ScAlN/GaN double-barrier resonant tunneling diode and manufacturing method thereof
A resonant tunneling and diode technology, which is applied in the direction of diodes, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problem of increasing the peak voltage of the differential negative resistance effect of resonant tunneling and device power consumption, and reducing the electron tunneling under reverse bias. Problems such as wear probability and uneven distribution of dislocations in the active area of the device can be achieved to reduce the consistency of device performance, improve the differential negative resistance effect of the device, and improve the stability and reliability of the device
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Embodiment 1
[0059] Embodiment 1, on a self-supporting gallium nitride substrate, a Sc 0.18 al 0.82 N barrier layer and n + InN collector ohmic contact layer doping concentration is 1x10 20 cm -3 ScAlN / GaN double barrier resonant tunneling diode.
[0060] Step 1, growing a GaN epitaxial layer, such as image 3 (a).
[0061] A GaN epitaxial layer with a thickness of 1500nm is grown on a self-supporting gallium nitride substrate by molecular beam epitaxy.
[0062] The process conditions used to grow the GaN epitaxial layer are: the temperature is 700°C, the equilibrium vapor pressure of the gallium beam is 8.0×10 - 7 Torr, the flow rate of nitrogen gas is 2.3sccm, and the power of the nitrogen plasma RF source is 375W.
[0063] Step two, grow n + GaN emitter ohmic contact layer, such as image 3 (b).
[0064] Using the molecular beam epitaxy method, the thickness of the GaN epitaxial layer is 100nm, and the doping concentration is 1x10 20 cm -3 the n + GaN emitter ohmic contac...
Embodiment 2
[0135] Embodiment two, on the sapphire substrate, making adopts Sc 0.2 al 0.8 N barrier layer and n + InN collector ohmic contact layer doping concentration is 5x10 19 cm -3 ScAlN / GaN double barrier resonant tunneling diode.
[0136] Step 1, grow GaN epitaxial layer, such as image 3 (a).
[0137] Using the metal-organic chemical vapor deposition method, under the process conditions of temperature 1050°C, pressure 40Torr, ammonia flow rate 2000sccm, gallium source flow rate 120sccm, hydrogen flow rate 3000sccm, on a sapphire substrate, the growth thickness is 3000nm GaN epitaxial layer.
[0138] Step 2, grow n + GaN emitter ohmic contact layer, such as image 3 (b).
[0139] Using the molecular beam epitaxy method, at a temperature of 720°C, the equilibrium vapor pressure of the gallium beam is 8.5×10 -7 Torr, the silicon beam equilibrium vapor pressure is 3.2×10 -8 Torr, the nitrogen gas flow rate is 2.3sccm, and the nitrogen plasma RF source power is 375W, the thi...
Embodiment 3
[0182] Embodiment three, on the silicon substrate, make and adopt Sc 0.15 Al 0.85 N barrier layer and n + InN collector ohmic contact layer doping concentration is 1x10 19 cm -3 ScAlN / GaN double barrier resonant tunneling diode.
[0183] Step A, growing a GaN epitaxial layer, such as image 3 (a).
[0184] Using the metal-organic chemical vapor deposition method, under the process conditions of temperature 1100°C, pressure 40Torr, ammonia gas flow rate 2000 sccm, gallium source flow rate 100 sccm, hydrogen gas flow rate 3000 sccm, on Si substrate, the growth thickness is 4000nm GaN epitaxial layer.
[0185] Step B, grow n + GaN emitter ohmic contact layer, such as image 3 (b).
[0186] Using molecular beam epitaxy, at a temperature of 680°C and a gallium beam equilibrium vapor pressure of 7.5×10 -7 Torr, silicon beam equilibrium vapor pressure is 3.0×10 -8 Under the process conditions of Torr, nitrogen gas flow rate of 2.3sccm, and nitrogen plasma RF source power o...
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