The invention relates to the technical field of
chip packaging and aims to solve a problem that, in a
chip packaging and testing process, when a separation device is used for realizing the separationof a
chip and a blue film, when the chip moves upwards, the blue film is driven to move upwards. The chip packaging and testing method comprises a
wafer thinning step, a
wafer cutting step, a chip mounting step, a chip
interconnection step, a forming step and a testing step, and is characterized in that the chip mounting step comprises the following steps that a
pickup plate descends so that a suction
nozzle on the
pickup plate abuts against a to-be-packaged chip, and pressing blocks located at two ends of the suction
nozzle press chips at two ends of the to-be-packaged chip at the same time;after the suction
nozzle sucks the chip to be packaged, the
pickup plate moves upwards and moves to a position above a corresponding mounting position on the packaging substrate; and S4, the pickup plate descends, the to-be-packaged chip is in contact with the mounting position, and meanwhile, the pressing blocks press the chips mounted at two ends of the mounting position.