The invention discloses an embedded
chip packaging detection method based on a lightweight neural network. The embedded
chip packaging detection method mainly solves the problem that in the prior art, the detection efficiency of advanced packaging image defects of chips with variable scales and a large number of
small target defects is low. According to the implementation scheme, the method comprises the steps that an original advanced packaging image
data set is collected from an industrial camera of a
chip packaging
production line, and a training sample and a
verification sample are obtained; constructing a chip advanced packaging defect detection network, and training the chip advanced packaging defect detection network; carrying out lightweight and format conversion on the trained
network model; constructing a detection program and deploying the model after format conversion on an embedded development board; and running the detection program on the development board to obtain a chip defect detection result. According to the invention, the lightweight defect detection network is designed and subjected to lightweight
processing, so that the computing resource overhead is reduced; by improving the general target
detector, the defect detection effect is improved; by deploying the network in an embedded computing platform for prediction, efficient detection of the advanced packaging defects of the chip is realized, and the method can be used for a chip packaging
production line.