The invention discloses an
etching device and method applied to
semiconductor chip production, and relates to the related technical field of
chip production. The
etching device comprises a base, an
etching box is arranged at the top of the base, a
photoresist assembly is arranged on the left side of the etching box, a plurality of obliquely-distributed injection holes are formed in the right side of the
photoresist assembly, a plurality of limiting rods are symmetrically arranged on the outer wall of the etching box, sealing plates are arranged on the outer walls of the limiting rods, and telescopic rods are arranged at the corners of the bottom of the inner wall of the etching box. According to the invention, after the
photoresist and the etching liquid are mixed, the photoetching resolution in the
chip etching process is improved, so that the etching definition of the
semiconductor chip is improved, the etching quality is improved, meanwhile, in the continuous movement process of the U-shaped
pipe assembly, the upper and lower
pressure difference of the etching liquid on the right side in the etching box is effectively changed, the time required for comprehensive etching of the chip is shortened, and the etching efficiency is improved. And the etching efficiency is improved.