Novel multi-element structure composite conductive filling material

Abstract

The invention discloses a multi-element structure composite conductive filling material. A surface of lightweight inorganic powder (hollow glass beads, mica, carbon fibers, flake graphite and the like) is plated with a layer of wave absorbing magnetic material (Ni, Fe, Co, Ni-P, Co-P, Ni-Co-P, Co-W-P, barium ferrite, ferriferrous oxide, carbonyl iron and the like), and then is plated with a layer of conductive material (such as metal of silver, nickel, copper and the like or inorganic oxides of doped tin oxide, doped indium oxide, doped zinc oxide, titanium dioxide and the like), and a novel multi-element structure composite conductive filling material-inorganic powder core / magnetic material coating layer / conductive material coating layer is prepared. The electromagnetic shielding performance of the composite conductive filling materials can be raised further by utilization of wave absorbing performances of the wave absorbing material to electromagnetic waves and the reflection performances of the conductive material to electromagnetic waves. The composite conductive filling material has advantages of light weight, low cost, wide shield frequency band, good shielding properties and the like, and has great application values in the electromagnetic shielding composite material field.

Description

technical field [0001] The invention belongs to the field of functional materials and relates to a multi-component composite conductive filler. A layer of wave-absorbing magnetic material is plated on the surface of the inorganic powder, and then a layer of conductive material is plated to obtain a new type of multi-structure composite conductive filler-inorganic powder core / magnetic material coating / conductive material coating, which has light weight, It has the advantages of low cost, wide shielding frequency band, and good shielding performance, and can be used in the field of electromagnetic shielding composite materials. Background technique [0002] With the rapid development of science and technology such as radar, microwave communication, and electronic countermeasures, the problem of electromagnetic interference (EMI) is becoming more and more serious. In order to achieve electromagnetic wave protection, electromagnetic shielding materials are developing rapidly, an...

AI Technical Summary

Problems solved by technology

At present, shielding fillers mainly include: (1) Metal conductive fillers: mainly metal conductive fillers such as silver, copper, and nickel; silver, copper, and other metals have high conductivity and good electromagnetic shielding effect, but Ag is expensive; in addition, Cu is easy to oxidize and reduce Conductivity, so special anti-oxidation treatment must be carried out; although nickel has certain magnetic properties and good chemical stability, its conductivity is lower than Cu and Ag, so the shielding effect is not as good as the former

(2) Metal wave-absorbing fillers: Commonly used metal wave-absorbing fillers include ferroferric oxide, magnetic metal powder (carbonyl iron powder, iron-cobalt-nickel and their alloys), polycrystalline iron fibers, etc., but such metal wave-absorbing fillers are also There are disadvantages such as high density and poor high temperature characteristics

[0005] Combining reflection loss and absorption loss is one of the key directions in the research of electromagnetic shielding materials, such as: using multi-layer composite / multi-filler composite technology to endow electromagnetic shielding composite materials with conductive and magnetic properties, thereby improving the electromagnetic shielding of materials efficiency, but at the same time, the thickness of the material increases and the processing technology is complicated.