The invention relates to a 
chip bonding 
programming control method suitable for the 
chip bonding machines of Janpan JUKI and SIEMENS companies, realized by the following steps: (1) using Gerber 
analysis software-GerbCAM to analyze Gerber files, finding the central coordinates of all the 
chip bonding positions according to pad combination on a substrate and 
numbering them according to their position numbers; (2) checking the 
position number indication to eliminate error and negligence and assure 
data accuracy; (3) converting the BOM 
list provided by a user into the BOM format required by the GerBCAM through the EXCEL, importing well-analyzed data files, reexporting them as CAD files, and by the arrangement of the EXECEL, selecting to generate a program for JUKI or SIEMENS chip bonding 
machine; and its beneficial effects: it makes the 
programming become a relatively easy course, not only enhancing 
programming accuracy but also extremely raising the efficiency; by 
estimation, the 
working hours it takes by a new 
programming method is 1 / 3 of the original ones, and besides, it does not occupy any equipment, therefore it makes purely off-line programming.