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74results about How to "Reduce leakage path" patented technology

Planar capacitor memory cell and its applications

InactiveUS7209384B1Less complicated to fabricateImprove performanceTransistorSolid-state devicesHemt circuitsEngineering
A capacitor memory is realized, wherein a capacitor stores data and a diode controls to store data “1” or “0”. Diode has four terminals wherein first terminal serves as word line, second terminal serves as storage node, third terminal is floating, and fourth terminal serves as bit line, wherein back channel effect is suppressed adding additional ions in the bottom side of third terminal or applying negative voltage in the well or substrate. A capacitor plate couples to second terminal, which plate has no coupling region to first, third and fourth terminal. With no coupling, the inversion layer of plate in the storage node is isolated from the adjacent nodes. In doing so, the plate can swing ground level to positive supply level to write. As a result, no negative generator is required for controlling plate. Word line and bit line keep ground level during standby, and rise to supply level for read or write operation. In this manner, no holding current is required during standby, and operating current is dramatically reduced with no negative generator. Write has a sequence to clear the state of cell before writing to store data regardless of previous state. Refresh cycle is periodically asserted to sustain data. The present invention can be applied for destructive read, or for nondestructive read adding pull-down device to bit line. The height of cell is almost same as control circuit on the bulk or SOI wafer.
Owner:KIM JUHAN

High sensitivity frequency modulated radar level gauge system

A radar level gauge system for determining a filling level of a product contained in a tank, comprising: a transceiver for generating, transmitting and receiving frequency-modulated electromagnetic signals; a transmitting propagating device electrically connected to the transceiver and arranged to propagate transmitted electromagnetic signals towards a surface of the product contained in the tank; and a receiving propagating device electrically connected to the transceiver and arranged to return echo signals resulting from reflections at impedance transitions encountered by the transmitted electromagnetic signals, including a surface echo signal resulting from reflection at the surface, back to the transceiver. A signal isolation between the transmitting propagating device and the receiving propagating device is at least 30 dB, and the transceiver comprises: a signal generator for generating a frequency-modulated signal having a predetermined center frequency; a transmitter branch connecting an output of the signal generator with the transmitting propagating device via a first frequency converter for converting the frequency of the frequency-modulated signal to provide the transmitted electromagnetic signal; a receiver branch connected to the receiving propagating device for receiving the surface echo signal; and a mixer having a first input connected to the signal generator via a second frequency converter for converting the frequency of the frequency-modulated signal and a second input connected to the receiver branch, for forming an intermediate frequency signal indicative of a phase difference between the transmitted electromagnetic signal and the surface echo signal. The radar level gauge system further comprising processing circuitry connected to the transceiver for determining the filling level based on the intermediate frequency signal.
Owner:ROSEMOUNT TANK RADAR

GaN-based III-V compound semiconductor LED (light emitting diode) epitaxial wafer and production method thereof

This application discloses a GaN-based III-V compound semiconductor LED (light emitting diode) epitaxial wafer and a production method thereof. The GaN-based III-V compound semiconductor LED epitaxial wafer structurally comprises a substrate, a low temperature GaN buffer layer, a first high temperature non-doped GaN layer and a second high temperature non-doped GaN layer, wherein an AlGaN/GaN superlattice layer is formed on the second high temperature non-doped GaN layer, a high temperature N type GaN layer is formed on the AlGaN/GaN superlattice layer, a stress release layer, an MQW protection layer, a P type electron barrier layer and a high temperature P type GaN layer are formed on the high temperature N type GaN layer, a contact layer is formed on the high temperature P type GaN layer, SiN mask/N type GaN layers are periodically inserted into the high temperature N type GaN layer, and the number of periods of the SiN mask/N type GaN layers ranges from 5 to 20. The GaN-based III-V compound semiconductor LED epitaxial wafer has the advantages of signally improving antistatic ability, effectively enhancing recombination efficiency of current carriers, and improving internal quantum efficiency of an LED.
Owner:XIANGNENG HUALEI OPTOELECTRONICS

Pixel circuit and display panel

The invention discloses a pixel circuit and a display panel, and a light-emitting control module of the pixel circuit is used for controlling a light-emitting module to emit light according to a driving signal output by a driving module according to a signal on a light-emitting control signal line. A first initialization module is used for writing initialization voltage into the control end of the driving module according to a signal on a first scanning line, the first end of the compensation module is connected with the first end of the driving module, and the second end of the compensation module is connected with the control end of the driving module through the electric leakage suppression module, and a compensation module is used for performing threshold compensation on the driving module according to the signal on the second scanning line, an electric leakage suppression module is used for suppressing electric leakage of the storage module. The storage module in the embodiment of the invention leaks electricity only through the electricity leakage suppression module, that is, only one electricity leakage path exists, so that the electricity leakage path and the magnitude of leakage current are reduced, the voltage stability of the control end of the driving module is favorably maintained, and the phenomenon that the light-emitting module flickers when emitting light due to the current change of the driving module is improved.
Owner:YUNGU GUAN TECH CO LTD

Epitaxial growth method for improving reverse electric leakage of GaN-based light-emitting diode (LED)

The invention provides an epitaxial growth method for improving reverse electric leakage of a GaN-based light-emitting diode (LED). An epitaxial structure for inhibiting linear dislocation comprises a 50-200nm non-doped u-Al GaN epitaxial layer inserted at the 4 / 5 thickness of a high-temperature u-GaN layer, 4-8 periodic n-Al GaN / GaN superlattice layers inserted at the 1 / 3 thickness of the high-temperature u-GaN layer, and a 2-6nm low-doped n-Al GaN layer growing behind a low-doped n-GaN layer; (2) an epitaxial structure for inhibiting V-type detect electric leakage comprises a 10-50nm non-doped Al GaN layer growing behind the last base of a multi-quantum well (MQW), and a 50-200nm low-doped p-Al GaN layer inserted between a low-temperature p-GaN layer and a high-temperature p-GaN layer. After the epitaxial growth method is adopted, the linear dislocation and the V-type detect density in a GaN epitaxial layer can be effectively reduced, electric leakage channels in a chip can be reduced, and the reverse electric leakage of the chip is effectively improved; the average value Ir of the electric leakage test of the 9*9mil chip produced by the epitaxy technique is equal to 0.0038mu A @-8V.
Owner:合肥彩虹蓝光科技有限公司

Lead-tin hybrid perovskite thin film, and preparation method and application therefor

The invention provides a lead-tin hybrid perovskite thin film, and a preparation method and an application therefor. The preparation method for the lead-tin hybrid perovskite thin film comprises the specific steps of dissolving PbRE<2> and SnRE<2> into DMF and DMSO mixed solvent to form a PbRE<2> solution and an SnRE<2> solution respectively, wherein RE is CL, Br or I; measuring the PbRE<2> solution and the SnRE<2> solution, and enabling the two kinds of solutions to be mixed to form a precursor liquid; coating a substrate with the precursor liquid in a spin-coating manner; then coating the substrate with a CH<3>NH<3>RE isopropanol solution in a spin-coating manner; and carrying out annealing on the substrate to obtain the hybrid perovskite thin film. According to the lead-tin hybrid perovskite thin film, the lead-tin hybrid perovskite thin film is prepared by a liquid phase two-step method, so that the content of heavy metal-lead in the thin film can be effectively reduced; and in addition, the coverage degree and the mass of the thin film can be improved, the pin holes of the thin film can be reduced, the electric leakage path can be reduced, and the photoelectric conversion efficiency of the prepared lead-tin hybrid perovskite solar cell can be improved.
Owner:HEBEI UNIVERSITY

LED epitaxial growth method for enhancing antistatic effect of device

The invention discloses an LED epitaxial growth method for enhancing the antistatic effect of a device. The method includes processing a sapphire substrate under high temperature, growing an AlN layer on the sapphire substrate, growing an AlxGa (1-x) N layer on the AlN layer, continuously growing an Si-doped N type GaN layer, periodically growing an active layer MQW, continuously growing a P-type AlxGaN layer, continuously growing 100-300nm magnesium-doped P-type GaN layer, cooling to 700-800 DEG C, individually introducing 100-150L / min nitrogen, warming 20-30 ms and then cooling in a furnace. Dislocation due to crystal lattice mismatch is reduced based on the advantages of low crystal lattice mismatch between AlN and sapphire substrate Al2O3 and low crystal lattice mismatch of AlGaN material, AlN and Gan. The dislocation density of an epitaxial layer is reduced, the crystal quality of the epitaxial layer is increased, and the dislocation density is small. When the LED device is under a static high voltage higher than 2kV, the electric leakage channels are fewer, the breakdown probability is reduced, and the antistatic effect is improved. The electric leakage of the LED device is reduced, and the LED product quality is improved.
Owner:XIANGNENG HUALEI OPTOELECTRONICS

Pixel circuit, driving method and display

The embodiment of the invention provides a pixel circuit, a driving method and a display. The pixel circuit comprises a data writing unit, a driving unit, a light emitting unit and an initializing unit. The data writing unit is electrically connected with the driving unit through the first node. The driving unit is electrically connected with the initialization unit through a second node. The driving unit is electrically connected with the light-emitting unit and the initialization unit through a third node. The initialization unit is used for initializing the second node by using the initialization voltage. And the data writing unit is used for setting the voltage of the first node as the voltage of the data signal and updating the voltage of the second node through the driving unit and the initialization unit. The driving unit is used for generating driving current to drive the light-emitting unit to emit light according to the first control signal. Due to the fact that initialization and voltage compensation of the second node are achieved at the same time through the path of the initialization unit, electric leakage paths of the storage capacitor are reduced, the electric leakage amount of the storage capacitor in the light emitting stage is reduced, and the quality of a display image is improved.
Owner:EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD

ScAlN/GaN double-barrier resonant tunneling diode and manufacturing method thereof

The invention discloses an ScAlN/GaN double-barrier resonant tunneling diode and a manufacturing method thereof. The ScAlN/GaN double-barrier resonant tunneling diode mainly solves the problems that an existing gallium nitride resonant tunneling diode is low in peak current, small in peak-valley current ratio and asymmetric in differential negative resistance effect. The ScAlN/GaN double-barrier resonant tunneling diode comprises a substrate, a GaN epitaxial layer, an n+GaN emitter ohmic contact layer, a GaN isolation layer, a first barrier layer, a GaN quantum well layer, a second barrier layer, an isolation layer, a collector ohmic contact layer and a collector electrode from bottom to top, wherein the two barrier layers both adopt ScAlN which has an Sc component range of 15% to 20% and a thickness of 1-3 nm and is identical in the Sc component and thickness; the isolation layer is made of InN with a thickness of 2-4 nm; and the collector ohmic contact layer adopts n+InN. The ScAlN/GaN double-barrier resonant tunneling diode is high in peak current, large in peak-valley current ratio, capable of achieving forward and reverse symmetrical differential negative resistance effect, high in working frequency and output power and applicable to a high-frequency terahertz radiation source and a high-speed digital circuit.
Owner:XIDIAN UNIV
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