This invention relates to the field of PCB blind via defect detection technology and discloses an X-
ray-based method for detecting PCB blind via defects. The method includes the following steps: first, the PCB is irradiated with X-rays; then, data is acquired and an initial image is established using CT projection; subsequently, the initial image is reconstructed using filtered
back projection to obtain a reconstructed image; then, the blind via region is extracted using the reconstructed image; next, a two-
stream neural network architecture is constructed based on a deep residual network; finally, the blind via defect is detected and classified using the two-
stream neural network architecture. This invention, through a two-
stream neural network architecture constructed based on a deep residual network, comprehensively utilizes geometric and material features, enabling comprehensive and accurate detection and classification of various defects in PCB blind vias, such as cracks, wrinkles, dents, and voids. This improves the efficiency and accuracy of defect detection, helps to promptly identify quality problems in the PCB manufacturing process, and ensures product quality.