30results about How to "Effectively improve on the issues" patented technology

A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a padding layer disposed on the substrate, a plurality of wires, a support, and a light-permeable layer disposed on the support. A top side of the padding layer is coplanar with a top surface of the sensor chip, the support is disposed on the top side of the padding layer and the top surface of the sensor chip, and the wires are embedded in the support. Terminals at one end of the wires are connected to the top surface of the sensor chip, and terminals at the other end of the wires are connected to the top side of the padding layer, so that the sensor chip can be electrically coupled to the substrate through the wires and the padding layer.

An automatic battery replacement apparatus, a moving platform, and a rechargeable battery are provided. The moving platform includes a movable carrier and the rechargeable battery assembled in the movable carrier. The movable carrier includes a carrying body and a moving component that is assembled to the carrying body. The carrying body has a power supply slot recessed in an outer surface thereof, and an inner lateral wall of the power supply slot is in a shape of an arc having a central angle that is less than or equal to 180 degrees. The moving component is configured to move on a working surface. The rechargeable battery has a matching structure configured to be engaged with a driving gear. The rechargeable battery is configured to be rotated along the inner lateral wall of the power supply slot by having the matching structure engaged with the driving gear.

A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a surrounding wall, a light emitting unit, an adhesive, and a light permeable element. The surrounding wall is annular with step structure and includes an upper tread surface arranged away from the substrate, an upper riser surface connected to an inner edge of the upper tread surface, a lower tread surface disposed at an inner side of the upper riser surface, an accommodating groove disposed between the lower tread surface and the upper riser surface, and a lower riser surface connected to an inner edge of the lower tread surface and arranged away from the upper tread surface. The lower riser surface and the first surface jointly define a receiving space.

A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a light emitting unit, a photodiode, a surrounding wall, a light permeable element, and a coating layer. The substrate includes a first surface and a second surface that is opposite to the first surface. The upper electrode layer is disposed on the first surface of the substrate. The light emitting unit and the photodiode both are disposed on the upper electrode layer. The surrounding wall is disposed on the first surface and is arranged to surround the light emitting unit and the photodiode. The light permeable element is disposed on the surrounding wall. The coating layer is disposed inside of the surrounding wall and is coated on a part of the first surface and a part of the upper electrode layer.

A wireless communication device is provided and includes a communication module, a dust and moisture resistant adhesive, and a nano-metallic layer. The communication module includes a circuit board, a communication chip and a plurality of passive components mounted on a carrying surface of the circuit board, and an insulating sheet that is disposed on the passive components and that has a thickness smaller than or equal to 150 μm. The dust and moisture resistant adhesive covers any electrically conductive portions of the communication module on the carrying surface. The nano-metallic layer covers the dust and moisture resistant adhesive, the communication chip, the passive components, and the insulating sheet, and is electrically coupled to a grounding portion of the circuit board. The wireless communication device does not include any grounding metal housing mounted on the circuit board.

An atomization device includes a liquid storing member that stores a liquid therein, a carrier detachably assembled to the liquid storing member, an opener disposed on at least one of the liquid storing member and the carrier, and an atomizing module that is assembled to at least one of the liquid storing member and the carrier. The opener is configured to form an opening on the liquid storing member. The atomization device has a buffering chamber arranged between the atomizing module and the opening of the liquid storing member, and a volume of the buffering chamber is less than a volume of the liquid. The liquid storing member can be pressed to change an inner pressure thereof, such that a part of the liquid is driven to flow from the opening into the buffering chamber for an atomizing process of the atomizing module. The buffering chamber can receive the liquid stored in the liquid storing member over multiple times, such that the atomization device can atomize the liquid over multiple times through the buffering chamber.

A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer and a lower electrode layer respectively disposed on two sides of the substrate, a light emitting unit mounted on the upper electrode layer, a surrounding wall disposed on the substrate and arranged to surround the light emitting unit, a conductive unit disposed on the surrounding wall and electrically connected to the lower electrode layer, a light permeable element disposed on the surrounding wall, a detection circuit formed on the light permeable element, and at least one conductive adhesive. The conductive adhesive includes a colloid and a plurality of fillers mixed with the colloid. The colloid and the fillers of the conductive adhesive are partially filled within the gap.