45results about "Thermal micromechanical switches" patented technology

The invention concerns a microsystem, in particular for producing microswitches or microvalves, constituted on a substrate (50) and used for producing a shift between a first operating state and a second operating state by means of a heat actuated device with bi-metal switch effect. The heat-actuated device comprises a deformable element (51) connected, by opposite ends, to the substrate (50) so as to present naturally a deflection without stress relative to the substrate surface which faces it, said natural deflection determining the first operating state, the second operating state being produced by the heat-actuated device which induces, by the effect of temperature variation, a deformation of the deformable element (51) tending to reduce its deflection and submitting it to a compressive stress by buckling effect in a direction opposite to its natural deflection.

A sensing module and method for monitoring various physical parameters, and particularly environmental parameters to which a living body may be subjected, for example, impacts and shock wave pulses. The module at least one energy storage device and at least one set of electromechanical sensing elements contained in a housing. The sensing elements are responsive to an external environmental input, and each sensing element defines an open electrical path when not subjected to the input, is operable to define a closed electrical path that produces an output in response to the input if the input exceeds a threshold of the sensing element. The module generates data corresponding to the outputs of the sensing elements and records the data.

A MEMS switching device including a first and second actuator and a switching member is described, the switching member being adapted to selectively provide a signal path between a first and second signal line. The selective provision of the signal path is effected by movement of a switching member from a first position to a second position, the movement of the switching member being effected by action of the first and second actuators thereon, such action resulting from a deformation of the actuators. In one embodiment of the invention, catch mechanisms link the switching member to the substrate in a first position, such that the switching member is maintained in this position when the actuation force is removed, and can be released by deformation of one actuator. In another embodiment of the invention, catch mechanisms are provided to maintain the switching member in each of two positions, and single actuators for each of the two positions provide both release of the catch mechanism for that position and translation of the switching member to the other position. In each embodiment, actuators are electrically disconnected from the switching elements other than during change of the switch position, so that interference between the switched signal path and the control circuits is avoided.

The present invention is a thermally controlled switch with high thermal or electrical conductivity. Microsystems Technology manufacturing methods are fundamental for the switch that comprises a sealed cavity formed within a stack of bonded wafers, wherein the upper wafer comprises a membrane assembly adapted to be arranged with a gap to a receiving structure. A thermal actuator material, which preferably is a phase change material, e.g. paraffin, adapted to change volume with temperature, fills a portion of the cavity. A conductor material, providing a high conductivity transfer structure between the lower wafer and the rigid part of the membrane assembly, fills another portion of the cavity. Upon a temperature change, the membrane assembly is displaced and bridges the gap, providing a high conductivity contact from the lower wafer to the receiving structure.

An apparatus and method for a micromachined mechanical switch device having first and second cooperating electrical switch contacts formed by respective first and second patterns of robust carbon nanotube thin film structures for forming intermittent electrical contact between the first and second conductors in response to the applied force urging the first and second cooperating patterns of carbon nanotube thin film structures together into momentary or substantially permanent physical contact.

A MEMS switch of the type having a substrate and a bistable element, uses a structure for the bistable element having first and second substantially straight beam members that are bridged by an optional switch contact member. The switch contact member may be actuated to close a pair of fixed electrical contacts by an actuator means. The actuator means as described comprises electro-thermally compliant actuators. However, other types of actuators including thermo-pneumatic, thermal bimorphic, piezoelectric, electrostatic, fluidic, electromagnetic and phase change actuators may be used. The bistable element is structured to be moved between a first stable state and a second stable state by the selective urging action of two opposing actuators. The actuators, if the electo-thermal compliant type, may comprise first and second bound and spaced electrically conductive beams connected in parallel and supplied with an electrical current. The electrical current is shared by the two conductive beams unequally, causing a differential linear expansion in the two beams and consequential buckling. The buckling action of the bound and spaced beams is used to cause buckling movement of the bistable element from one stable state to the other. In a preferred embodiment, first and second support members, at least one of which is compliant, are interposed between the ends of the bistable element and the substrate. In an embodiment, an optional latch mechanism is used to initially make the bistable element go into one stable state. The latch mechanism may be operated by an auxiliary actuator.

The Resettable Latching MEMS Temperature Sensor provides the capability of recording external temperature extremes without consuming electrical power. The device incorporates a thermal bimorph, contacts, latches, and actuators for device reset. The device can be designed, hardwired, or programmed to trigger at various temperature levels. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the device consumes no quiescent power. The device can be configured to close a circuit, switch an interrupt signal, or switch some other electrical trigger signal between devices at the time of a temperature extreme being reached, or it can be configured to latch and be polled at some time after the temperature limit has occurred.

Implantable sensing modules and methods for monitoring various physical parameters, including physical parameters of a living body and environmental parameters to which the living body may be subjected, for example, impacts. A method for monitoring impacts to which a living body is subjected entails the use of an implantable sensing module that has a rigid housing containing at least one energy storage device and at least one electromechanical sensing element that is responsive to impacts. The module generates data corresponding to impacts to which the electromechanical sensing element is subjected, and records the data in memory. The module is preferably implanted in a living body so that the module is connected to a rigid portion of the living body, in particular, a bone or tooth.

The invention relates to a microswitch containing conductors located on a first level and conductors located on a second level, where the conductors on the first level are supported by a deformable element which can switch by means of an actuator with a bimetallic effect, and where the effect of this switching is that the gap between the conductors on the first level and the conductors on the second level is modified, characterised in that the actuator with a bimetallic effect consists of resistors in close and localised contact with the deformable element, and in that the resistors are capable, when traversed by an electric control current, of expanding sufficiently under the effect of the heat produced by the passage of the electric command current to cause, by the bimetallic effect, the deformable element to trigger before the heat produced in the resistors has been able to propagate into the deformable element.

The present invention is a thermally controlled switch with high thermal or electrical conductivity. Microsystems Technology manufacturing methods are fundamental for the switch that comprises a sealed cavity formed within a stack of bonded wafers, wherein the upper wafer comprises a membrane assembly adapted to be arranged with a gap to a receiving structure. A thermal actuator material, which preferably is a phase change material, e.g. paraffin, adapted to change volume with temperature, fills a portion of the cavity. A conductor material, providing a high conductivity transfer structure between the lower wafer and the rigid part of the membrane assembly, fills another portion of the cavity. Upon a temperature change, the membrane assembly is displaced and bridges the gap, providing a high conductivity contact from the lower wafer to the receiving structure.

A system includes a thin-film battery and an activity-activated switch. In some embodiments, the system is placed on a substrate with an adhesive backing. In some embodiments, the substrate is flexible. Also formed on the substrate is an electrical circuit that includes electronics. The activity-activated switch places the thin-film battery in electrical communication with the circuit and electronics. The battery and the circuit are formed on the substrate and may be comprised of one or a plurality of deposited layers.

A method of making a Lateral-Moving Micromachined Thermal Bimorph which provides the capability of achieving in-plane thermally-induced motion on a microchip, as opposed to the much more common out-of-plane, or vertical, motion seen in many devices. The present invention employs a novel fabrication process to allow the fabrication of a lateral bimorph in a fundamentally planar set of processes. In addition, the invention incorporates special design features that allow the bimorph to maintain material interfaces.

A MEMS module that contains at least one integrated energy storage device whose discharge is minimized and controlled, so that power is available for system operation over longer periods of time. The MEMS module includes a device electrically coupled to the energy storage device for controlling charge transfers from the energy storage device while preventing charge leakage from the energy storage device. The controlling device includes a plurality of integrated MEMS switches that define open electrical paths that prevent charge leakage from the energy storage device through the MEMS switches, and are then operable to define closed electrical paths to allow charge transfers from the energy storage device, and preferably also allow charge transfers to the energy storage device, through the MEMS switches. The charge transfer can be utilized to power electronic circuits or store data in non-volatile digital memory.

A micro miniature solid state mechanical switch device operated by thermal energy for the control of thermal and electrical energy is shown. A gap in an energy path is bridged by an energy conductor that is mechanically moved into and out of operative position with the gap in the energy path.

A system includes a thin-film battery and an activity-activated switch. In some embodiments, the system is placed on a substrate with an adhesive backing. In some embodiments, the substrate is flexible. Also formed on the substrate is an electrical circuit that includes electronics. The activity-activated switch places the thin-film battery in electrical communication with the circuit and electronics. The battery and the circuit are formed on the substrate and may be comprised of one or a plurality of deposited layers.

A sensing module and method for monitoring various physical parameters, and particularly environmental parameters to which a living body may be subjected, for example, impacts and shock wave pulses. The module at least one energy storage device and at least one set of electromechanical sensing elements contained in a housing. The sensing elements are responsive to an external environmental input, and each sensing element defines an open electrical path when not subjected to the input, is operable to define a closed electrical path that produces an output in response to the input if the input exceeds a threshold of the sensing element. The module generates data corresponding to the outputs of the sensing elements and records the data.

An integrated circuit, comprising an electrical-switching mechanical device in a housing having at least one first thermally deformable assembly including a beam held in at least two different locations by at least two arms secured to edges of the housing, the beam and the arms being metallic and situated within the same first metallization level and an electrically conductive body, wherein the said first thermally deformable assembly has at least one first configuration at a first temperature and a second configuration when at least one is at a second temperature different from the first temperature, wherein the beam is at a distance from the body in the first configuration and in contact with the said body and immobilized by the said body in the second configuration and establishing or prohibiting an electrical link passing through the body and through the beam.

A magnetic actuator including a mobile magnetic part, a fixed magnetic part, and a mechanism for triggering displacement of the mobile magnetic part relatively to the fixed magnetic part. At least two amagnetic supports, placed in different planes, delimit a gap between them, the fixed magnetic part being integral with at least one of the supports. The supports each have an abutment area for the mobile magnetic part, the abutment area being distinct from the fixed magnetic part. The mobile magnetic part is in levitation in the gap between both supports by magnetic guiding due to the fixed magnetic part when it does not abut against the abutment area of one of the supports. The mobile magnetic part can assume plural stable magnetic positions; in each of these positions, it abuts against a support.

The present invention provides a bi-directional microelectromechanical element, a microelectromechanical switch including the bi-directional element, and a method to reduce mechanical creep in the bi-directional element. In one embodiment, the bi-directional microelectromechanical element includes a cold beam having a free end and a first end connected to a cold beam anchor. The cold beam anchor is attached to a substrate. A first beam pair is coupled to the cold beam by a free end tether and is configured to elongate when heated thereby to a greater temperature than a temperature of the cold beam. A second beam pair is located on an opposing side of the cold beam from the first beam pair and is coupled to the first beam pair and the cold beam by the free end tether. The second beam pair is configured to elongate when heated thereby to the greater temperature.

Modules, systems, and methods for monitoring environmental conditions, such as physical, electromagnetic, thermal, and / or chemical parameters within an environment, over extended periods of time with the use of one or more electromechanical sensing devices that include a sensing device and electronic circuitry for processing an output of the sensing device and generating a output of the module. The sensing device includes a microstructure, for example, a cantilevered beam, and at least one set of contacts configured for contact-mode operation with the microstructure in response to the microstructure deflecting toward or away from the contacts when exposed to the parameter of interest. The microstructure has a stack of layers of dissimilar materials, at least one of which has at least one property that changes as a result of curing of or absorption by the first material when exposed to the parameter.

A miniaturized relay having a first zone facing a second zone, a first condenser plate, a second condenser plate arranged in the second zone, and smaller than or equal to the first plate, an intermediate space between both zones, a conductive element arranged in the intermediate space and which is mechanically independent from the adjacent walls and can move freely across the intermediate space depending on voltages present between both plates, contact points of an electric circuit, in which the conductive element closes the electric circuit by making contact with the contact points. Such relays can be used, for example, as: accelerometers, accelerometers in airbags, tiltmeters, Coriolis force detectors, microphones, in acoustic applications, pressure sensors, flow sensors, temperature sensors, gas sensors and magnetic field sensors.

Modules, systems, and methods for monitoring environmental conditions, such as physical, electromagnetic, thermal, and / or chemical parameters within an environment, over extended periods of time with the use of one or more electromechanical sensing devices that include a sensing device and electronic circuitry for processing an output of the sensing device and generating a output of the module. The sensing device includes a microstructure, for example, a cantilevered beam, and at least one set of contacts configured for contact-mode operation with the microstructure in response to the microstructure deflecting toward or away from the contacts when exposed to the parameter of interest. The microstructure has a stack of layers of dissimilar materials, at least one of which has at least one property that changes as a result of curing of or absorption by the first material when exposed to the parameter.