A resin paste for die bonding that can be supplied and applied easily by a printing method. The resin paste for die bonding of the present invention comprises: a polyimide resin (PI), which is obtained by reacting a tetracarboxylic dianhydride (A) comprising a tetracarboxylic dianhydride represented by the formula (I) shown below:
(wherein, n represents an integer from 2 to 20), with a diamine (B) comprising a siloxane-based diamine represented by the formula (II) shown below:
(wherein, Q1 and Q2 each represent, independently, an alkylene group of 1 to 5 carbon atoms or a phenylene group, Q3, Q4, Q5 and Q6 each represent, independently, an alkyl group of 1 to 5 carbon atoms, a phenyl group, or a phenoxy group, and p represents an integer from 1 to 50); a filler (F); and a printing solvent (S), wherein the resin paste has been adjusted to have a solid fraction from 20 to 70% by weight, a thixotropic index from 1.5 to 8.0, and a viscosity (25° C.) from 5 to 1,000 Pa·s.