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30results about How to "Effectively improve on the issues" patented technology
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Wind power generation device
ActiveUS20200018286A1Effectively improve on the issuesEfficient use ofMagnetic circuit rotating partsMagnetic circuit stationary partsSpiral bladeControl theory
A wind power generation device includes a rotor assembly and a stator. The rotor assembly includes a rotating member, a first magnetic module, and a second magnetic module the latter two of which are fixed on the rotating member. The rotating member has a column and a spiral blade connected to the column. The first and second magnetic modules are arranged outside the spiral blade and face each other. The rotor assembly defines an annular gap formed around the spiral blade and between the first and second magnetic modules. The stator assembly includes a frame, a positioning member connected to the frame, and an induction module fixed on the positioning member and arranged in the annular gap. The spiral blade can rotate the rotator assembly relative to the stator assembly by wind, so that a region between the first and second magnetic module sweeps over the induction module.
Owner:HERO POWER TECH CORP
Sensor package structure
PendingUS20210305437A1Improvement have become issueEffectively improve on the issuesSolid-state devicesSemiconductor devicesPhysicsSolder mask
A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 μm. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
Owner:TONG HSING ELECTRONICS INDS
Light source package structure
ActiveUS20200357934A1Effectively improve on the issuesLaser detailsSemiconductor lasersPhotodiodeMaterials science
A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a light emitting unit, a photodiode, a surrounding wall, a light permeable element, and a coating layer. The substrate includes a first surface and a second surface that is opposite to the first surface. The upper electrode layer is disposed on the first surface of the substrate. The light emitting unit and the photodiode both are disposed on the upper electrode layer. The surrounding wall is disposed on the first surface and is arranged to surround the light emitting unit and the photodiode. The light permeable element is disposed on the surrounding wall. The coating layer is disposed inside of the surrounding wall and is coated on a part of the first surface and a part of the upper electrode layer.
Owner:LITE ON OPTO TECH (CHANGZHOU) CO LTD +1
Wind power generation apparatus
ActiveUS20220034299A1Effectively improve on the issuesWind motor controlEngine fuctionsRotational axisEddy current
A wind power generation apparatus includes a rotating shaft, a wind power generation device assembled to the rotating shaft, and an acceleration restriction mechanism. The wind power generation device includes a drag blade fixed on the rotating shaft, an inner housing connected to an outer edge of the drag blade, and an outer housing sleeved around the inner housing. The acceleration restriction mechanism includes a plurality of swing arms pivotally connected to the inner housing and a metal ring fixed on the outer housing. A magnetic portion of each swing arm is movable relative to the inner housing from an initial position to an acceleration restriction position. When the magnetic portion of each swing arm is at the acceleration restriction position, the magnetic portion at least partially covers the metal ring, so that the metal ring generates an eddy current limiting a rotating acceleration of the drag blade.
Owner:HERO POWER TECH CORP
Wireless communication device
ActiveUS20210399413A1Effectively improve on the issuesReduce thicknessMagnetic/electric field screeningAntenna supports/mountingsMetallic enclosureAdhesive
A wireless communication device is provided and includes a communication module, a dust and moisture resistant adhesive, and a nano-metallic layer. The communication module includes a circuit board, a communication chip and a plurality of passive components mounted on a carrying surface of the circuit board, and an insulating sheet that is disposed on the passive components and that has a thickness smaller than or equal to 150 μm. The dust and moisture resistant adhesive covers any electrically conductive portions of the communication module on the carrying surface. The nano-metallic layer covers the dust and moisture resistant adhesive, the communication chip, the passive components, and the insulating sheet, and is electrically coupled to a grounding portion of the circuit board. The wireless communication device does not include any grounding metal housing mounted on the circuit board.
Owner:ANHUI HAIHUA CHEM
Light source package structure
ActiveUS10816176B1Effectively improve on the issuesReliable electrical connectionElectric circuit arrangementsSemiconductor devices for light sourcesHemt circuitsElectrically conductive adhesive
A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer and a lower electrode layer respectively disposed on two sides of the substrate, a light emitting unit mounted on the upper electrode layer, a surrounding wall disposed on the substrate and arranged to surround the light emitting unit, a conductive unit disposed on the surrounding wall and electrically connected to the lower electrode layer, a light permeable element disposed on the surrounding wall, a detection circuit formed on the light permeable element, and at least one conductive adhesive. The conductive adhesive includes a colloid and a plurality of fillers mixed with the colloid. The colloid and the fillers of the conductive adhesive are partially filled within the gap.
Owner:LITE ON OPTO TECH (CHANGZHOU) CO LTD +1
Sensor package structure
PendingUS20220328547A1Effectively improve on the issuesEasy to crackSemiconductor/solid-state device detailsSolid-state devicesMaterials scienceElectric wire
A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically coupled to the substrate and the sensor chip, a light-permeable layer, and a colloid formed on the substrate to fix the light-permeable layer. The colloid covers the wires, a peripheral portion of the sensor chip, and lateral surfaces of the light-permeable layer. A top curved surface of the colloid is partially arranged beside the lateral surfaces. In a cross section of the sensor package structure, the top curved surface has a reference point spaced apart from one of the lateral surfaces adjacent thereto by 100 μm, a top edge of the top curved surface and the reference point define a connection line, and the connection line and the one of the lateral surfaces have an acute angle within a range from 25 degrees to 36 degrees.
Owner:TONG HSING ELECTRONICS INDS
Projecting apparatus
ActiveUS20210373419A1Effectively improve on the issuesHigh dimensionalProjectorsSolid-state devicesFlexible circuitsMicroelectromechanical systems
A projecting apparatus is provided, and includes a frame, a light source module, and a microelectromechanical systems (MEMS) module. The frame includes two lateral boards respectively arranged on two opposite sides thereof, and a transverse beam that connects the two lateral boards. Each of the two lateral boards has a guiding slot recessed in a portion thereof. The MEMS module is configured to transmit light emitted from the light source module, and includes a flexible circuit board, a first MEMS unit, and a second MEMS unit, the latter two of which are connected to the flexible circuit board. The first MEMS unit is inserted into the guiding slots of the two lateral boards. The second MEMS unit abuts against the two lateral boards and / or the transverse beam. The first MEMS unit and the second MEMS unit have a predetermined angle there-between by the second frame portion.
Owner:MEGA 1 CO LTD
Sensor package structure
ActiveUS11309275B2Effectively improve on the issuesResulted differenceSemiconductor/solid-state device detailsSolid-state devicesEngineeringMaterials science
A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a padding layer disposed on the substrate, a plurality of wires, a support, and a light-permeable layer disposed on the support. A top side of the padding layer is coplanar with a top surface of the sensor chip, the support is disposed on the top side of the padding layer and the top surface of the sensor chip, and the wires are embedded in the support. Terminals at one end of the wires are connected to the top surface of the sensor chip, and terminals at the other end of the wires are connected to the top side of the padding layer, so that the sensor chip can be electrically coupled to the substrate through the wires and the padding layer.
Owner:TONG HSING ELECTRONICS IND LTD
External electromagnetic shielding device
ActiveUS11445647B2Effectively improve on the issuesEffectively maintain heat dissipation efficiencyScreening rooms/chambersInstrument screening arrangementsClassical mechanicsStructural engineering
An external electromagnetic shielding device is provided. The external electromagnetic shielding device includes a bottom shield, a conductive cover being in a grid-like shape and arranged above the bottom shield, and a rolling module. The conductive cover includes a top shield spaced apart from the bottom shield, a lateral shield connected to the top shield, and a plurality of supports that are fixed to the lateral shield. The supports include a bottom support in an annular arrangement, and any two of the supports are spaced apart from each other. The rolling module includes a rolling unit and a linkage unit that is connected to the rolling unit and the bottom support. When the linkage unit is coiled on or released from the rolling unit, the bottom support can be moved to allow the lateral shield to fold or unfold between the bottom shield and the top shield.
Owner:ADIVIC TECH CO LTD
Automatic battery replacement apparatus, moving platform, and rechargeable battery
PendingUS20220176844A1Refining issueEffectively improve on the issuesCharging stationsSuction cleanersRechargeable cellMechanical engineering
Owner:ALICORP
Projecting apparatus
ActiveUS11402733B2Effectively improve on the issuesEasy to assembleProjectorsSolid-state devicesAdhesiveEngineering
A projecting apparatus is provided, and includes a frame, a light source module, at least one collimator lens, at least one adhesive, and a microelectromechanical systems (MEMS) module. The frame includes a first frame portion and a second frame portion. The first frame portion has a carrier and a carrying bridge having an end connected to the carrier. The frame has a processing slot that uses the carrying bridge as a bottom thereof, and the carrying bridge has at least one thru-hole that is in spatial communication with the processing slot. The second frame portion is connected to the carrier and another end of the carrying bridge of the first frame portion. The at least one adhesive corresponds in position to the at least one thru-hole, and connects the at least one collimator lens onto the carrying bridge. The MEMS module is disposed on the second frame portion.
Owner:MEGA 1 CO LTD
Light source package structure
ActiveUS11289880B2Effectively improve on the issuesLess polar groupLiquid crystal compositionsLaser detailsEngineeringMaterials science
A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a surrounding wall, a light emitting unit, an adhesive, and a light permeable element. The surrounding wall is annular with step structure and includes an upper tread surface arranged away from the substrate, an upper riser surface connected to an inner edge of the upper tread surface, a lower tread surface disposed at an inner side of the upper riser surface, an accommodating groove disposed between the lower tread surface and the upper riser surface, and a lower riser surface connected to an inner edge of the lower tread surface and arranged away from the upper tread surface. The lower riser surface and the first surface jointly define a receiving space.
Owner:LITE ON OPTO TECH (CHANGZHOU) CO LTD +1
Microneedle structure and biodegradable microneedle thereof
ActiveUS20200360678A1Refining issueEffectively improve on the issuesMicroneedlesMedical devicesSurgeryBiology
A microneedle structure and a biodegradable microneedle thereof are provided. The biodegradable microneedle defining a central axis includes a first step portion and a second step portion that is taperedly extending from the first step portion along the central axis. The biodegradable microneedle has a total height along the central axis and a maximum internal diameter along a direction perpendicular to the central axis. The total height is within a range of 380-430 μm, and an aspect ratio defined by the total height divided by the maximum internal diameter is within a range of 1.2-2.2. In a cross section of the biodegradable microneedle having the central axis, a part of the second step portion arranged away from the first step portion having a corner. The corner has an angle within a range of 65-100 degrees and faces toward the first step portion.
Owner:MICRO BASE TECH CORP
Antenna device
ActiveUS20220238990A1Refining issueEffectively improve on the issuesRadiating elements structural formsEngineering physicsMaterials science
An antenna device is provided. The antenna device includes an antenna layer, a first transparent layer, and a second transparent layer. The antenna layer is a metal mesh structure having a plurality of thru-holes, and the antenna layer includes at least one soldering region and an embedded region. The first transparent layer and the second transparent layer are respectively connected to two opposite sides of the antenna layer. The first transparent layer and the second transparent layer are connected to each other, so that the embedded region of the antenna layer is embedded in-between the first transparent layer and the second transparent layer. The second transparent layer has a hollow region corresponding in position to the at least one soldering region, so that the at least one soldering region is exposed from the hollow region.
Owner:WISTRON NEWEB
Electronic device
PendingUS20220115837A1Refining issueEffectively improve on the issuesLaser detailsSemiconductor lasersEngineering physicsSemiconductor
An electronic device is provided. The electronic device includes a substrate, a semiconductor unit, a wall, and a light-transmitting member. The semiconductor unit is mounted on the substrate. The wall is disposed on the substrate and surrounds the semiconductor unit. The wall includes two exterior wall components and two interior wall components. The two exterior wall components are spaced apart from each other, so that two gaps are formed between the two exterior wall components. The two gaps are in spatial communication with an installation area that is surrounded by the two exterior wall components. The two interior wall components are arranged in the installation area and spaced apart from each other. The two interior wall components correspond in position to the two gaps and respectively shade parts of the two gaps. The light-transmitting member is disposed on the wall and covered on the semiconductor unit.
Owner:LITE ON TECH CORP
Light source package structure
ActiveUS20200358250A1Effectively improve on the issuesLess polar groupLiquid crystal compositionsLaser detailsEngineeringMaterials science
A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a surrounding wall, a light emitting unit, an adhesive, and a light permeable element. The surrounding wall is annular with step structure and includes an upper tread surface arranged away from the substrate, an upper riser surface connected to an inner edge of the upper tread surface, a lower tread surface disposed at an inner side of the upper riser surface, an accommodating groove disposed between the lower tread surface and the upper riser surface, and a lower riser surface connected to an inner edge of the lower tread surface and arranged away from the upper tread surface. The lower riser surface and the first surface jointly define a receiving space.
Owner:LITE ON OPTO TECH (CHANGZHOU) CO LTD +1
Sensor package structure
ActiveUS20210398934A1Effectively improve on the issuesResulted differenceSemiconductor/solid-state device detailsSolid-state devicesMaterials scienceElectric wire
A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a padding layer disposed on the substrate, a plurality of wires, a support, and a light-permeable layer disposed on the support. A top side of the padding layer is coplanar with a top surface of the sensor chip, the support is disposed on the top side of the padding layer and the top surface of the sensor chip, and the wires are embedded in the support. Terminals at one end of the wires are connected to the top surface of the sensor chip, and terminals at the other end of the wires are connected to the top side of the padding layer, so that the sensor chip can be electrically coupled to the substrate through the wires and the padding layer.
Owner:TONG HSING ELECTRONICS IND LTD
Chip-scale sensor package structure
ActiveUS20210305304A1Effectively improve on the issuesSolid-state devicesSemiconductor/solid-state device manufacturingRedistribution layerEngineering
A chip-scale sensor package structure includes a sensor chip, a first package body surrounding and connected to an outer lateral side of the sensor chip, a ring-shaped support disposed on a top side of the first package body, a light permeable member disposed on the ring-shaped support, and a redistribution layer (RDL) disposed on a bottom surface of the sensor chip and a bottom side of the first package body. The sensor chip includes a sensing region arranged on the top surface thereof, a plurality of internal contacts, and a plurality of conductive paths respectively connected to the internal contacts and electrically coupled to the sensing region. The sensing region is spaced apart from the ring-shaped support by a distance less than 300 μm. A bottom surface of the RDL has a plurality of external contacts electrically coupled to the internal contacts.
Owner:TONG HSING ELECTRONICS IND LTD
Vehicle lighting device
InactiveUS20220097602A1Improvement have become issueEffectively improve on the issuesMechanical apparatusLighting circuitsPhysicsElectrically conductive
A vehicle lighting device is provided. The vehicle lighting device includes a main body and a connecting unit. The main body has an upper film, a lower film, a light guide filler, and at least one lower light-emitting element. The upper film has a setting area and a light-permeable layer at a center of the setting area. A distance spaced apart between an edge of the light-permeable layer and an edge of the setting region is no more than 5 cm. The at least one lower light-emitting element is embedded in the light guide filler arranged between the lower film and the upper film and is located on a part of the setting region defined by orthogonally projecting the lower conductive layer onto the setting region. The connecting unit can electrically connect to a control circuit to control the at least one lower light-emitting element.
Owner:ICHIA TECH
Light source package structure
ActiveUS11205731B2Effectively improve on the issuesLaser detailsSemiconductor lasersEngineeringPhotodiode
A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a light emitting unit, a photodiode, a surrounding wall, a light permeable element, and a coating layer. The substrate includes a first surface and a second surface that is opposite to the first surface. The upper electrode layer is disposed on the first surface of the substrate. The light emitting unit and the photodiode both are disposed on the upper electrode layer. The surrounding wall is disposed on the first surface and is arranged to surround the light emitting unit and the photodiode. The light permeable element is disposed on the surrounding wall. The coating layer is disposed inside of the surrounding wall and is coated on a part of the first surface and a part of the upper electrode layer.
Owner:LITE ON OPTO TECH (CHANGZHOU) CO LTD +1
Microneedle structure and biodegradable microneedle thereof
ActiveUS11433225B2Effectively improve on the issuesImprove structural strengthMicroneedlesMedical devicesSurgeryBiology
A microneedle structure and a biodegradable microneedle thereof are provided. The biodegradable microneedle defining a central axis includes a first step portion and a second step portion that is taperedly extending from the first step portion along the central axis. The biodegradable microneedle has a total height along the central axis and a maximum internal diameter along a direction perpendicular to the central axis. The total height is within a range of 380-430 μm, and an aspect ratio defined by the total height divided by the maximum internal diameter is within a range of 1.2-2.2. In a cross section of the biodegradable microneedle having the central axis, a part of the second step portion arranged away from the first step portion having a corner. The corner has an angle within a range of 65-100 degrees and faces toward the first step portion.
Owner:MICRO BASE TECH CORP
Wind power generation device
ActiveUS11493025B2Effectively improve on the issuesEfficient use ofMagnetic circuit stationary partsWind motor combinationsSpiral bladeControl theory
A wind power generation device includes a rotor assembly and a stator. The rotor assembly includes a rotating member, a first magnetic module, and a second magnetic module the latter two of which are fixed on the rotating member. The rotating member has a column and a spiral blade connected to the column. The first and second magnetic modules are arranged outside the spiral blade and face each other. The rotor assembly defines an annular gap formed around the spiral blade and between the first and second magnetic modules. The stator assembly includes a frame, a positioning member connected to the frame, and an induction module fixed on the positioning member and arranged in the annular gap. The spiral blade can rotate the rotator assembly relative to the stator assembly by wind, so that a region between the first and second magnetic module sweeps over the induction module.
Owner:HERO POWER TECH CORP
External electromagnetic shielding device
ActiveUS20220240424A1Maintain heat dissipate efficiencyEffectively improve on the issuesScreening rooms/chambersInstrument screening arrangementsElectrically conductiveStructural engineering
An external electromagnetic shielding device is provided. The external electromagnetic shielding device includes a bottom shield, a conductive cover being in a grid-like shape and arranged above the bottom shield, and a rolling module. The conductive cover includes a top shield spaced apart from the bottom shield, a lateral shield connected to the top shield, and a plurality of supports that are fixed to the lateral shield. The supports include a bottom support in an annular arrangement, and any two of the supports are spaced apart from each other. The rolling module includes a rolling unit and a linkage unit that is connected to the rolling unit and the bottom support. When the linkage unit is coiled on or released from the rolling unit, the bottom support can be moved to allow the lateral shield to fold or unfold between the bottom shield and the top shield.
Owner:ADIVIC TECH CO LTD
Wireless communication device
ActiveUS11309626B2Effectively improve on the issuesReduce thicknessMagnetic/electric field screeningAntenna supports/mountingsAdhesiveCommunication device
A wireless communication device is provided and includes a communication module, a dust and moisture resistant adhesive, and a nano-metallic layer. The communication module includes a circuit board, a communication chip and a plurality of passive components mounted on a carrying surface of the circuit board, and an insulating sheet that is disposed on the passive components and that has a thickness smaller than or equal to 150 μm. The dust and moisture resistant adhesive covers any electrically conductive portions of the communication module on the carrying surface. The nano-metallic layer covers the dust and moisture resistant adhesive, the communication chip, the passive components, and the insulating sheet, and is electrically coupled to a grounding portion of the circuit board. The wireless communication device does not include any grounding metal housing mounted on the circuit board.
Owner:AZUREWAVE TEHNOLOGIES INC
Atomization device
PendingUS20220211956A1Effectively improve on the issuesMedical devicesMedical applicatorsSoftware engineeringLiquid storage
Owner:MICRO BASE TECH CORP
Antenna device
ActiveUS11417948B1Effectively improve on the issuesWide applicationRadiating elements structural formsEngineering physicsMaterials science
An antenna device is provided. The antenna device includes an antenna layer, a first transparent layer, and a second transparent layer. The antenna layer is a metal mesh structure having a plurality of thru-holes, and the antenna layer includes at least one soldering region and an embedded region. The first transparent layer and the second transparent layer are respectively connected to two opposite sides of the antenna layer. The first transparent layer and the second transparent layer are connected to each other, so that the embedded region of the antenna layer is embedded in-between the first transparent layer and the second transparent layer. The second transparent layer has a hollow region corresponding in position to the at least one soldering region, so that the at least one soldering region is exposed from the hollow region.
Owner:WISTRON NEWEB
Light source package structure
ActiveUS20200355357A1Effectively improve on the issuesReliable electrical connectionElectric circuit arrangementsSemiconductor devices for light sourcesHemt circuitsElectrically conductive adhesive
A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer and a lower electrode layer respectively disposed on two sides of the substrate, a light emitting unit mounted on the upper electrode layer, a surrounding wall disposed on the substrate and arranged to surround the light emitting unit, a conductive unit disposed on the surrounding wall and electrically connected to the lower electrode layer, a light permeable element disposed on the surrounding wall, a detection circuit formed on the light permeable element, and at least one conductive adhesive. The conductive adhesive includes a colloid and a plurality of fillers mixed with the colloid. The colloid and the fillers of the conductive adhesive are partially filled within the gap.
Owner:LITE ON OPTO TECH (CHANGZHOU) CO LTD +1
Lighting touchpad
ActiveUS20220326801A1Effectively improve on the issuesChange of lightSolid-state devicesInput/output processes for data processingElectrical conductorTouchpad
A lighting touchpad is provided, which includes a substrate module, a plurality of sensing electrodes, a plurality of driving electrodes, a plurality of light emitting diode (LED) chips mounted on the substrate module, and a controller. The driving electrodes and the sensing electrodes are formed on the substrate module and are respectively located at different height positions. The driving electrodes define a distribution space that extends along a normal direction of the substrate module. The LED dies are arranged in the distribution space. The controller is electrically coupled to the sensing electrodes, the driving electrodes, and the LED dies through the substrate module. When a coupling capacity is generated between a conductor and at least one of the sensing electrodes, the controller is configured to drive at least one of the LED dies adjacent to the at least one of the sensing electrodes to emit light.
Owner:PIXART IMAGING INC
Projecting apparatus
ActiveUS20210373420A1Effectively improve on the issuesEasy to assembleProjectorsMountingsCollimatorEngineering
A projecting apparatus is provided, and includes a frame, a light source module, at least one collimator lens, at least one adhesive, and a microelectromechanical systems (MEMS) module. The frame includes a first frame portion and a second frame portion. The first frame portion has a carrier and a carrying bridge having an end connected to the carrier. The frame has a processing slot that uses the carrying bridge as a bottom thereof, and the carrying bridge has at least one thru-hole that is in spatial communication with the processing slot. The second frame portion is connected to the carrier and another end of the carrying bridge of the first frame portion. The at least one adhesive corresponds in position to the at least one thru-hole, and connects the at least one collimator lens onto the carrying bridge. The MEMS module is disposed on the second frame portion.
Owner:MEGA 1 CO LTD
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