65 results about "Spacer coupling" patented technology

An air-density-tuned interferometer includes: a hermetically sealed enclosure; a front window coupled to the hermetically sealed enclosure; an interferometer residing within the hermetically sealed enclosure; and a pressure changing device coupled to the hermetically sealed enclosure. The interferometer within the enclosure includes: a first glass plate optically coupled to the front window; a first reflective coating coupled to the first glass plate; a second reflective coating optically coupled to the first reflective coating; a second glass plate coupled to the second reflective coating; and a plurality of spacers coupled to the first and second glass plates, forming an optical interometric cavity therein. The pressure changing device manipulates the gas pressure within the cavity. The air-density-tuned interferometer does not incorporate additional elements into the optical path within the interferometer and that does not disturb or move any of the optical components disposed within or associated with this optical path.

A valve actuator assembly is disclosed. The assembly comprises a stator; an armature housing; and an adjustable spacer coupled between the stator and the armature housing, wherein the spacer yields at a controlled rate when an axial load is applied thereto. The adjustable spacer is positioned between the stator and the armature housing such that when an axial load is applied, the adjustable spacer compresses at a controlled rate, thereby allowing adjustment of the valve stroke. A system and method in accordance with the present invention is applicable to any valve which includes a housing containing a seat, an armature, a stator, and a mechanism that is capable of applying a load to the housing.

The invention is a method of transporting a pipe mounted within a plurality of brackets, each bracket having a body, an arm coupled to the body, a support guide located within the arm and configured to provide support to the pipe, a base coupled to the body and configured to attach a platform, the base further configured to provide support to the body, a spacer coupled to the body and configured to maneuver the bracket, wherein each bracket is configured to maintain support for the pipe while the bracket is maneuvered by the spacer. The method comprises the following. Position the plurality of brackets with the spacer proximate to the transporting surface. Set the spacer of each of the plurality of brackets on the transporting surface.

A prosthetic foot comprises a resilient bottom member, a resilient top member, wherein the anterior top end is connected to the anterior bottom end of the resilient bottom member, and wherein the resilient top member is positioned over the resilient bottom member, and an elastomeric bumper member comprising a tapered surface configured to contact the resilient bottom member and attached to an underside of the posterior of the resilient top member. The prosthetic foot can further comprise a toe pad having a spacer coupled to, and creating space between, the bottom member and the top member, and an adhesive bonding one of the bottom member and one end of the top member, where the adhesive is commingled with the spacer between the first bottom end and the first top end.

A battery cell module includes a battery cell, a sliding repeating element, and a guide rail. The repeating element is disposed adjacent the battery cell. A gap is defined between the battery cell and the repeating element. The repeating element has a main body with at least one spacer coupled thereto. The guide rail cooperates with the at least one spacer and permits the repeating element to move with an expansion of the battery cell. The cooperation of the guide rail with the at least one spacer thereby militates against an overcompression of the battery cell.

In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the polishing pad with a second pressure; and pressing a second portion of the wafer interior to the peripheral edge portion against the polishing pad with a third pressure. The second pressure may be provided through a mechanical member in contact with the peripheral edge portion; and the second pressure may be a pneumatic pressure against a backside surface of the wafer. Desirably, the pneumatic pressure is exerted through a resilient membrane, or is exerted by gas pressing directly against at least a portion of the wafer backside surface. A carrier or subcarrier for a CMP apparatus that includes: a plate having an outer surface; a first pressure chamber for exerting a force to urge the plate in a predetermined direction; a spacer coupled to a peripheral outer edge of the plate; a membrane coupled to the plate via the spacer and separated from the plate by a thickness of the spacer; and a second pressure chamber defined between the membrane and the plate surface for exerting a second force to urge the membrane in a third predetermined direction. Substrate, such as a semiconductor wafer, processed or fabricated according to the invention.

In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the polishing pad with a second pressure; and pressing a second portion of the wafer interior to the peripheral edge portion against the polishing pad with a third pressure. The second pressure may be provided through a mechanical member in contact with the peripheral edge portion; and the second pressure may be a pneumatic pressure against a backside surface of the wafer. Desirably, the pneumatic pressure is exerted through a resilient membrane, or is exerted by gas pressing directly against at least a portion of the wafer backside surface. A carrier or subcarrier for a CMP apparatus that includes: a plate having an outer surface; a first pressure chamber for exerting a force to urge the plate in a predetermined direction; a spacer coupled to a peripheral outer edge of the plate; a membrane coupled to the plate via the spacer and separated from the plate by a thickness of the spacer; and a second pressure chamber defined between the membrane and the plate surface for exerting a second force to urge the membrane in a third predetermined direction. Substrate, such as a semiconductor wafer, processed or fabricated according to the invention.

A cable backplane system includes a backplane having a plurality of openings therethrough. A cable rack is coupled to a rear of the backplane, which includes a tray and spacers coupled to the tray that have guide pins. Cable connector assemblies are held by the tray. Removable dust caps are coupled to corresponding cable connectors each having a distal end and guide walls extending therefrom that guide mating of the cable rack with the backplane. The distal end of each dust cap is received in a corresponding opening in the backplane. The guide walls guide the cable rack relative to the backplane such that the guide pins of the spacers are aligned with guide holes of the backplane and such that the cable connectors are aligned with the openings of the backplane. The removable dust caps are removed after the cable rack is coupled to the backplane.

A tool for use in cutting a tie wrap that is bound about at least one wire and a method of operating the tool. The tool includes a housing having a first side and a second side, wherein the first side and the second side are coupled together to define a cavity. The housing further includes a groove formed in the first side and in the second side, wherein the groove is in flow communication with the cavity. A blade is coupled to the first side and positioned with the cavity, wherein the blade includes a cutting surface partially extending into the groove. The tool also includes a spacer coupled to the housing and configured to maintain the wire a distance away from the cutting surface when the housing is applied to the tie wrap.

A cable backplane system includes a backplane having a plurality of openings and mounting blocks proximate the openings. A cable rack is coupled to a rear of the backplane that includes a tray, spacers coupled to the tray and cable connector assemblies held by corresponding spacers. Each cable connector assembly has a plurality of cables extending between cable connectors. The cable connectors are received in corresponding openings and held in position relative to the backplane by the spacers. Locking assemblies are held by the tray and have a latch proximate to a front edge of the tray configured to interact with a corresponding one of the mounting blocks to lockably couple the tray to the backplane. The locking assemblies each have an actuator at a rear of the tray that is actuated by an installer to lock and unlock the latch with the mounting block.

A connector assembly includes a housing, a plurality of contact modules received in the housing, and a pin spacer coupled to the contact modules. Each contact module has a plurality of contacts each including a pin extending from a bottom of the corresponding contact module. The pin spacer has a plurality of pin holes extending through the pin spacer. The pin holes receive corresponding pins for mounting to the circuit board. The pin spacer holds relative positions of the pins. The pin spacer has side edges at opposite sides of the pin spacer and lugs extending from the top of the pin spacer proximate to the sides of the pin spacer. The lugs block entry into a space defined between the bottoms of the contact modules and the top of the pin spacer.

The invention is a method of transporting a pipe mounted within a plurality of brackets, each bracket having a body, an arm coupled to the body, a support guide located within the arm and configured to provide support to the pipe, a base coupled to the body and configured to attach to a platform, the base further configured to provide support to the body, a spacer coupled to the body and configured to maneuver the bracket, wherein each bracket is configured to maintain support for the pipe while the bracket is maneuvered by the spacer. The method comprises the following. Position the plurality of brackets with the spacer proximate to a transporting surface. Set the spacer of each of the plurality of brackets on the transporting surface.

An image forming apparatus having an image support body configured to support a latent image, a charging member configured to provide a substantially uniform charge to a surface of the image support body and a spacer coupled to the charging member and configured to contact the image support body to maintain a gap between the image support body and the charging member. A cleaning part is configured to clean the surface of the image support body after developer is applied to the image support body and transferred to a recording medium. The cleaning part is configured to satisfy the relationship A+B≦C, where A is a width of the effective charging area of the charging member that charges a surface of the image support body, B is a total width of the spacer that contacts the image support body, and C is a width of cleaning part that contacts the image support body.

The invention provides an anti-oscillation arrangement and configuration method for phase-to-phase spacers of an ultrahigh-voltage compact power transmission line. In the anti-oscillation arrangement and configuration method for the phase-to-phase spacers of the 1,000kV ultrahigh-voltage compact power transmission line, a conducting wire-insulator string-phase-to-phase spacer coupling finite element model is established for the 1,000kV ultrahigh-voltage compact transmission line by utilizing a finite element analysis method, the influence of first-order to sixth-order wavelengths in oscillation is taken into full account, and simulative computing and analysis are performed on the oscillation and oscillation suppression of the power transmission line according to factors such as different spans, weather conditions comprising different ice coating thicknesses and wind speeds, and the like of the power transmission line. The method can be used for guiding the anti-oscillation work of the 1,000kV ultrahigh-voltage compact power transmission line, and a technical support is provided for the secure and stable running of a power grid.

A window well assembly for buildings and the like include at least a first well unit and a second well unit each having opposite first and second flanges at opposite ends of a retaining wall of each unit for securing the well units to a sub-grade foundation of the building. Preferably, the assembly has a plurality of releasable spacer couplings that are mated and carried between well units when the assembly is in a stored state, and has indexing features that are mated and carried between well units when the assembly is in an assembled state.

A sliding mount for a part made of plastics material and having at least one thin wall that is to be mounted in sliding manner on a support via its thin wall, the thin wall having an elongate opening therein with two longitudinal edges that are substantially parallel at least over a portion of their length, the mount comprising a spacer that is separate from the part, that is thicker than the thin wall, and that is suitable for sliding in the opening between the two longitudinal edges thereof. The spacer comprises an elastically deformable portion bearing slidably against the thin wall of the part when the spacer slides in the opening, the thin wall having a coupling shape organized in such a manner that when the spacer is in a privileged position relative to the opening, the deformable portion of the spacer couples with the thin wall.

A connector assembly includes a housing, a plurality of contact modules received in the housing, and a pin spacer coupled to the contact modules. Each contact module has a plurality of contacts each including a pin extending from a bottom of the corresponding contact module. The pin spacer has a plurality of pin holes extending through the pin spacer. The pin holes receive corresponding pins for mounting to the circuit board. The pin spacer holds relative positions of the pins. The pin spacer has side edges at opposite sides of the pin spacer and lugs extending from the top of the pin spacer proximate to the sides of the pin spacer. The lugs block entry into a space defined between the bottoms of the contact modules and the top of the pin spacer.

A check vale for injecting gas comprises: an integrally formed body provided with a corrugated portion having a diameter smaller than other areas on an outer surface of an upper portion of a gas flow hole; an integrally formed spindle perpendicularly penetrating the body and provided with a corrugated portion having a diameter smaller than other areas on an outer surface of a lower portion of the gas flow hole of the body; a spring penetrating an upper end portion of the spindle; a spring seat for fixing the spring penetrating the upper end portion of the spindle and for guiding the spindle to a perpendicular position; a coupling ring coupled to an upper end of the body for fixing the body to a prechamber; and a spacer coupled to a lower end of the body for fixing the lower end of the body that covers an outer edge of the spindle to the prechamber.

A cable backplane system includes a backplane having board areas surrounding a connector opening with holes in the board areas along the connector opening. Stiffeners are coupled to corresponding board areas along a front of the backplane. The stiffeners have bores aligned with corresponding holes in the backplane. A cable rack is coupled to the rear of the backplane. The cable rack has a tray with a frame surrounding a raceway and spacers coupled to the tray that hold corresponding cable connectors. The spacers have guide pins extending therefrom that pass through the holes in the backplane into corresponding bores in the stiffeners to position the spacers relative to the stiffeners and the backplane. The cable connectors are received in the connector opening in the backplane and held in position relative to the backplane by the spacers and stiffeners.

The present disclosure relates to a gas insulated switchgear (GIS), and more particularly, a structure of a bus in a GIS. A structure of a three-phase integrated bus in a GIS, in a bus of a gas insulated switchgear comprising an enclosure, three phase conductors inserted in the enclosure, and spacers coupled to both sides of the enclosure to fix the three phase conductors, is characterized in that the three phase conductors are arranged in a shape of inverted triangle, wherein a conductor located at a lower side, of the three phase conductors, is formed in a shape of straight pipe, and has a branch bus upwardly extending from its middle portion, and wherein each of two conductors located at an upper end of the inverted triangle, of the three phase conductors, has both side portions formed in a shape of straight pipe and a middle portion outwardly curved.

A cable backplane system includes a tray having a frame with side walls surrounding a raceway. The side walls extend to a front edge of the frame. The tray includes spacers coupled to the tray located proximate to the front edge. Cable connectors are held by corresponding spacers in position relative to the backplane. The cable backplane system includes an electromagnetic radiation (EMR) absorber extending along an opening in the tray to suppress the propagation of EMR into or out of the tray.

A prosthetic foot comprises a resilient bottom member, a resilient top member, wherein the anterior top end is connected to the anterior bottom end of the resilient bottom member, and wherein the resilient top member is positioned over the resilient bottom member, and an elastomeric bumper member comprising a tapered surface configured to contact the resilient bottom member and attached to an underside of the posterior of the resilient top member. The prosthetic foot can further comprise a toe pad having a spacer coupled to, and creating space between, the bottom member and the top member, and an adhesive bonding one of the bottom member and one end of the top member, where the adhesive is commingled with the spacer between the first bottom end and the first top end.

A cable backplane system includes a backplane having a plurality of openings extending between a front and a rear of the backplane. The backplane has mounting locations proximate the openings. Mounting blocks are coupled to the front of the backplane at corresponding mounting locations. The mounting blocks are secured to the backplane by fasteners. A cable rack is coupled to the rear of the backplane and has a tray with a frame surrounding a raceway and spacers coupled to the tray. The spacers hold corresponding cable connectors and are secured to corresponding mounting blocks to position the spacers and cable connector assemblies relative to the backplane. The cable connectors are received in corresponding openings in the backplane and are held in position relative to the backplane by the spacers and mounting blocks.

The invention is a method of transporting a pipe mounted within a plurality of brackets, each bracket having a body, an arm coupled to the body, a support guide located within the arm and configured to provide support to the pipe, a base coupled to the body and configured to attach a platform, the base further configured to provide support to the body, a spacer coupled to the body and configured to maneuver the bracket, wherein each bracket is configured to maintain support for the pipe while the bracket is maneuvered by the spacer. The method comprises the following. Position the plurality of brackets with the spacer proximate to the transporting surface. Set the spacer of each of the plurality of brackets on the transporting surface.