Formaldehyde-free soybean powder adhesive and preparation method thereof

Abstract

The invention discloses a formaldehyde-free soybean powder adhesive. The formaldehyde-free soybean powder adhesive is prepared from the following components in parts by weight: 100 parts of water, 20 to 70 parts of soybean powder, 0.1 to 10 parts of a modifier, 20 to 120 parts of a crosslinking agent, 0.05 to 5 parts of a regulator and 0.1 to 3 parts of a reducing agent. The formaldehyde-free soybean powder adhesive is good in bonding performance and water resistance, low in production cost, long in storage period, and convenient to transport and use. A preparation method of the formaldehyde-free soybean powder adhesive is simple in preparation, good in controllability, easy to operate and realize industrial production and low in production cost, so that the formaldehyde-free soybean powder adhesive has good economic benefit, is favorable for popularization and application, and has wide application prospects.

Description

technical field [0001] The invention relates to an adhesive, in particular to an formaldehyde-free soybean powder adhesive and a preparation method thereof. Background technique [0002] With the increasing scarcity of petroleum resources, the production cost of formaldehyde adhesives is rising steadily, and the international community is increasingly concerned about the hazards of volatile formaldehyde, phenol and other harmful gases in "trialdehyde adhesives" to human health. The woodworking adhesive industry has begun to reconsider the development and research of new, natural, non-toxic adhesives, and soybean adhesives have once again become a research hotspot. In the past two years, the United States has successfully launched a soy-based formaldehyde-free plywood named "Purebond", prompting the California Air Regulatory Board (CARB) to put forward stricter new requirements than E0 for the allowable formaldehyde emission of various plywood. The promotion and implementati...

AI Technical Summary

Problems solved by technology

[0004] The invention patents of CN 101475790A and CN 1670111A disclose the use of protein-containing raw materials, acid regulators, compounds containing benzene rings in molecules, preservatives, thickeners, and fillers to prepare a aldehyde-free adhesive. In the application of boards, there are problems such as high board hot-pressing temperature (above 150°C), extremely low production efficiency, and easy "explosion" during the hot-pressing process; the yield is too low; US patents US2004 / 0089418, US2005 / 0282988 A1, US2005 / 0282988 A1, discloses the use of cationic polymers, polyamide epichlorohydrin, cross-linked with soybean protein, greatly improving the bond strength and water resistance

The product introduced by this patent, due to the large amount of polyamide epichlorohydrin, results in high cost of glue, which greatly limits its application

The invention patent of CN101412898A discloses that the mixture of vegetable protein and lignin sulfonate is used as the base material, and the protein itself is modified by adding alkaline hydroxide, silicate or borate, epoxy halide, amino polymer, etc. To improve water resistance; this patented product has problems such as large seasonal variability and poor product stability. In the process of industrialization, the storage time of liquid adhesive is short, the transportation cost is high, and the sales radius is greatly limited.