The invention relates to the technical field of
LED lamp beads, in particular to an
LED lamp bead, a preparation method of the
LED lamp bead and an LED lamp strip, and the method comprises the following steps: depositing an
indium tin oxide electrode by adopting a high-purity aluminum
oxide substrate and photoetching a microcircuit, flip-
chip welding a Micro-LED
chip, filling a
quantum dot solution through a micro-channel and spin-
coating ZIF-8 to form a 500nm porous protective layer, and performing heat treatment to obtain the LED lamp bead. The method comprises the following steps of:
doping nano ZrO2,
fluorine-modified
polyimide microspheres and a SiO2-coated TiO2 core-shell light diffusant into a thiosiloxane
adhesive serving as a matrix, carrying out
gradient centrifugation and UV / thermal dual-curing packaging,
stamping a PCT / LCP
alloy stepped bowl cup and
sputtering an Ag reflecting layer, filling an aluminum radiator with aluminum
nitride adhesive to construct dual-channel heat dissipation, and
brazing a linear driver, thereby obtaining the PCT / LCP
alloy / Ag reflecting layer / PCT / LCP
alloy / Ag reflecting layer / PCT / LCP alloy / Ag reflecting layer / PCT / LCP alloy / Ag reflecting layer / and carrying out 3D
direct writing and
coating with a thiosiloxane
adhesive, and printing the super
lens array. Therefore, the problems that an LED lamp bead is poor in heat dissipation, low in light emitting efficiency, uneven in light emitting, short in service life and the like are solved.