43results about How to "Firmly grounded" patented technology

A plasma display module having a filtering film and adapted for use with a plasma display apparatus includes: a Plasma Display Panel (PDP), a chassis base including a front side adapted to be connected to the PDP and a rear side provided with a circuit board for the PDP, and a filtering film arranged on a front side of the PDP.

A multilayer printed wiring board of the present invention includes, e.g., an electrical insulating layer (103), a plurality of wiring layers (114) arranged alternately with the electrical insulating layer (103), and a plurality of conductors (115) passing through the electrical insulating layer (103) in its thickness direction for electrically connecting the wiring layers (114). A plating layer (107) is formed so as to cover the side of the electrical insulating layer (103) and electrically connected to ground wiring (106). The impedance of a signal transmission conductor (102a) arranged in the edge portion of the electrical insulating layer (103) is controlled by a ground conductor (105a) arranged opposite to the plating layer (107) with this signal transmission conductor (102a) sandwiched between them and the plating layer (107).

A semiconductor package according to the present invention includes: a semiconductor element where a high frequency signal is input or output; a planar lead terminal having an end electrically connected to an input terminal or an output terminal of the semiconductor element; an encapsulation resin for encapsulating the lead terminal and the semiconductor element, the lead terminal having another end exposed from the resin; and a ground enhancing metal body encapsulated in the encapsulation resin, having a first main surface facing the lead terminal and a second main surface exposed from the encapsulation resin, wherein the ground enhancing metal body has a shape with a cross section parallel to the second main surface and having a smaller area than an area of the first main surface.

A flip chip package may include a substrate, a semiconductor chip, main bump structures and auxiliary bump structures. The substrate has a circuit pattern. The semiconductor chip is arranged over the substrate. The semiconductor chip includes a body having semiconductor structures, main pads electrically connected to the semiconductor structures to mainly control the semiconductor structures, and auxiliary pads electrically connected to the semiconductor structures to provide auxiliary control of the semiconductor structures. The main bump structures are interposed between the semiconductor chip and the substrate to electrically connect the circuit pattern with the main pads. The auxiliary bump structures can be interposed between the semiconductor chip and the substrate to electrically connect the circuit pattern with the auxiliary pads.

The invention provides a display device, which comprises: a display panel, which is defined with a display image in the active region and the active region of non active area, the display panel is embedded with a touch sensor of the first type and includes a substrate having a first surface and a second surface opposite to the first surface; a plurality of pixels, the on the first surface of the substrate in the active region, each pixel includes a pixel driving circuit; the transparent conductive layer, the second surface of the substrate is covered with an active region and a non active area part; and the substrate on the second surface of the non active region of the metal pattern, metal pattern electrically connected to the transparent conductive layer and has a transparent conductive layer is smaller than the resistance, including metal pattern toward the second surface of the substrate edge protrusions extending and receiving electrical signals from the outside, the metal figure The case for the whole region decreases with the transparent conductive layer in the conductive path relative to the potential difference of signal.

Embodiments of the invention relate to the technical field of electronic equipment, and disclose a metal shell and electronic equipment. The metal shell comprises a shell body and at least one screw column formed on the shell body; a convex part is formed on the upper surface of the screw column; a screw goes through a hole in a circuit board to be locked in the screw column; and the convex part props against a grounding part of the circuit board. The embodiments of the invention also provide the electronic device. Grounding stability of the circuit board can be maintained when the circuit board is deformed, and the cost is not increased basically.

The invention discloses a high-voltage cable joint ground wire live-line restoration apparatus and live-line restoration method. The high-voltage cable joint ground wire live-line restoration apparatus includes a grounding needling device, wherein a drive unit of the grounding needling device drives a needle at needles at the drive part of the grounding needling device to move to a clamping part of the grounding needling device; a grounding system is arranged between the needle and the ground; the grounding system includes a digital display capacitance-resistance divider, a high-voltage vacuumcontactor and a connecting wire; after the divider and the contactor are connected in parallel, one end of the grounding needling device is electrically connected with the needle through the connecting wire, and the other end of the grounding needling device is grounded; an insulating bar is arranged at one end, far away from the needle, on the grounding needling device; and the axis of the insulating bar is parallel to the axis of the needle, and one end of the insulating bar is connected with a hydraulic cavity. The high-voltage cable joint ground wire live-line restoration apparatus and live-line restoration method can realize cable joint ground wire live-line restoration, can avoid economic loss caused by power-off restoration, can overcome the harm and hidden trouble of discharge arcwhich appears during the grounding process, can avoid burning operators and related equipment and avoid occurrence of fire, and can also monitor the voltage to ground value of the coaxial ground cables in real time so as to guarantee safety of the work staff.

The invention discloses bonding pad through hole packaging equipment for processing an image sensing chip, and the equipment comprises a packaging cover, a packaging bottom plate, a packaging bolt, aplugging assembly, a bonding pad, a sol layer, a grounding assembly, a positioning assembly, and a grounding piece, the packaging cover is disposed above the packaging bottom plate, and the packagingcover is cooperatively installed at the top side of the packaging bottom plate through the packaging bolt. The plugging assembly is arranged in the packaging bottom plate, and the positioning assemblyis installed on the top side of the packaging bottom plate. A bonding pad is placed on a supporting plate through the positioning assembly, and at the moment, under cooperation of a connecting rod, extrusion of an extrusion plate can be achieved, so that extrusion of a gas storage bag is achieved, gas in the gas storage bag can be input into a limiting gas bag, expansion of the limiting gas bag is achieved, after expansion, under cooperation of two limiting strips, the bonding pad can be clamped and limited, then a stop valve is closed, stable positioning of the bonding pad can be guaranteed,the stability of the bonding pad is guaranteed, and the packaging state is better.

The invention discloses a refrigerator and a compressor mounting plate thereof. The refrigerator comprises the compressor mounting plate, ground wires and screws. The compressor mounting plate is provided with ground wire mounting holes. The ground wires are arranged on the compressor mounting plate and comprise metal heads. The metal heads comprise heads and rods. The heads of the metal heads are provided with through holes. The rods of the metal heads are connected with the outer rears of the heads of the metal heads and extend towards the direction far away from the heads. The screws comprise screw heads and screw rods. Each screw head is abutted against one side, far away from the compressor mounting plate, of each head of each metal head. The screw rods penetrate the through holes to be connected with wall threads around the ground wire mounting holes. The compressor mounting plate is provided with a stop structure which is opposite to the rods of the metal heads and which is used for limiting rotation of the metal heads. According to the arrangement, safety of the refrigerator is improved, and influence of the rotation of the ground wires to the appearance is avoided.

The invention relates to an air compressor testing table, in particular to a high-stability and high-precision air compressor testing system, and mainly solves the technical problems of more complicated assemble of the testing table, more troublesome assembly of fittings with needed functions, weaker precision of each detected parameter, easy leakage of airflow under higher air pressure, inaccurate testing parameters, incapability of monitoring related test data in real time, incapability of automatically or selectively storing testing results and the like. The high-stability and high-precision air compressor testing system comprises a testing main table and a testing auxiliary table; the testing main table is provided with a displayer; a PLC and an industrial computer are arranged in a cabinet; the industrial computer is connected with the displayer and a button set through circuits; the PLC is connected with the testing auxiliary table through a circuit; the testing auxiliary table comprises a frame; a main tabletop is arranged on the frame; more than two air cylinders are arranged at the lower part of the frame; the air cylinders are connected with module valve plates; and the module valve plates are connected with air compressors through hoses.

The invention relates to a fan-out packaging structure with an electromagnetic shielding function, which comprises a wafer, a cavity arranged on the wafer, and a metal shielding layer, a repassivation layer, a first rewiring layer, a metal bump arranged on the first rewiring layer, a chip and a metal bump arranged on the chip which are sequentially arranged on the surface of the wafer and the cavity, the cavity, the chip, the first rewiring layer, the metal bumps and the like form a plastic package body, the second rewiring layer, the PI protection layer, the UBM layer and the solder balls are sequentially arranged on the surface of the plastic package body, and the metal heat dissipation layer is arranged on the lower surface of the wafer. The invention further provides a packaging method of the fan-out type packaging structure with the electromagnetic shielding function. According to the fan-out type packaging structure and the packaging method, the packaging efficiency is high, the electromagnetic shielding effect is good, the structure is stable, and heat dissipation is easy.

The invention discloses an LCP cabinet with high grounding stability. The LCP cabinet comprises an LCP cabinet body. Hanging rings are welded to four corners of a cabinet top of the LCP cabinet body.Heat dissipation plates are installed at two ends of an inner cavity of the LCP cabinet body. Switch mounting grooves are symmetrically arranged in a left side and a right side of the inner cavity ofthe LCP cabinet body; the left and right sides of the bottom of the inner cavity of the LCP cabinet body are symmetrically provided with grounding columns; a grounding plate is connected between the two grounding columns; the inner cavity of the grounding plate is screwed with a grounding bolt; the right grounding column is connected with a connecting frame; and the connecting frame is fixedly connected with the inner cavity of the LCP cabinet body through fastening bolts, sealing strips are installed around the inner cavity of the LCP cabinet body, a cabinet door is hinged to a left side wallof the LCP cabinet body, a cabinet lock is installed in the middle of the right side of the cabinet door, a grounding base is installed at a right end of a front side of the base of the LCP cabinet body, and a baffle is installed in the inner cavity of the LCP cabinet body. Problems that an overall mechanism of the LCP cabinet is poor in stability and poor in grounding performance are solved.

The invention belongs to the technical field of cables, and especially relates to quick charging equipment and a cable shielding assembly thereof. The cable shielding assembly comprises a shielding assembly and a grounding shell. The grounding shell is used for sleeving a cable. The shielding assembly comprises a main ring body, a plurality of shielding wires and a grounding spring ring. The mainring body is sleeved on an outer insulating skin of a cable. The multiple shielding wires extend in the axis direction of the cable and are arranged around the periphery of the outer insulating skin,the first ends of the multiple shielding wires are all arranged on the main ring body, the second ends of the multiple shielding wires are all inserted into the junction of the outer insulating skin and the inner insulating skin of the cable, and the grounding spring ring is arranged on the main ring body in a sleeving mode and makes contact with the inner wall face of the grounding shell. Therefore, because the grounding spring ring has a certain elastic force, at least one part of the grounding spring ring can be ensured to be in contact with the inner wall of the grounding shell in an attached manner even under the action of factors such as external vibration and impact, thereby ensuring that the cable shielding assembly can be stably grounded all the time, and ensuring the shielding effect of the cable shielding assembly.

The invention provides a switch cabinet and a three-phase grounding switch thereof, and relates to the technical field of high-voltage electrical equipment. The switch cabinet comprises a cabinet body, wherein the three-phase grounding switch and a three-phase fixed contact are installed inside the cabinet body; the three-phase grounding switch comprises a substrate fixedly installed with the cabinet body; a transmission main shaft is rotatably assembled on the substrate; the transmission main shaft is vertically connected with a connecting arm; an integral movable contact is installed at theouter end of the connecting rod, and the length of the integral movable contact extends along the axis of the transmission main shaft; and the movable contact is separated from and in contact with thethree-phase fixed static simultaneously when being driven by the transmission main shaft to rotate so as to realize opening and closing. When the switch cabinet is used, an operating mechanism drivesthe transmission main shaft to rotate, the transmission main shaft drives the movable contact to perform closing and opening actions, due to the fact that the movable contact is of an integral structure, the movable contact and the three-phase fixed contact are of high synchronism in separated and contact states, opening and closing of each phase of contact are guaranteed simultaneously, the reliability of grounding connection is improved, and the electric shock hidden danger of operators is completely eliminated.