The present invention relates to a method for manufacturing an element, the method comprising several steps. The steps comprise performing a plurality of
etching lines (23) in the first conductive layer, applying IR
radiation on a first zone of the working portion, so that the PDLC material of the first zone is affected, kiss-
cutting the first perimeter of the first zone, depositing a first
conductive paste material (24) on the first zone (21) and depositing a first
busbar (25), wherein a first portion (251) of the first
busbar (25) is installed on a first portion of the second conductive layer and a second portion (252) of the first
busbar (25) is installed on a second portion of the second conductive layer. Then, after applying a sealing paste on the first zone, the orientation of the
smart film arrangement is changed upside down. IR
radiation is applied on a second zone of the working portion and a second
cutting head (15) perform a kiss-
cut in the perimeter of the second zone removing the second conductive layer and the PDLC material of the second zone, wherein the second zone comprises the second portion of the second conductive layer. A plurality of
conductive paste elements are deposited on the second zone and dried and a second busbar is installed on each
conductive paste element. Finally, a flexible printed circuit is applied on the second zone, in contact with the second portion of the first busbar and in contact with the plurality of second busbars.