30results about How to "Easy and less-expensive" patented technology

A vehicle side-flashing lamp includes: a cup-shaped housing; a light exit opening opposite the housing bottom; and a light exit cover which covers the light exit opening. At least one light-emitting diode emits light outwardly at least partially at an angle which is large with respect to the main axis of the housing. A prismatic element, defined by first, second and third boundary surfaces, is arranged in front of the light-emitting diode in such a way that an emitted light beam passes through the first boundary surface into the prismatic element and is at least partially reflected at the second boundary surface, which is inclined with respect to the central axis of the light beam, in such a way that the reflected part issues from the prismatic element through the third boundary surface.

A radiometric heating / sensing probe for radiating electromagnetic waves of a first frequency capable of heating tissue and detecting electromagnetic waves of a second frequency emitted by the tissue indicating tissue temperature. The probe includes a dual frequency antenna, a signal transmitting path to the antenna and a signal receiving path from the antenna to a radiometer. A diplexer connected between those paths inside the probe includes a quarter wave stub in the form of a shorted slab line-type transmission line in the signal transmitting path. The entire probe package is only about 0.4 in. long and 0.08 in. in diameter so that it can be used in many minimally invasive applications.

A wall in which there is formed at least one cooling channel, said wall being cooled by cool air flowing in the channel, the channel comprising a hole and a diffusion portion, the hole opening out at one end into the inside surface of the wall, and at its other end into the diffusion portion where it forms an orifice, the diffusion portion flaring around said orifice and opening out into the outside surface of the wall, the diffusion portion having a bottom whose front end is substantially plane, sloping, and extending in front of the orifice, and also having a margin extending behind, round the sides, and in front of the orifice, said margin joining the sides of the front end. A method and an electrode for making such a cooling channel. A turbomachine blade presenting such a wall.

Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant.A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected to the tabs. An encapsulant is applied to the upper and side surfaces of the leadframe. Finally, the leadframe is cut in situ so that the die pad and tabs are severed from the frame, the sides of the package are formed, and the package is severed from the leadframe.

An air flow-enhancing insert (30) is configured to be inserted into the air inlet (16) of a compressor (3). The insert includes a hollow, cylindrical inner member (32) and lugs (44) protruding outward from an outer surface (36) of the inner member, each lug having an elongated cross sectional shape and including a leading edge (46), a trailing edge (48), and a long axis (50) that extends between the leading edge and trailing edge, the long axis defining a helix about the outer surface. When the insert (30) is disposed in the compressor air inlet, an air recirculation path (20) is defined between the inner member outer surface, an inner surface (17) of the air inlet, and the lugs. The air recirculation path improves air flow in the compressor, whereby compressor efficiency is improved and noise is reduced.

Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant.A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected to the tabs. An encapsulant is applied to the upper and side surfaces of the leadframe. Finally, the leadframe is cut in situ so that the die pad and tabs are severed from the frame, the sides of the package are formed, and the package is severed from the leadframe.

Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant.A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected to the tabs. An encapsulant is applied to the upper and side surfaces of the leadframe. Finally, the leadframe is cut in situ so that the die pad and tabs are severed from the frame, the sides of the package are formed, and the package is severed from the leadframe.

A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected to the tabs. An encapsulant is applied to the upper and side surfaces of the leadframe. Finally, the leadframe is cut in situ so that the die pad and tabs are severed from the frame, the sides of the package are formed, and the package is severed from the leadframe.

A body rotation and securing sling having a flat sheet configured with a plurality of edges dimensioned to accommodate a side laying person's back, torso, hips and upper legs, wherein at least two edges are angled, curved, or slanted to transition between other sets of edges, a plurality of straps configured to reposition and secure the side laying person and, thus to enable a service personnel to reposition a bed ridden person by tugging or pulling on the straps to reposition and roll the laying patient from side-to-side and to secure the side laying person on one side or angled side until time for rotation to the other side.

Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant. A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected to the tabs. An encapsulant is applied to the upper and side surfaces of the leadframe. Finally, the leadframe is cut in situ so that the die pad and tabs are severed from the frame, the sides of the package are formed, and the package is severed from the leadframe.

According to one embodiment of the invention, an apparatus used for collecting fluids during a medical procedure includes a fluid collection pouch having an open end, an inflatable bladder substantially surrounding a perimeter of the open end, and a pump coupled to the inflatable bladder. The pump is operable to inflate the inflatable bladder. According to another embodiment of the invention, an apparatus used for collecting fluids during a medical procedure includes a fluid collection pouch having an open end with a perimeter, a channel surrounding approximately one half of the perimeter of the open end, an inflatable bladder disposed within the channel, and a pump disposed within the channel and coupled to the inflatable bladder. The pump is operable to inflate the inflatable bladder.

A wall in which there is formed at least one cooling channel, said wall being cooled by cool air flowing in the channel, the channel comprising a hole and a diffusion portion, the hole opening out at one end into the inside surface of the wall, and at its other end into the diffusion portion where it forms an orifice, the diffusion portion flaring around said orifice and opening out into the outside surface of the wall, the diffusion portion having a bottom whose front end is substantially plane, sloping, and extending in front of the orifice, and also having a margin extending behind, round the sides, and in front of the orifice, said margin joining the sides of the front end. A method and an electrode for making such a cooling channel. A turbomachine blade presenting such a wall.

Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant.A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected to the tabs. An encapsulant is applied to the upper and side surfaces of the leadframe. Finally, the leadframe is cut in situ so that the die pad and tabs are severed from the frame, the sides of the package are formed, and the package is severed from the leadframe.

According to one embodiment of the invention, an apparatus used for collecting fluids during a medical procedure includes a fluid collection pouch having an open end, an inflatable bladder substantially surrounding a perimeter of the open end, and a pump coupled to the inflatable bladder. The pump is operable to inflate the inflatable bladder. According to another embodiment of the invention, an apparatus used for collecting fluids during a medical procedure includes a fluid collection pouch having an open end with a perimeter, a channel surrounding approximately one half of the perimeter of the open end, an inflatable bladder disposed within the channel, and a pump disposed within the channel and coupled to the inflatable bladder. The pump is operable to inflate the inflatable bladder.

A dryer uses conduits to carry a heating medium, such as steam, to heat the outer surface of the dryer. The volume of steam is successfully reduced to non-explosive levels and the shell need not be designed to prevent an explosion. Conduits may be formed through the shell itself or grooves may be formed on the inner surface of the shell, with the conduits retained within the grooves. Also, the conduits can be placed against the inside surface of the dryer and a material, such as zinc, can be filled in about the conduits. The material serves to both retain the conduits in place and thermally couple the conduits to the dryer to assure efficient heat transfer between the conduits and dryer. These modifications relieve the dryer from the Unfired Pressure Vessel classification to the classification of a piping assembly under ASA code regulations. This results in savings in operation safety, installation cost and operating costs due to the absence of costly inspections. Transportation costs are lowered by manufacturing a plurality of holding plates which would be transported to the location of use at which point the Yankee dryer will be constructed. It is contemplated that the plurality of holding plates would not require a shell surrounding the exterior of these holding plates. Additionally, the thermal gradient on the exterior of the Yankee dryer will be controlled through the use of a plurality of auxiliary supply and exhaust conduits.

According to one embodiment of the invention, an apparatus used for collecting fluids during a medical procedure includes a fluid collection pouch having an open end, an inflatable bladder substantially surrounding a perimeter of the open end, and a pump coupled to the inflatable bladder. The pump is operable to inflate the inflatable bladder. According to another embodiment of the invention, an apparatus used for collecting fluids during a medical procedure includes a fluid collection pouch having an open end with a perimeter, a channel surrounding approximately one half of the perimeter of the open end, an inflatable bladder disposed within the channel, and a pump disposed within the channel and coupled to the inflatable bladder. The pump is operable to inflate the inflatable bladder.

A dryer uses conduits to carry a heating medium, such as steam, to heat the outer surface of the dryer. The volume of steam is successfully reduced to non-explosive levels and the shell need not be designed to prevent an explosion. Conduits may be formed through the shell itself or grooves may be formed on the inner surface of the shell, with the conduits retained within the grooves. Also, the conduits can be placed against the inside surface of the dryer and a material, such as zinc, can be filled in about the conduits. The material serves to both retain the conduits in place and thermally couple the conduits to the dryer to assure efficient heat transfer between the conduits and dryer. These modifications relieve the dryer from the Unfired Pressure Vessel classification to the classification of a piping assembly under ASA code regulations. This results in savings in operation safety, installation cost and operating costs due to the absence of costly inspections. Transportation costs are lowered by manufacturing a plurality of holding plates which would be transported to the location of use at which point the Yankee dryer will be constructed. It is contemplated that the plurality of holding plates would not require a shell surrounding the exterior of these holding plates. Additionally, the thermal gradient on the exterior of the Yankee dryer will be controlled through the use of a plurality of auxiliary supply and exhaust conduits.

Sulfur containing, hydroxyl-telechelic PIBs, hydrolytically and oxidatively resistant, biocompatible and biostable polyurethanes (PUs) made therefrom, and methods for making both are disclosed. Well-defined hydroxyl telechelic PIBs are synthesized by a thiol-ene click photochemical reaction between PIBs carrying unsaturated end groups and 2-mercaptoethanol (HS—CH2CH2—OH). This regioselective process affords HO—CH2CH2—S-PIB-S—CH2CH2—OH (abbreviated herein as HO—S-PIB-S—OH) in high yield. In some embodiments, these HO—S-PIB-S—OH polymers may be reacted with diisocyanates and a chain extender to form sulfur containing PIB-based PUs. These sulfur containing PIB-based PUs have been found to have properties and chemical stability that are very similar to that of PUs made from di-hydroxyl terminated PIBs (OH-PIB-OHs) without sulfur, but have surprisingly increased creep resistance and are easier and less expensive to make.

Packages for an optical integrated circuit die and a method for making such packages are disclosed. The package includes a die, a die pad, a plurality of lead fingers, and an encapsulating dielectric material. The downward second pad surface of the die pad bearing an integrated circuit is encapsulated by a bottom encapsulating dielectric material. The top encapsulating dielectric material provides the function for protecting the leadframe from severe environment. The top encapsulating dielectric material can be neglected if there is no threat on the integrated circuit die and the leadframe. Multiple of lead fingers are mounted on the printed circuit board. A portion of the printed circuit board is removed in order to provide an optical path for the light beam transmitted from a light source through the transparent bottom encapsulating dielectric material into the integrated circuit die. The method of making a package includes forming a leadframe including a die pad and a plurality of lead fingers. A die is attached on the downward second surface of the die pad. There are bonding wires electrically coupling the die and the lead fingers. Transparent dielectric encapsulating material covers the die, the die pad and a portion of the lead fingers. Finally, the package is mounted on a printed circuit board with flatly bended tip portion of the lead fingers.

The present invention is in the field of hematological diseases of carcinogenic origin. More specifically, the present invention relates to the use of Wiscott-Aldrich syndrome protein (WASP) as a biological marker of the progression of a hematological disease, in particular leukemias, and to an in vitro method for monitoring the progression of a hematological disease, such as leukemia.

An inter-blade sealing for a turbine or compressor wheel of a turbine engine includes inserts engaged in longitudinal cavities in side edges of platforms of blades and bearing, in operation, against facing side edges of platforms of adjacent blades. Each insert has a cylindrical elongate shape and includes in its outer cylindrical surface at least one annular groove for passing platform cooling air.

A self-contained no-feed-roll computer controlled corrugated board or paperboard sheet feeder apparatus 200 is configured to upgrade an installed corrugated board processing machine (e.g., 10) and includes a feed table surface 210 for boards (e.g., 2) having drive wheels (222W, 224W, 226W) in an initial variable velocity zone 220 which drives the board in a first motion profile through a first vacuum zone, and a second velocity zone 230 which then drives the board in a second motion profile through a second vacuum zone Retrofittable sheet feeder 200 also includes a controller 300 configured to receive predetermined velocity signals from the host machine 10 and generate (i) a first initial variable velocity control signal for initial variable velocity zone 220 and (ii) a second velocity control signal for second velocity zone 230 in response.