The invention discloses the field of
wafer wet cleaning, and particularly relates to a Malangei
drying method compatible with multi-size wafers, which is applied to a
drying machine comprising a lifting mechanism and a controller, and the method is executed by the controller and comprises the following steps of: firstly, receiving a
wafer size specification
signal, driving the lifting mechanism to adjust a
wafer bracket to a corresponding preset process height, and adjusting the wafer bracket to a preset process height; the upper edges of the wafers with different sizes are all located in a preset
drying working area at the top of the cavity, then isopropanol steam is guided in in an immersion state to construct a
surface tension gradient, finally, a drain valve is controlled to be opened to enable the liquid level to be slowly lowered, and
moisture is removed through the Malangori effect. Through physical position compensation of the lifting mechanism, it is ensured that the upper edges of wafers of different diameters can be accurately aligned to the preset drying working area at the top of the drying cavity, compatibility of single equipment to the wafers of different specifications is achieved, uniformity of chemical
atmosphere concentration and a temperature field is ensured, and the drying quality and the flexibility of a
production line are improved.