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Photo-curable and heat-curable resin composition

A resin composition and photocurable technology, which is applied in the field of photocurable thermosetting resin composition, can solve problems such as difficulty in removing impurities, and achieve the effects of improving hydrophobicity, excellent insulation reliability, and improving electrical properties

Active Publication Date: 2014-04-30
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Common epoxy acrylate modified resins almost all of the epoxy resins used as raw materials contain a lot of chloride ion impurities. After epoxy acrylate modification, it is very difficult to remove the impurities.

Method used

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  • Photo-curable and heat-curable resin composition
  • Photo-curable and heat-curable resin composition
  • Photo-curable and heat-curable resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0167] Examples and comparative examples are shown below to specifically describe the present invention, but the present invention is not limited to the following examples. In addition, the following "parts" and "%", unless otherwise specified, all refer to quality standards.

Synthetic example 1

[0169] In an autoclave equipped with a thermometer, a nitrogen introduction device, an alkylene oxide introduction device, and a stirring device, 119.4 g of novolac type cresol resin (manufactured by Showa Polymer Corporation, trade name "Shonol CRG951", OH equivalent: 119.4) is added, 1.19 g of potassium hydroxide and 119.4 g of toluene were replaced with nitrogen in the system while stirring, and heated. Then, slowly add 63.8g of propylene oxide dropwise, at 125~132℃, 0~4.8kg / cm 2 React for 16 hours. Then, it was cooled to room temperature, and 1.56 g of 89% phosphoric acid was added and mixed in the reaction solution to neutralize potassium hydroxide to obtain a novolac type cresol resin epoxy with 62.1% non-volatile content and 182.2 g / eq. of hydroxyl value. Propane reaction liquid. This is a substance in which 1.08 moles of alkylene oxide are added on average per 1 equivalent of phenolic hydroxyl group.

[0170] Next, 293.0 g of the obtained novolak type cresol resin alkyl...

Synthetic example 2

[0172] In a 5-liter separable flask equipped with a thermometer, a stirrer, and a reflux condenser, 1245 g of polycaprolactone diol (PLACCEL208 manufactured by DDAICEL CHEMICAL INDUSTRIES, LTD., molecular weight 830) as a polymer polyol, and 201 g were put into Dimethylolpropionic acid as a dihydroxy compound having a carboxyl group, 777 g of isophorone diisocyanate as a polyisocyanate, and 119 g of 2-hydroxyethyl acrylate as a (meth)acrylate having a hydroxyl group, and 0.5 g each Of p-methoxyphenol and di-tert-butyl-hydroxytoluene. While stirring, it was heated to 60°C to stop, and 0.8 g of dibutyltin dilaurate was added. If the temperature in the reaction vessel starts to decrease, heat it again, continue stirring at 80°C, and confirm the absorption spectrum of the isocyanate group in the infrared absorption spectrum (2280cm -1 When) disappears, the reaction is stopped, and a viscous liquid urethane acrylate compound is obtained. Carbitol acetate was used to adjust to non-v...

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Abstract

Disclosed are: a photo-curable and heat-curable resin composition which enables the formation of a cured coating film having excellent insulation reliability and chemical resistance and also having PCT resistance, HAST resistance and electroless gold plating resistance that are important for a solder resist for a semiconductor package; a dried film and a cured product of the composition; and a printed circuit board having, formed thereon, a cured coating film such (e.g., a solder resist) produced from the composition or the dried film. Specifically disclosed is a photo-curable and heat-curable resin composition which can be developed with a dilute aqueous alkaline solution. The resin composition comprises a carboxyl-group-containing resin (excluding a carboxyl-group-containing resin produced using an epoxy resin as a starting raw material), a photopolymerization initiator, and an amino resin having an alkoxymethyl group. The carboxyl-group-containing resin preferably contains no hydroxy group, and more preferably contains a photosensitive group. A preferred embodiment of the photo-curable and heat-curable resin composition additionally contains a heat-curable component, and preferably additionally contains a coloring agent.

Description

Technical field [0001] The present invention relates to a photocurable thermosetting resin composition that can be developed by a dilute alkali aqueous solution, and in particular to a solder resist composition that is photocured by ultraviolet exposure or laser exposure, its dry film and cured product, and a composition formed by using them Printed circuit board with cured film. Background technique [0002] At present, from the viewpoint of high precision and high density, the solder resist for some consumer printed circuit boards and most industrial printed circuit boards uses image formation by developing after ultraviolet irradiation and heat and / or light irradiation. For the final cured (fully cured) liquid developing solder resist, based on concerns about environmental issues, the alkaline developing photoresist using a dilute aqueous alkali solution as the developer has become the mainstream, and is used in the actual printed circuit board manufacturing Is used a lot. I...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/038C08G8/30C08G18/67G03F7/004H05K3/28
CPCH05K3/287C08G59/4246C08G59/027C08L63/00G03F7/0388
Inventor 伊藤信人有马圣夫
Owner TAIYO HLDG CO LTD
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