraction analysis of samples, such as image 3 As shown in (c), due to the equivalent content of the two elements in the film sample, the solid solution causes the shift and broadening of the peak position, and the peak division shows that the diffraction peak is composed of pure silver, Mo(Ag) solid solution and pure amorphous molybdenum.

[0067] For the Mo obtained in Example 5 x Ag y The alloy film was analyzed by transmission electron microscope, energy spectrum analysis and X-ray diffraction analysis, the results are as follows Figure 5 (a), (b), (c), (d), as shown in Figure 5 As shown in (c), the silver and molybdenum in the film are mixed evenly. Due to the high silver content, there is a tendency to form a layered structure. It is found in the SEM image that there are a large number of part...

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Abstract

The invention provides a space solar cell composite interconnection material and a preparation method thereof. The composite interconnection material sequentially comprises a molybdenum substrate, a molybdenum-silver alloy transition layer and a silver film from inside to outside. The molybdenum-silver alloy transition layer is firstly deposited on the surface of the molybdenum foil through the magnetron sputtering technology, then the silver film is deposited on the surface of the molybdenum foil, infiltration and firm bonding between the molybdenum substrate and the silver film and stable transition of thermal expansion coefficients are achieved under the condition that a third metal element which is not a film substrate is not introduced, the film substrate bonding strength is remarkably enhanced, the preparation cost of the space solar cell interconnection material is reduced, and the problems that the welding interface organization structure and performance of the material are uncontrollable due to introduction of other elements and spacecraft signal transmission interference is caused when the material is used are solved. The preparation method disclosed by the invention is simple in process and can be continuously carried out without damaging the vacuum condition, so that the cost is saved, the efficiency is improved, and the film-substrate bonding strength is enhanced.

Description

technical field [0001] The invention relates to the technical field of interconnection materials, in particular to a space solar cell composite interconnection material and a preparation method thereof. Background technique [0002] The low-orbit (200km ~ 1000km) space vehicle solar battery is used as the power source of the space vehicle, on the one hand, it provides electric energy for the spacecraft load, and on the other hand, it charges the battery pack. The battery board is composed of separate battery pieces connected in parallel or in series through bus bars and interconnection pieces. The interconnection pieces collect the charge generated on a single battery piece and connect the battery pieces together; Connect and combine together for output. Currently, the interconnects used in space vehicles are mainly made of silver, the most conductive metal. [0003] The low-orbit space environment is a relatively complex environment, mainly including space debris, high-en...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/05H01L31/18C23C14/16C23C14/35
CPCH01L31/0512H01L31/1804C23C14/165C23C14/352Y02P70/50Y02E10/547Y02E10/50
Inventor 周灵平高宝龙朱家俊符立才杨武霖李德意
Owner HUNAN UNIV
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