An improved substrate holder comprises an
electrode supporting a focus ring and a substrate, an insulating member surrounding the
electrode and focus ring, a ground member surrounding the insulating member, and a focus ring surrounding the substrate. The focus ring provides a RF impedance substantially equivalent to a RF impedance of the substrate. A method of
processing a substrate utilizing the improved substrate holder reduces arcing between the edge of the substrate and the focus ring. The method comprises the steps of placing the focus ring on the
electrode, placing the substrate on the electrode and
processing the substrate. Additionally, a method of controlling a focus ring temperature and a substrate temperature utilizing the improved substrate holder comprises the steps of placing the focus ring on the electrode, placing the substrate on the electrode, clamping the focus ring and the substrate to the electrode using an electrostatic clamp, supplying
heat transfer gas(es) to the space residing between the focus ring and the electrode, and the space between the substrate and the electrode, and controlling the temperature of the electrode.