According to the
semiconductor device assembling equipment, a notch is formed in the closed end of a sleeve, when an
electrode cell is implanted, a feeding
assembly pushes the sleeve into a jig hole of a positioning seat arranged on a
rotating disc assembly, a pressing block presses the sleeve in the jig hole tightly under the action of a reed, and then the sleeve is inserted into the positioning seat; the control device controls the
rotating disc assembly to rotate the
pipe sleeve on the positioning base to the right lower portion of the lower guide groove, a groove opening in the
pipe sleeve corresponds to the lower guide groove, the sliding table air cylinder drives the guide plate to move downwards, the trigger elastic piece retracts into the trigger through hole under the action of the trigger
electrode, the lower guide groove is conducted, and the
pipe sleeve is driven to move downwards. The embedded
anode core is implanted into the casing pipe through the notch in the pipe sleeve, the control device controls the
rotating disc assembly to rotate by one
station to the discharging mechanical arm, discharging is completed through the discharging mechanical arm, the
electrode cell is directly embedded at the
tail end of the casing pipe, and therefore when packaging is conducted again, the
tail end of the casing pipe is directly packaged.