A kind of conductive glue, conductive adhesive tape and preparation method thereof
A technology of conductive tape and conductive adhesive, which is applied in the direction of conductive adhesives, adhesives, film/sheet adhesives, etc., which can solve the problems of increased production costs, insufficient shear strength, and copper ions cannot be thoroughly cleaned.
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[0055] Another aspect of the present invention provides a method for preparing a conductive adhesive, comprising the following steps:
[0056] (1) Anti-oxidation treatment method: put copper powder in a polar solvent containing corrosion inhibitors, seal and react in a pressure-resistant container at 20-300 ° C for 0.01-100 hours, wash and dry with water or ethanol, and obtain Antioxidant copper powder, at least one layer of formate is adsorbed on the surface of the dendritic copper powder;
[0057] According to an embodiment of the present invention, the corrosion inhibitor may be selected from at least one of formic acid, formate, etc.; formate may be selected from lithium formate, sodium formate, magnesium formate, aluminum triformate, potassium formate, ammonium formate, formic acid At least one of calcium, zinc formate, iron formate, copper formate, barium formate, beryllium formate, nickel formate, cobalt formate, manganese formate, etc.; polar solvents can be selected f...
Embodiment 1
[0081] According to the method provided by the present invention,
[0082] (1) Preparation of dendritic copper powder: The anode plate (this example is a phosphor copper system) and a cathode plate (this example is a titanium plate system) are placed in the electrolyte for electrolysis, and the dendritic plates obtained on the cathode plate are collected by ultrasonic cooperating with a scraper. Copper powder, wherein the electrolyte is sulfuric acid 180g / L, copper sulfate pentahydrate 160g / L, hydrochloric acid 0.5g / L, the electrolysis temperature is 30~50℃, the plate spacing is 5cm, and the current density is 200mA / cm 2 , collected every 3 minutes;
[0083] (2) Antioxidation treatment: take the dendritic copper powder obtained above, put it in a solution in which the corrosion inhibitor is sodium formate 16g / L, and the polar solvent is N,N-dimethylformamide 0.940g / mL, in The reaction is sealed in a pressure-resistant container, the temperature is 150 ° C, the duration is 18 ...
Embodiment 2
[0093] According to the method provided by the present invention,
[0094] The preparation steps and the selection of materials in Example 2 are the same as those in Example 1, except that in step (3), 50 wt % of antioxidant dendritic copper powder, 23 wt % of polycarbonate modified water-based polyurethane, and 25.8 wt % of solvent are weighed. wt %, silane coupling agent 0.2 wt %, carbodiimide 0.6 wt %, hindered phenol 0.4 wt %, after three-roll grinding treatment, and uniform foaming by a homogenizer at 1500 rpm for 5 min to obtain an antioxidant copper conductive adhesive, The selection of other preparation steps and materials is the same as that in Example 1.
[0095] The performance test of the conductive tape prepared in Example 2 was carried out, its thickness was 75 microns, and the volume resistivity was 1.67×10 -6 Ω·m, shear strength was 13.85MPa, peel force (PI) was 10.1N / cm, and adhesion force (PI) was 5B.
[0096] Stability test: After 1000h, the stability test...
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Abstract
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