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A method for metallizing the surface of a ceramic substrate and a high-power LED base

A technology of LED base and ceramic substrate, which is applied in the parts of lighting device, cooling/heating device of lighting device, lighting auxiliary device, etc., can solve the problem of poor density and thermal conductivity of ceramic substrate, complex metallization process, and coating The problem of low bonding force with the ceramic substrate can achieve the effect of low cost, simple preparation process and good density.

Active Publication Date: 2015-11-25
BYD CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to solve the problems of complex metallization process on the surface of the ceramic substrate, low bonding force between the coating layer and the ceramic substrate, and poor density and thermal conductivity of the ceramic substrate in the prior art, the present invention provides a method for metallizing the surface of the ceramic substrate, which The specific steps are:

Method used

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  • A method for metallizing the surface of a ceramic substrate and a high-power LED base

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preparation example Construction

[0022] The preparation method of ceramic substrate of the present invention is illustrated as follows:

[0023] First prepare the glassy functional additive powder, select two or more of the oxides of A, A is aluminum, magnesium, silicon, barium, calcium, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper , zinc, niobium, molybdenum, technetium, ruthenium, rhodium, palladium, silver, cadmium, tantalum, tungsten, rhenium, osmium, iridium, platinum, gold, indium, tin, antimony, lead or bismuth, two or more A The oxides are mixed in a certain proportion and dispersed by ball milling, for example, to prepare TiO 2 / CuO's glassy functional additive is TiO 2 Mix with CuO at a mass ratio of 1:1 or 1:2, the glassy functional additive of CaO / CoO is to mix CaO and CoO at a mass ratio of 1:1 or 1:2, Fe 2 o 3 The functional additive of / FeO / MgO is Fe 2 o 3 , FeO and MgO are mixed in a mass ratio of 1:1:1 or 1:2:1, FeO / SiO 2 / Fe 2 o 3 The glassy functional additi...

Embodiment 1

[0036] First prepare ceramic substrate, the concrete composition of described ceramic substrate is: the Al of 96wt% 2 o 3 Ceramic body, 0.5wt% CuO / TiO functional aid, wherein the mass ratio of CuO to TiO is 1:1, and 3.5wt% sintering aid, said sintering aid is Y 2 o 3 The mixture mixed with MgO at a mass ratio of 3:1. The green body is prepared by tape casting and sintered; the specific method is as follows, first, 100g of the above-mentioned ceramic substrate powder, 50g of solvent (mixed with ethanol and xylene at a mass ratio of 1:1), and dispersant (glyceryl trioleate) Put 3g into a ball mill for 12 hours of ball milling. After the ball milling, add 6g of binder (PVB) and 5g of plasticizer (polyethylene glycol and dibutyl phthalate in a mass ratio of 1:1) Mixing), and 0.1g defoamer for secondary ball milling, the ball milling time is 16h; after ball milling, filter and carry out vacuum degassing for 25min, then cast the obtained slurry under the tape casting machine, and...

Embodiment 2

[0038] In this example, the functional additive is CaO / CoO glassy powder accounting for 0.5wt% of the total weight of the ceramic substrate, wherein the mass ratio of CaO to CoO is 1:1; other processes are the same as in Example 1.

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Abstract

The invention provides a method for metalizing a ceramic substrate surface and a high-power LED base manufactured by the method. The method comprises the following steps of: adding a function auxiliary in a ceramic substrate, the function auxiliary is glass state powder composed of two or more of oxides selected from A, wherein A is aluminum, magnesium, silicon, barium, calcium, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, niobium, molybdenum, technetium, ruthenium, rhodium, palladium, silver, cadmium, tantalum, tungsten, rhenium, osmium, iridium, platinum, gold, indium, tin, antimony, lead or bismuth; the density and heat conductivity of the ceramic substrate are greatly improved by the added glass state function auxiliary; meanwhile, the adsorption of the ceramic substrate to an energy beam is enhanced, the chemical plating can be performed by directly activating the surface of the ceramic substrate through the energy beam with low power so as to form a metal layer, and the metal layer is strongly combined with the ceramic substrate.

Description

technical field [0001] The invention belongs to the field of manufacturing LED ceramic substrates, and in particular relates to a method for surface metallization of high-power LED ceramic heat dissipation substrates. Background technique [0002] Due to the high thermal conductivity and electrical insulation strength of ceramic materials, and the matching of thermal expansion coefficient with LED chips, currently high-power LEDs mostly use ceramic materials as heat dissipation substrates. This first requires metallization of the surface of the ceramic substrate to form interconnection wires. At present, the metallization method of the ceramic surface in the prior art is complicated in process, and the combination of the metal layer and the ceramic substrate is a deposition veneer combination, and the bonding force is low, and the density and thermal conductivity of the prepared ceramic substrate are not good. [0003] CN1582095 discloses a ceramic substrate interconnection...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B41/51C04B41/88F21V21/00F21V29/50F21Y101/02F21V29/70F21V29/89
Inventor 徐强林信平任永鹏张保祥
Owner BYD CO LTD