Patents
Literature
1 results about "Secant modulus" patented technology
Efficacy Topic
Property
Owner
Technical Advancement
Application Domain
Technology Topic
Technology Field Word
Patent Country/Region
Patent Type
Patent Status
Application Year
Inventor
Secant Modulus: Secant modulus is the slope of a line drawn from the origin of the stress-strain diagram and intersecting the curve at the point of interest. Therefore, the secant modulus can take different values depending on the location of intersect. The figure below shows how the secant modulus is obtaind at point A on the curve.
Tire comprising a durable reinforcing structure and an interface between the outer and inner layers
The present invention relates to a tire (10) comprising a crown (12), a first and a second side (30A, 30B), a first and a second bead (32A, 32B), an inner surface (34) delimiting an annular cavity (36), a first outer layer (33A) arranged radially and / or axially outside and in contact with a first inner layer (37A), and a reinforcing structure (52) extending continuously in the annular cavity (36) from the first side (30A) and / or the first bead (32A) to the crown (12), through the first inner layer (37A) and at least partially penetrating the first outer layer (33A). The modulus ratio between the nominal secant modulus at 10% elongation of the first outer layer (33A) and the nominal secant modulus at 10% elongation of the first inner layer (37A) is strictly greater than 1.0.
Owner:MICHELIN & CO (CIE GEN DES ESTAB MICHELIN)