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Photo-curable and heat-curable resin composition

A resin composition and photocurable technology, which is applied in the field of photocurable thermosetting resin composition, can solve problems such as difficulty in removing impurities, and achieve the effects of improving hydrophobicity, excellent insulation reliability, and improving electrical properties

Active Publication Date: 2012-04-11
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Common epoxy acrylate modified resins almost all of the epoxy resins used as raw materials contain a lot of chloride ion impurities. After epoxy acrylate modification, it is very difficult to remove the impurities.

Method used

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  • Photo-curable and heat-curable resin composition
  • Photo-curable and heat-curable resin composition
  • Photo-curable and heat-curable resin composition

Examples

Experimental program
Comparison scheme
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Embodiment

[0167] Although Examples and Comparative Examples are shown below and the present invention will be specifically described, the present invention is not limited to the following Examples. In addition, the following "parts" and "%" refer to mass standards unless otherwise specified.

Synthetic example 1

[0169] In an autoclave equipped with a thermometer, a nitrogen gas introduction device, an alkylene oxide introduction device, and a stirring device, 119.4 g of novolac-type cresol resin (manufactured by Showa High Molecular Co., Ltd., trade name "Shonol CRG951", OH equivalent: 119.4), 1.19g of potassium hydroxide and 119.4g of toluene, nitrogen replacement in the system was carried out while stirring, and the temperature was raised by heating. Next, slowly add 63.8g of propylene oxide dropwise, at 125-132°C, at 0-4.8kg / cm 2 React for 16 hours. Then, it was cooled to room temperature, and 1.56 g of 89% phosphoric acid was added and mixed in the reaction solution to neutralize potassium hydroxide to obtain a non-volatile content of 62.1%, a hydroxyl value of 182.2 g / eq. Propane reaction solution. This is a substance in which 1.08 moles of alkylene oxide were added on average per 1 equivalent of phenolic hydroxyl group.

[0170] Next, 293.0 g of the obtained novolak-type cres...

Synthetic example 2

[0172] In a 5-liter detachable flask equipped with a thermometer, a stirrer, and a reflux condenser, 1245 g of polycaprolactone diol (DDAICEL CHEMICAL INDUSTRIES, LTD. manufacture PLACCEL208, molecular weight 830), 201 g of polycaprolactone diol as a polymer polyol, and 201 g as Dimethylol propionic acid which is a dihydroxy compound having a carboxyl group, 777 g of isophorone diisocyanate which is a polyisocyanate, and 119 g of 2-hydroxyethyl acrylate which is a (meth)acrylate having a hydroxyl group, and 0.5 g each of p-methoxyphenol and di-tert-butyl-hydroxytoluene. Heating was stopped at 60° C. while stirring, and 0.8 g of dibutyltin dilaurate was added. If the temperature in the reaction vessel begins to drop, then reheat, continue stirring at 80°C, and confirm the absorption spectrum of the isocyanate group in the infrared absorption spectrum (2280cm -1 ) disappears, the reaction is stopped to obtain a viscous liquid urethane acrylate compound. It adjusted to non-vola...

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Abstract

Disclosed are: a photo-curable and heat-curable resin composition which enables the formation of a cured coating film having excellent insulation reliability and chemical resistance and also having PCT resistance, HAST resistance and electroless gold plating resistance that are important for a solder resist for a semiconductor package; a dried film and a cured product of the composition; and a printed circuit board having, formed thereon, a cured coating film such (e.g., a solder resist) produced from the composition or the dried film. Specifically disclosed is a photo-curable and heat-curable resin composition which can be developed with a dilute aqueous alkaline solution. The resin composition comprises a carboxyl-group-containing resin (excluding a carboxyl-group-containing resin produced using an epoxy resin as a starting raw material), a photopolymerization initiator, and an amino resin having an alkoxymethyl group. The carboxyl-group-containing resin preferably contains no hydroxy group, and more preferably contains a photosensitive group. A preferred embodiment of the photo-curable and heat-curable resin composition additionally contains a heat-curable component, and preferably additionally contains a coloring agent.

Description

technical field [0001] The present invention relates to a photocurable thermosetting resin composition that can be developed by a dilute alkali aqueous solution, and in particular to a composition for solder resist that is photocured by ultraviolet exposure or laser exposure, its dry film and cured product, and a composition having a composition formed using them. Printed circuit boards with cured film. Background technique [0002] At present, from the viewpoint of high precision and high density, for some consumer printed circuit boards and most industrial printed circuit boards, solder resists are image-formed by developing after ultraviolet irradiation and irradiated with heat and / or light. The final cured (completely cured) liquid-developed solder resist, starting from concerns about environmental issues, the alkali-developed photo-solder resist that uses a dilute alkaline aqueous solution as the developer has become the mainstream, and is used in the actual manufacture...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/038C08G8/30C08G18/67G03F7/004H05K3/28
CPCG03F7/0388C08G59/027C08G59/4246H05K3/287C08L63/00
Inventor 伊藤信人有马圣夫
Owner TAIYO INK MFG
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