The invention discloses a vacuum plating method adopting combination of a composite magnetic field, a lining ladder pipe and a porous baffle, and belongs to the technical field of material surface processing. The problems of pollution of macroparticles in arc ion plating towards a thin film, use limitation of a target material, loss of magnetically filtered arc plasma, instability of high-power pulse magnetron sputtering discharge and the like are solved. A device comprises a bias voltage power source, an arc ion plating target source, an arc ion plating power source, a multi-level magnetic field device, a multi-level magnetic field device power source, a lining bias voltage ladder pipe and porous baffle device, a lining bias voltage power source, a movable coil device, a movable coil device power source, a waveform matching device, a high-power pulse magnetron sputtering target source, a high-power pulse magnetron sputtering power source and the like. The vacuum plating method adopting the combination of the composite magnetic field, the lining ladder pipe and the porous baffle comprises a step of thin film deposition, specifically, the devices are connected, a system is turned on, when a vacuum degree is lower than 10<-4>Pa, working gas is introduced, the bias voltage power source is started to adjust the energy of plasma, the multi-level magnetic field device and the movablecoil device eliminate macroparticle defects and guide transmission of composite plasm, loss in a vacuum chamber is reduced, and preparation technology parameters are set.