The invention relates to the technical field of
semiconductor manufacturing quality control, in particular to a space-time
coupling virtual measurement intelligent labeling method based on feature space geometry, which comprises the following steps: S1, acquiring multi-dimensional sensor
time sequence data of
semiconductor manufacturing equipment as a labeling sample set, and performing manifold value evaluation on the labeling sample set; s2, establishing an adaptive time weight model based on
data complexity, establishing a dynamic space weight model based on local sparseness based on an
adaptive kernel function, combining the adaptive time weight model, the dynamic space weight model and manifold value evaluation, and defining a time-space
coupling value
score; s3, taking the time-space
coupling value
score as an input, and establishing a three-layer optimization architecture to realize a globally optimal sample combination; s4, combining the samples selected by each cluster to form a final
label set, performing quality evaluation on the final
label set, and generating standardized
label output according to a quality
evaluation result; and an accurate value basis is provided for subsequent intelligent selection.