78results about "Shape memory alloy connections" patented technology

A Contact according to an aspect of the present invention is formed by laminating a shape memory alloy film on a surface of a metal spring film, and the shape thereof is a conical spiral. A manufacturing method therefor is composed of 11 steps including a step of preparing a sacrificial metal film, a step of forming a resist cone, a step of patterning a resist film, a step of preparing a shape memory alloy film, and the like. Since an organic resist material has poor heat resistance, the sacrificial metal film is formed in advance, the resist is removed before sputtering of the shape memory alloy film, the sacrificial metal film is removed after sputtering of a shape memory alloy and a heat treatment, which are performed at high temperatures, so as to lift off an excess shape memory alloy film.

Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

An electrical connector assembly for an arcuate surface in a high temperature environment and associated method of use is disclosed for a variety of applications. This can include, but is not limited to, an injection molding heater assembly having at least one heater and an injection molding heater and nozzle assembly having at least one heater and a nozzle that is in thermal communication with the at least one heater. This at least one electrical connector, having a first electrical conductor that is electrically connectable to at least one first conductive portion at least one arcuate surface and a second electrical conductor that is electrically connectable to at least one second conductive portion on the at least one arcuate surface, and at least one disconnect mechanism positioned adjacent to the at least one electrical connector and in electrical connection with the first electrical conductor and the second electrical conductor.

A gas-tight electrical connection comprises a conductive substrate with at least one socket for receiving an associated wire, at least one slot in the conductive substrate that penetrates each socket and at least one SMA force ring that slides over the conductive substrate near each slot to clamp the electrical connection when heated to its austenitic state.

An insulating system for splicing a pair of cables having at least partially exposed non-insulating portions joined with a metallic connector is disclosed. The insulating system includes an insulating tube constructed from a shape memory material having a central section having a substantially elliptical cross-section and a pair of end sections with substantially circular cross-sections. A pair of support cores is removably insertable in each of the end sections for holding the end sections in a stretched configuration. When the insulating system is placed about the cables and the connector and the support cores are removed from the end sections, the end sections return to a pre-stretched configuration, thereby completing a splice of the cables.

Improved electrode assemblies for recording and stimulation. Cortical and depth electrode structures are provided as well as inline interconnection systems. Methods of manufacture are further taught to provide enhanced surfaces for cortical electrodes. The inline interconnection systems include connector assembly embodiments for electrode leads which have structure providing ease of EEG recording as well as stimulation.

The present invention provides a rotating machine which can maintain good contact state between the brush and the metal rotating body. A rotating machine of the present invention includes a stator including a stator winding, a rotor including a rotor winding and rotatably disposed apart from the stator with a gap, a metal rotating body electrically coupled with the rotor winding, a brush in contact with the metal rotating body, and a pressing mechanism for increasing pressure to press the brush against the metal rotating body when contact failure occurs between the metal rotating body and the brush.

Provided is a terminal structure for a superconducting cable that causes an electrode and a superconducting cable to be easily and favorably connected with reduced contact resistance. In the superconducting cable, a superconducting wire in which a superconducting layer is provided on a substrate interposed by an intermediate layer is wound around a core so that the superconducting layer becomes the inner periphery side and the substrate becomes the outer periphery side. In the terminal structure, the superconducting cable (110) has a plurality of superconducting wires (113, 115), in which a superconducting layer is provided on the substrate interposed by an intermediate layer, and the plurality of superconducting wires (113, 115) are arranged in multiple layers so as to be wound concentrically around a core (111) so that the superconducting layer becomes the inner periphery side and the substrate becomes the outer periphery side. The superconducting cable (110) is arranged inside a tubular electrode (120) and the inner surface of the tubular electrode (120) is soldered to the substrate-side surface of, among the plurality of superconducting wires (113, 115), the superconducting wire (113, 115) positioned at the outermost layer inside the tubular electrode (120).

A driving device and driving device manufacturing method that ensure stable fixing of an SMA, without causing difficulties in downsizing the device, and without adversely affecting the performance of the SMA. A driving device equipped with a string-shaped shape memory alloy as a drive source includes a base member constituting a basis of the driving device, and a rod-like member which penetrates the base member and is made of the metal fixed onto this base member. The rod-like member is caulked on one end of this rod-like member so that the aforementioned shape memory alloy is pinch-held in-between, whereas power-feeding members to apply current to the shape memory alloy are arranged on the other end of the rod-like member.

An attachment ring is provided for attaching a shield of an electrical cable to a backshell. The attachment ring includes an annular body including a shape memory material that is heat recoverable. The body is configured to extend at least partially around the shield and a fitting of the backshell to hold the shield on the fitting in contact with the fitting. The body includes a single segment having a first end that includes a first connection member, and a second end that opposes the first end. The second end has a second connection member that is configured to be interlocked with the first connection member of the first end to connect the first and second ends together such that the single segment of the body defines a continuous ring.

The invention relates to a pipe joint used for the connecting of a skin-effect electric heating element and a heating pipe; the pipe joint made of iron-based memory alloy material is provided with 'bound and restore' feature, and can generate a certain connected tightening force, and can be used for replacing the pipe joint made of general material; meanwhile, the problems that the pipe joint for connecting two heating pipes in heating pipe connection of long-distance pipeline electric heating pipe construction is submerged in underground water or accidental water seepage can lead the sealing of the welding seam to be unreliable, which can affect the skin-effect heating current channel, the number of the pipe joints at the heating pipe is large, the welding construction which clings to the long-distance pipeline is difficult, the difficulty of underground construction is large, the workers are more, the construction period is long, and the welding technology is low-efficient are solved; meanwhile, the invention has advantages that: the air tightness is reliable, the welding device and the corresponding personnel are not required, and the operating tool is simple.

An injection molding system injection molding system having at least one heater with an arcuate surface and a nozzle that is in thermal communication with the heater and an associated method of use. This injection molding system includes an electrical connector assembly for a heater having at least one electrical connector with a first electrical conductor that is electrically connectable to at least one first conductive portion on a heater and a second electrical conductor that is electrically connectable to at least one second conductive portion on the heater, and at least one disconnect mechanism positioned adjacent to the at least one electrical connector and in electrical connection with the first electrical conductor and the second electrical conductor. An injection molding system can include, but is not limited to, a hot runner system.

The present invention discloses an electronic package structure, which comprises an electronic element, a plurality of SMA (Shape Memory Alloy) connection portions, and a plurality of solder connection members. One side of the SMA connection portion is joined to the electronic element, and the solder connection member is arranged over the other side of the SMA connection portion. The SMA connection portions can comply with the strains caused by thermal stresses during the operation of the electronic product and can restore the original shape after the thermal stresses disappear. Therefore, the preset invention can prevent the junctions between the SMA connection portions and the electronic element/the solder connection members from the crack or disconnection caused by thermal stresses.