Ni-Cu-La-B quaternary alloy plating solution and method for chemically plating glass fibers by using same

A quaternary alloy and glass fiber technology, applied in the field of chemical plating, can solve the problems of reducing the bonding force and conductivity of the coating, increasing the brittleness of the coating, affecting the quality of the coating, etc., and achieving the effects of easy promotion, energy saving, and good wear resistance

Active Publication Date: 2014-04-30
CHENGDU UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The traditional glass fiber electroless plating technology uses sodium hypophosphite (also known as sodium hypophosphite) as the reducing agent. Sodium hypophosphite has certain toxicity, and the sodium hypophosphite solution will explode when heated and evaporated under normal pressure; Phosphorus...

Method used

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  • Ni-Cu-La-B quaternary alloy plating solution and method for chemically plating glass fibers by using same
  • Ni-Cu-La-B quaternary alloy plating solution and method for chemically plating glass fibers by using same
  • Ni-Cu-La-B quaternary alloy plating solution and method for chemically plating glass fibers by using same

Examples

Experimental program
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Effect test

Embodiment 1

[0045] Use glass fiber as the base material, soak in 1% sodium carbonate aqueous solution for 24 hours, wash with distilled water, filter, dry, immerse in 1.5% silane coupling agent solution, soak for 10 minutes, filter, dry , immerse in a 50% nitric acid solution at 60°C for roughening treatment for 30 minutes, wash with water, and immerse at a concentration of 10g / LSnCl 2 2H 2 O and 20g / LHCl mixed solution for sensitization treatment, immersion concentration is 0.3g / LPdCl 2 and 1.5mL / L HCl mixed solution for activation treatment. Then immerse in the plating solution at 60°C for 180 minutes. The formulation of the plating solution is 35g / L of nickel chloride, 15g / L of copper sulfate, 1g / L of lanthanum sulfate, 1g / L of sodium borohydride, 45g / L of sodium potassium tartrate, and Diamine 18g / L, sodium hydroxide 45g / L, pH 12.5. The electroless Ni-Cu-La-B glass fiber was obtained on the surface, and after drying at 100°C, it was observed with a microscope that the coating was com...

Embodiment 2

[0047] Use glass fiber as the base material, soak in 1.5% sodium carbonate aqueous solution for 12 hours, wash with distilled water, filter, dry, immerse in 1.5% silane coupling agent solution, soak for 10 minutes, filter and dry , immerse in a 50% nitric acid solution at 60°C for roughening treatment for 30 minutes, wash with water, and immerse at a concentration of 10g / LSnCl 2 2H 2 O and 20g / LHCl mixed solution for sensitization treatment, immersion concentration is 0.3g / LPdCl 2 and 1.5mL / L HCl mixed solution for activation treatment. Then immerse in the 70°C plating solution for 120 minutes, the plating solution formula is nickel chloride 30g / L, copper sulfate 20g / L, lanthanum sulfate 1.5g / L, sodium borohydride 0.8g / L, potassium sodium tartrate 40g / L , Ethylenediamine 25g / L, sodium hydroxide 50g / L, pH value 13. The electroless Ni-Cu-La-B glass fiber was obtained on the surface, and after drying at 100°C, it was observed with a microscope that the coating was compact.

Embodiment 3

[0049] Use glass fiber as the base material, soak in 1% sodium carbonate aqueous solution for 24 hours, wash with distilled water, filter, dry, immerse in 1.5% silane coupling agent solution, soak for 10 minutes, filter, dry , immerse in a 50% nitric acid solution at 60°C for roughening treatment for 30 minutes, wash with water, and immerse at a concentration of 10g / LSnCl 2 2H 2 O and 20g / LHCl mixed solution for sensitization treatment, immersion concentration is 0.3g / LPdCl 2 and 1.5mL / L HCl mixed solution for activation treatment. Then immerse in the 60 ℃ plating bath and apply plating for 150 minutes. Diamine 30g / L, sodium hydroxide 50g / L, pH 13.5. The electroless Ni-Cu-La-B glass fiber was obtained on the surface, and after drying at 100°C, it was observed with a microscope that the coating was compact.

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Abstract

The invention discloses a Ni-Cu-La-B quaternary alloy plating solution. The Ni-Cu-La-B quaternary alloy plating solution comprises the following components: 20-40g/L of nickel chloride, 10-20g/L of copper sulfate, 0.5-10 g/L of lanthanum sulfate, 0.5-3 g/L of sodium borohydride, 40-50g/L of potassium sodium tartrate, 15-30g/L of ethylenediamine and 35-60g/L of sodium hydroxide. A method for chemically plating the glass fibers by using the Ni-Cu-La-B quaternary alloy plating solution comprises the following steps: using sodium borohydride as a reducing agent, adding the water-soluble lanthanum sulfate, and chemically plating the glass fibers by using the Ni-Cu-La-B quaternary alloy plating solution under the conditions of strong base and low temperature; plating layers are Ni-Cu-La-B alloy plating layers, wherein the content of boron is low (only about 0.5-5wt%), the content of nickel in the plating layers is high; the plating layers have good bonding force, electrical conductivity and wear resistance. Through observation with microscopes, the plating layers of the Ni-Cu-La-B quaternary alloy plated glass fibers prepared by using the method are compact; testing with an X-ray energy dispersive spectrometer shows that the surface chemistry components of the Ni-Cu-La-B quaternary alloy plated glass fibers contain 15-50wt% of Ni, 2-15wt% of Cu, 0.5-5wt% of La and 0.5-5wt% of B. The electric conducting glass fibers can be applied to the special fields of electromagnetic wave shielding, microwave absorption, invisibility, anti-static electricity and the like.

Description

technical field [0001] The invention relates to the technical field of chemical plating, in particular to a Ni-Cu-La-B quaternary alloy plating solution and a method for chemical plating of glass fibers. Background technique [0002] With the rapid development of modern science and technology, a kind of electromagnetic radiation pollution called "invisible killer" has attracted increasing attention from all walks of life. Electromagnetic interference, electromagnetic information leakage and electromagnetic environmental pollution caused by electromagnetic radiation have a great impact on economic construction, national defense security and social life. The impact is becoming more and more serious, and electromagnetic radiation pollution has become a major public hazard in today's society. Using electromagnetic shielding coatings to shield stray electromagnetic waves that interfere with the normal operation of electronic and electrical products is an effective method to preve...

Claims

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Application Information

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IPC IPC(8): C23C18/48C03C17/10
Inventor 管登高徐冠立孙遥孙传敏林金辉周文鑫李华伟胥文军唐峰陈婷
Owner CHENGDU UNIVERSITY OF TECHNOLOGY
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