The utility model discloses a
wafer glass
powder wiping device, and belongs to the technical field of
wafer processing auxiliary equipment. The
wafer clamping device is characterized in that a pressurizing device is installed on a
reciprocating motion device and reciprocates along with the
reciprocating motion device, a pressing part is arranged at the bottom of the pressurizing device, a tray (15) is arranged below the pressing part, and an adsorption part used for fixing a wafer is arranged on the tray (15). According to the pressurizing device of the wafer glass
powder wiping device, the wafer is pressed through the pressing part,
kraft paper is placed on the pressing part, the
reciprocating motion device drives the pressurizing device to do reciprocating motion, the pressing part and the wafer achieve
relative motion so that glass
powder on the wafer can be wiped, the wafer can be firmly sucked through the suction part on the tray, the wafer is prevented from moving along with the pressing part, the pressurizing device can ensure that the pressure of the pressing plate on the wafer is constant, the thickness of glass powder on the wiped wafer is uniform, the wafer wiping speed is high, the thickness of the glass powder is uniform, and the qualified rate of machined chips is high.