Texturing additive for inverted pyramid textured monocrystalline silicon wafer and application thereof

Abstract

The invention discloses a texturing additive for inverted pyramid textured monocrystalline silicon wafer and application thereof. The texturing additive comprises the following components: a nonionicsurfactant, a cationic surfactant, polyethylene glycol, an organic salt and the balance water. An alkali solution added with the texturing additive provided by the invention can be used for preparation of an inverted pyramid texture on a monocrystalline silicon wafer surface, catalysis of silver, copper and other precious metal ions is not needed, the texturing cost can be lowered, environmental pollution is reduced, therefore the texturing additive is more conducive to the process stability of crystalline silicon solar cells, and has good practical value. By using the alkali solution added with the texturing additive provided by the invention for texturing of a monocrystalline silicon wafer surface, a uniform, fine and dense textured inverted pyramid can be obtained. And the texturing additive provided by the invention does not contain isopropanol or ethanol, has no toxicity, corrosiveness, irritation, also has no burning or explosion hazard, and can avoid environmental pollution. Moreover, the manufacturing and use process of the texturing additive is simple, employs cheap equipment and has good repeatability.

Description

technical field [0001] The invention relates to a texturizing additive for an inverted pyramid textured single crystal silicon wafer and an application thereof. Background technique [0002] In order to improve the performance and efficiency of monocrystalline silicon solar cells, it is necessary to fabricate a textured surface on the surface of the monocrystalline silicon wafer. The effective textured structure can make the incident sunlight reflect and refract multiple times on the surface of the silicon wafer, which not only significantly reduces the The reflectivity of the chip or cell, and change the direction of incident light in the silicon, prolonging the optical path, thereby increasing the absorption rate of the silicon chip for infrared light. [0003] The textured surface of a conventional monocrystalline silicon wafer is a pyramid textured surface formed by etching the surface of a silicon wafer with an alkali solution, and the textured surface has a convex pyra...

AI Technical Summary

Problems solved by technology

Wet chemical etching uses precious metals, which is expensive; and wet chemical etching also uses a large amount of hydrofluoric acid and nitric acid, which puts great pressure on environmental protection and pollution control; in addition, the use of metal catalysis to prepare suede requires strict cleaning of silicon wafers. Remove the nano-metal particles remaining between the textured microstructures, otherwise the nano-metal particles will be brought into the subsequent process (such as diffusion), which is fatal to the silicon wafer itself and the diffusion equipment

[0005] To sum up, the conventional texturing process of monocrystalline silicon wafers based on alkaline solution can only produce convex pyramid textured surfaces on the surface of single crystal silicon wafers, but cannot form inverted pyramid textured textures.

However, the existing monocrystalline silicon wafer wet chemical etching texturing process for forming the textured surface of the inverted pyramid requires the catalysis of silver, copper and other precious metal ions, and the texturing equipment cannot be used for the lye texturing process, and the texturing equipment needs to be replaced equipment

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