30results about How to "Effectively improve on the issues" patented technology

A wind power generation apparatus includes a rotating shaft, a wind power generation device assembled to the rotating shaft, and an acceleration restriction mechanism. The wind power generation device includes a drag blade fixed on the rotating shaft, an inner housing connected to an outer edge of the drag blade, and an outer housing sleeved around the inner housing. The acceleration restriction mechanism includes a plurality of swing arms pivotally connected to the inner housing and a metal ring fixed on the outer housing. A magnetic portion of each swing arm is movable relative to the inner housing from an initial position to an acceleration restriction position. When the magnetic portion of each swing arm is at the acceleration restriction position, the magnetic portion at least partially covers the metal ring, so that the metal ring generates an eddy current limiting a rotating acceleration of the drag blade.

A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a padding layer disposed on the substrate, a plurality of wires, a support, and a light-permeable layer disposed on the support. A top side of the padding layer is coplanar with a top surface of the sensor chip, the support is disposed on the top side of the padding layer and the top surface of the sensor chip, and the wires are embedded in the support. Terminals at one end of the wires are connected to the top surface of the sensor chip, and terminals at the other end of the wires are connected to the top side of the padding layer, so that the sensor chip can be electrically coupled to the substrate through the wires and the padding layer.

An external electromagnetic shielding device is provided. The external electromagnetic shielding device includes a bottom shield, a conductive cover being in a grid-like shape and arranged above the bottom shield, and a rolling module. The conductive cover includes a top shield spaced apart from the bottom shield, a lateral shield connected to the top shield, and a plurality of supports that are fixed to the lateral shield. The supports include a bottom support in an annular arrangement, and any two of the supports are spaced apart from each other. The rolling module includes a rolling unit and a linkage unit that is connected to the rolling unit and the bottom support. When the linkage unit is coiled on or released from the rolling unit, the bottom support can be moved to allow the lateral shield to fold or unfold between the bottom shield and the top shield.

A projecting apparatus is provided, and includes a frame, a light source module, at least one collimator lens, at least one adhesive, and a microelectromechanical systems (MEMS) module. The frame includes a first frame portion and a second frame portion. The first frame portion has a carrier and a carrying bridge having an end connected to the carrier. The frame has a processing slot that uses the carrying bridge as a bottom thereof, and the carrying bridge has at least one thru-hole that is in spatial communication with the processing slot. The second frame portion is connected to the carrier and another end of the carrying bridge of the first frame portion. The at least one adhesive corresponds in position to the at least one thru-hole, and connects the at least one collimator lens onto the carrying bridge. The MEMS module is disposed on the second frame portion.

A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a surrounding wall, a light emitting unit, an adhesive, and a light permeable element. The surrounding wall is annular with step structure and includes an upper tread surface arranged away from the substrate, an upper riser surface connected to an inner edge of the upper tread surface, a lower tread surface disposed at an inner side of the upper riser surface, an accommodating groove disposed between the lower tread surface and the upper riser surface, and a lower riser surface connected to an inner edge of the lower tread surface and arranged away from the upper tread surface. The lower riser surface and the first surface jointly define a receiving space.

A chip-scale sensor package structure includes a sensor chip, a first package body surrounding and connected to an outer lateral side of the sensor chip, a ring-shaped support disposed on a top side of the first package body, a light permeable member disposed on the ring-shaped support, and a redistribution layer (RDL) disposed on a bottom surface of the sensor chip and a bottom side of the first package body. The sensor chip includes a sensing region arranged on the top surface thereof, a plurality of internal contacts, and a plurality of conductive paths respectively connected to the internal contacts and electrically coupled to the sensing region. The sensing region is spaced apart from the ring-shaped support by a distance less than 300 μm. A bottom surface of the RDL has a plurality of external contacts electrically coupled to the internal contacts.

A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a light emitting unit, a photodiode, a surrounding wall, a light permeable element, and a coating layer. The substrate includes a first surface and a second surface that is opposite to the first surface. The upper electrode layer is disposed on the first surface of the substrate. The light emitting unit and the photodiode both are disposed on the upper electrode layer. The surrounding wall is disposed on the first surface and is arranged to surround the light emitting unit and the photodiode. The light permeable element is disposed on the surrounding wall. The coating layer is disposed inside of the surrounding wall and is coated on a part of the first surface and a part of the upper electrode layer.

A microneedle structure and a biodegradable microneedle thereof are provided. The biodegradable microneedle defining a central axis includes a first step portion and a second step portion that is taperedly extending from the first step portion along the central axis. The biodegradable microneedle has a total height along the central axis and a maximum internal diameter along a direction perpendicular to the central axis. The total height is within a range of 380-430 μm, and an aspect ratio defined by the total height divided by the maximum internal diameter is within a range of 1.2-2.2. In a cross section of the biodegradable microneedle having the central axis, a part of the second step portion arranged away from the first step portion having a corner. The corner has an angle within a range of 65-100 degrees and faces toward the first step portion.

A wind power generation device includes a rotor assembly and a stator. The rotor assembly includes a rotating member, a first magnetic module, and a second magnetic module the latter two of which are fixed on the rotating member. The rotating member has a column and a spiral blade connected to the column. The first and second magnetic modules are arranged outside the spiral blade and face each other. The rotor assembly defines an annular gap formed around the spiral blade and between the first and second magnetic modules. The stator assembly includes a frame, a positioning member connected to the frame, and an induction module fixed on the positioning member and arranged in the annular gap. The spiral blade can rotate the rotator assembly relative to the stator assembly by wind, so that a region between the first and second magnetic module sweeps over the induction module.

A wireless communication device is provided and includes a communication module, a dust and moisture resistant adhesive, and a nano-metallic layer. The communication module includes a circuit board, a communication chip and a plurality of passive components mounted on a carrying surface of the circuit board, and an insulating sheet that is disposed on the passive components and that has a thickness smaller than or equal to 150 μm. The dust and moisture resistant adhesive covers any electrically conductive portions of the communication module on the carrying surface. The nano-metallic layer covers the dust and moisture resistant adhesive, the communication chip, the passive components, and the insulating sheet, and is electrically coupled to a grounding portion of the circuit board. The wireless communication device does not include any grounding metal housing mounted on the circuit board.

An atomization device includes a liquid storing member that stores a liquid therein, a carrier detachably assembled to the liquid storing member, an opener disposed on at least one of the liquid storing member and the carrier, and an atomizing module that is assembled to at least one of the liquid storing member and the carrier. The opener is configured to form an opening on the liquid storing member. The atomization device has a buffering chamber arranged between the atomizing module and the opening of the liquid storing member, and a volume of the buffering chamber is less than a volume of the liquid. The liquid storing member can be pressed to change an inner pressure thereof, such that a part of the liquid is driven to flow from the opening into the buffering chamber for an atomizing process of the atomizing module. The buffering chamber can receive the liquid stored in the liquid storing member over multiple times, such that the atomization device can atomize the liquid over multiple times through the buffering chamber.

An antenna device is provided. The antenna device includes an antenna layer, a first transparent layer, and a second transparent layer. The antenna layer is a metal mesh structure having a plurality of thru-holes, and the antenna layer includes at least one soldering region and an embedded region. The first transparent layer and the second transparent layer are respectively connected to two opposite sides of the antenna layer. The first transparent layer and the second transparent layer are connected to each other, so that the embedded region of the antenna layer is embedded in-between the first transparent layer and the second transparent layer. The second transparent layer has a hollow region corresponding in position to the at least one soldering region, so that the at least one soldering region is exposed from the hollow region.

A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer and a lower electrode layer respectively disposed on two sides of the substrate, a light emitting unit mounted on the upper electrode layer, a surrounding wall disposed on the substrate and arranged to surround the light emitting unit, a conductive unit disposed on the surrounding wall and electrically connected to the lower electrode layer, a light permeable element disposed on the surrounding wall, a detection circuit formed on the light permeable element, and at least one conductive adhesive. The conductive adhesive includes a colloid and a plurality of fillers mixed with the colloid. The colloid and the fillers of the conductive adhesive are partially filled within the gap.