The invention discloses a pure tin electroplating solution for inhibiting growth of tin whiskers and an application thereof. A mixed solution of methylsulphonic acid and sulfuric acid is adopted as an acidic plating solution, a mixed solution of alkyl sulfonic acid tin salt and hydrogen peroxide is adopted as tin salt, and antioxidants, adjuvants, brightening agents, wetting agents, surface-active agents and the like are added to the mixed solutions. In the application process, an unique electroplating solution preparing method and matters needing attention in use are adopted, and therefore the effect of inhibiting the growth of the tin whiskers is obvious compared with the application of a traditional electroplating solution; moreover, the growth speed of the tin whiskers is greatly reduced, and the growth of the tin whiskers on the surface of an electroplated part is reduced; moreover, plated layers electroplated through the method is good in flexibility and ductility, cracks of the plated layers can be well reduced, the ability to bear the temperature is flexible, and the practical value is high.