The utility model provides
semiconductor cleaning equipment, which comprises a process tank, the
drying tank is buckled on the process tank; the first supporting structure is movably arranged in the process tank; the second supporting structure is arranged in the
drying groove, the second supporting structure comprises at least one pair of oppositely-arranged supporting assemblies, and the second supporting structure has a supporting state and an avoiding state; and in the supporting state of the second supporting structure, the two oppositely-arranged supporting assemblies are supported on the part, separated from the
liquid interface, of the
wafer, so that the
wafer located at the position partially separated from the
liquid interface is separated from the first supporting structure and the
liquid interface. According to the
semiconductor cleaning equipment disclosed by the utility model, the
wafer is fixed by supporting the part, separated from the liquid interface, of the wafer through the supporting
assembly of the second supporting structure, so that the first supporting structure can be separated from the wafer part below the liquid interface; the remaining part of the wafer does not have a contact point with the first supporting structure in the subsequent process of separating from the liquid interface.