The utility model discloses a multi-hole mini-LED membrane die-
cutting tool which comprises a movable sliding block and a
grinding wheel arranged at the bottom of the movable sliding block, a splash-proof plate is arranged on the left side of a
water supply block, two side nozzles are arranged at the bottom of the
water supply block, a sensor support is arranged on the tool, and a sensor is arranged on the sensor support. An adjusting bolt and a fastening bolt are respectively arranged on the sensor support, a main
nozzle is arranged below the tool, a plurality of spraying holes are formed in the side
nozzle, an adjusting window is arranged on one side of the side
nozzle, an inner sleeve rod is arranged in the side nozzle, a knob is arranged in front of the inner sleeve rod, and a
handle is arranged on the knob. An adjusting nozzle is arranged on the inner sleeve rod, a sliding groove is formed in the outer side of the inner sleeve rod, a sliding block is arranged on the inner wall of the side nozzle, and when
water flow is sprayed out of the adjusting nozzle, the sprayed
water flow can directly clean wafers on the platform. Some
silicon crystal chips and
metal chips generated during
abrasive wheel
cutting are prevented from being attached to the surface of the
wafer and the blade, and the
cutting quality is guaranteed.