An autonomous device for image recognition comprising a housing in which a camera block (1) with an image sensor (11) and a process block (2) with at least one process unit (12) are stored, where both of these blocks (1,2) are separated from each other by means of a thermal insulation partition (3), wherein the camera block (1) and the process block (2) are signal-connected by a connecting element (20) and electrically powered, where the camera block (1) has a camera block (1) housing (6) formed by a base (61) provided with ribbing (24) and a cover (8) with an aperture (10) provided with a lens (17) of a camera module (16) with an image sensor (11) which is covered by a lens cover (46) with a lens slit (47), where the lens cover (46) is attached to the camera block base (61) by means of lens cover fastening screws (48), and the process block (2) has a process block (2) housing (7) formed by a base (71) provided with ribbing (24) and a cover (9) and a mounting cap (27), wherein between the housing (6) of the camera block (1) and the housing (7) of the process block (2), a thermal insulation partition (3) provided with an aperture (4) and a pair of thermal insulation inserts (50) is arranged, forming a channel (4b) through which a connecting element (20), that is formed by a cable (37), passes and which connects the printed circuit board (5) to the first heat pump (321) through the printed circuit board connector (39) and to the camera module (16) through the camera module connector (23), wherein a process unit (12) is disposed on the printed circuit board (5) located in the process block (2), and the printed circuit board (5) is further connected using a flexible portion (21) with a fixed expansion portion (22) of the printed circuit board on which a high speed connector (49) is arranged, wherein the printed circuit board (5) is further connected through a first stacking connector (331) and a second stacking connector (332) to the I/O plate (34) which is connected through an I/O connector (35) using the flexible portion (21) of the printed circuit board to the I/O connector plate (36) to which a GPIO connector (18) is connected, where the I/O plate (34) is connected to the supply printed circuit board (31) through a second stacking connector (332) and a third stacking connector (333), which supply printed circuit board is further connected by the cable (37) through a supply connector (38) to a power connector (19), and where a second heat pump (322) is arranged between the process block (2) housing (7) and the printed circuit board (5), and a third heat pump (323) is arranged between the process block (2) housing (7) and the supply printed circuit board (31).