The invention relates to a
chip bonding
programming control method suitable for the
chip bonding machines of Janpan JUKI and SIEMENS companies, realized by the following steps: (1) using Gerber
analysis software-GerbCAM to analyze Gerber files, finding the central coordinates of all the
chip bonding positions according to pad combination on a substrate and
numbering them according to their position numbers; (2) checking the
position number indication to eliminate error and negligence and assure
data accuracy; (3) converting the BOM
list provided by a user into the BOM format required by the GerBCAM through the EXCEL, importing well-analyzed data files, reexporting them as CAD files, and by the arrangement of the EXECEL, selecting to generate a program for JUKI or SIEMENS chip bonding
machine; and its beneficial effects: it makes the
programming become a relatively easy course, not only enhancing
programming accuracy but also extremely raising the efficiency; by
estimation, the
working hours it takes by a new
programming method is 1 / 3 of the original ones, and besides, it does not occupy any equipment, therefore it makes purely off-line programming.